CN101207085A - 半导体器件的制作方法 - Google Patents
半导体器件的制作方法 Download PDFInfo
- Publication number
- CN101207085A CN101207085A CNA2006101478054A CN200610147805A CN101207085A CN 101207085 A CN101207085 A CN 101207085A CN A2006101478054 A CNA2006101478054 A CN A2006101478054A CN 200610147805 A CN200610147805 A CN 200610147805A CN 101207085 A CN101207085 A CN 101207085A
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- semiconductor device
- semiconductor substrate
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 97
- 238000000034 method Methods 0.000 title claims abstract description 60
- 238000004519 manufacturing process Methods 0.000 title claims description 31
- 239000000758 substrate Substances 0.000 claims abstract description 67
- 238000005468 ion implantation Methods 0.000 claims abstract description 32
- 238000004151 rapid thermal annealing Methods 0.000 claims abstract description 18
- 150000002500 ions Chemical class 0.000 claims description 96
- 238000002347 injection Methods 0.000 claims description 31
- 239000007924 injection Substances 0.000 claims description 31
- 230000008569 process Effects 0.000 claims description 23
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- -1 phosphonium ion Chemical class 0.000 claims description 11
- HAYXDMNJJFVXCI-UHFFFAOYSA-N arsenic(5+) Chemical compound [As+5] HAYXDMNJJFVXCI-UHFFFAOYSA-N 0.000 claims description 8
- 238000000137 annealing Methods 0.000 claims description 7
- 235000012239 silicon dioxide Nutrition 0.000 claims description 7
- 239000000377 silicon dioxide Substances 0.000 claims description 7
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 5
- 229910052796 boron Inorganic materials 0.000 claims description 4
- 229910001449 indium ion Inorganic materials 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 229920005591 polysilicon Polymers 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- 150000003377 silicon compounds Chemical class 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- 239000007943 implant Substances 0.000 claims 1
- 238000002513 implantation Methods 0.000 claims 1
- 125000006850 spacer group Chemical group 0.000 abstract 1
- 239000002019 doping agent Substances 0.000 description 14
- 230000000694 effects Effects 0.000 description 12
- 238000005457 optimization Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000005684 electric field Effects 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 238000005036 potential barrier Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000007850 degeneration Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910000449 hafnium oxide Inorganic materials 0.000 description 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823418—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the source or drain structures, e.g. specific source or drain implants or silicided source or drain structures or raised source or drain structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823437—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the gate conductors, e.g. particular materials, shapes
- H01L21/82345—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the gate conductors, e.g. particular materials, shapes gate conductors with different gate conductor materials or different gate conductor implants, e.g. dual gate structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66575—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate
- H01L29/6659—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate with both lightly doped source and drain extensions and source and drain self-aligned to the sides of the gate, e.g. lightly doped drain [LDD] MOSFET, double diffused drain [DDD] MOSFET
Abstract
Description
Claims (15)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200610147805A CN100576512C (zh) | 2006-12-22 | 2006-12-22 | 半导体器件的制作方法 |
US11/867,645 US20080153240A1 (en) | 2006-12-22 | 2007-10-04 | Method for Fabricating Semiconductor Device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200610147805A CN100576512C (zh) | 2006-12-22 | 2006-12-22 | 半导体器件的制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101207085A true CN101207085A (zh) | 2008-06-25 |
CN100576512C CN100576512C (zh) | 2009-12-30 |
Family
ID=39543449
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200610147805A Active CN100576512C (zh) | 2006-12-22 | 2006-12-22 | 半导体器件的制作方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20080153240A1 (zh) |
CN (1) | CN100576512C (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102437058A (zh) * | 2011-11-17 | 2012-05-02 | 上海华力微电子有限公司 | Pmos器件的制造方法 |
CN102543741A (zh) * | 2010-12-23 | 2012-07-04 | 中芯国际集成电路制造(上海)有限公司 | P型金属氧化物半导体管的制作方法 |
CN102693904A (zh) * | 2011-03-22 | 2012-09-26 | 中芯国际集成电路制造(上海)有限公司 | 一种减小i/o mos器件hci效应的方法 |
CN102737965A (zh) * | 2011-04-12 | 2012-10-17 | 中芯国际集成电路制造(上海)有限公司 | 一种Halo结构的形成方法 |
CN108231682A (zh) * | 2016-12-22 | 2018-06-29 | 中芯国际集成电路制造(上海)有限公司 | 半导体器件及其形成方法 |
CN108597997A (zh) * | 2018-02-28 | 2018-09-28 | 中国电子科技集团公司第十三研究所 | GaN基器件欧姆接触电极的制备方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102779753B (zh) * | 2011-05-12 | 2015-05-06 | 中芯国际集成电路制造(上海)有限公司 | 半导体器件制造方法 |
CN102800593B (zh) * | 2011-05-25 | 2016-03-16 | 中芯国际集成电路制造(上海)有限公司 | 晶体管形成方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100364122B1 (en) * | 2001-04-24 | 2002-12-11 | Hynix Semiconductor Inc | Method for fabricating semiconductor device |
US6734109B2 (en) * | 2001-08-08 | 2004-05-11 | International Business Machines Corporation | Method of building a CMOS structure on thin SOI with source/drain electrodes formed by in situ doped selective amorphous silicon |
DE10240422B4 (de) * | 2002-09-02 | 2010-02-18 | Advanced Micro Devices, Inc., Sunnyvale | Verfahren zur Herstellung eines Halbleiterelements mit einer Leitungsstruktur mit vergrößertem Metallsilizidbereich |
DE10250888B4 (de) * | 2002-10-31 | 2007-01-04 | Advanced Micro Devices, Inc., Sunnyvale | Halbleiterelement mit verbesserten Dotierprofilen und ein Verfahren zur Herstellung der Dotierprofile eines Halbleiterelements |
US7211489B1 (en) * | 2004-09-07 | 2007-05-01 | Advanced Micro Devices, Inc. | Localized halo implant region formed using tilt pre-amorphization implant and laser thermal anneal |
US7494878B2 (en) * | 2006-10-25 | 2009-02-24 | United Microelectronics Corp. | Metal-oxide-semiconductor transistor and method of forming the same |
-
2006
- 2006-12-22 CN CN200610147805A patent/CN100576512C/zh active Active
-
2007
- 2007-10-04 US US11/867,645 patent/US20080153240A1/en not_active Abandoned
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102543741A (zh) * | 2010-12-23 | 2012-07-04 | 中芯国际集成电路制造(上海)有限公司 | P型金属氧化物半导体管的制作方法 |
CN102543741B (zh) * | 2010-12-23 | 2016-03-30 | 中芯国际集成电路制造(上海)有限公司 | P型金属氧化物半导体管的制作方法 |
CN102693904A (zh) * | 2011-03-22 | 2012-09-26 | 中芯国际集成电路制造(上海)有限公司 | 一种减小i/o mos器件hci效应的方法 |
CN102693904B (zh) * | 2011-03-22 | 2015-01-07 | 中芯国际集成电路制造(上海)有限公司 | 一种减小i/o mos器件hci效应的方法 |
CN102737965A (zh) * | 2011-04-12 | 2012-10-17 | 中芯国际集成电路制造(上海)有限公司 | 一种Halo结构的形成方法 |
CN102437058A (zh) * | 2011-11-17 | 2012-05-02 | 上海华力微电子有限公司 | Pmos器件的制造方法 |
CN108231682A (zh) * | 2016-12-22 | 2018-06-29 | 中芯国际集成电路制造(上海)有限公司 | 半导体器件及其形成方法 |
US10727130B2 (en) | 2016-12-22 | 2020-07-28 | Semiconductor Manufacturing International (Shanghai) Corporation | Semiconductor device and fabrication method thereof |
CN108231682B (zh) * | 2016-12-22 | 2021-02-02 | 中芯国际集成电路制造(上海)有限公司 | 半导体器件及其形成方法 |
CN108597997A (zh) * | 2018-02-28 | 2018-09-28 | 中国电子科技集团公司第十三研究所 | GaN基器件欧姆接触电极的制备方法 |
CN108597997B (zh) * | 2018-02-28 | 2021-03-23 | 中国电子科技集团公司第十三研究所 | GaN基器件欧姆接触电极的制备方法 |
US11239081B2 (en) | 2018-02-28 | 2022-02-01 | The 13Th Research Institute Of China Electronics | Method for preparing ohmic contact electrode of gallium nitride-based device |
Also Published As
Publication number | Publication date |
---|---|
US20080153240A1 (en) | 2008-06-26 |
CN100576512C (zh) | 2009-12-30 |
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C14 | Grant of patent or utility model | ||
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Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING |
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Effective date of registration: 20111110 Address after: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Co-patentee after: Semiconductor Manufacturing International (Beijing) Corporation Patentee after: Semiconductor Manufacturing International (Shanghai) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |