CN101198655B - 可固化的有机基聚硅氧烷组合物 - Google Patents

可固化的有机基聚硅氧烷组合物 Download PDF

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Publication number
CN101198655B
CN101198655B CN2006800215172A CN200680021517A CN101198655B CN 101198655 B CN101198655 B CN 101198655B CN 2006800215172 A CN2006800215172 A CN 2006800215172A CN 200680021517 A CN200680021517 A CN 200680021517A CN 101198655 B CN101198655 B CN 101198655B
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component
molecule
group
organopolysiloxane
silicon
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Chinese (zh)
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CN101198655A (zh
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潮嘉人
三谷修
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DuPont Toray Specialty Materials KK
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Dow Corning Toray Co Ltd
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Publication of CN101198655A publication Critical patent/CN101198655A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN2006800215172A 2005-06-15 2006-06-09 可固化的有机基聚硅氧烷组合物 Active CN101198655B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP174430/2005 2005-06-15
JP2005174430A JP5025917B2 (ja) 2005-06-15 2005-06-15 硬化性オルガノポリシロキサン組成物
PCT/JP2006/312088 WO2006135036A1 (en) 2005-06-15 2006-06-09 Curable organopolysiloxane composition

Publications (2)

Publication Number Publication Date
CN101198655A CN101198655A (zh) 2008-06-11
CN101198655B true CN101198655B (zh) 2011-01-19

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CN2006800215172A Active CN101198655B (zh) 2005-06-15 2006-06-09 可固化的有机基聚硅氧烷组合物

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Country Link
US (1) US7781560B2 (enExample)
EP (1) EP1891160B1 (enExample)
JP (1) JP5025917B2 (enExample)
KR (1) KR101244204B1 (enExample)
CN (1) CN101198655B (enExample)
AT (1) ATE412706T1 (enExample)
DE (1) DE602006003433D1 (enExample)
WO (1) WO2006135036A1 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4839041B2 (ja) 2005-08-29 2011-12-14 東レ・ダウコーニング株式会社 絶縁性液状ダイボンディング剤および半導体装置
JP4955984B2 (ja) 2005-11-04 2012-06-20 東レ・ダウコーニング株式会社 有機ケイ素重合体およびその製造方法
JP4965111B2 (ja) 2005-11-09 2012-07-04 東レ・ダウコーニング株式会社 硬化性シリコーン組成物
TW200720359A (en) 2005-11-17 2007-06-01 Dow Corning Toray Co Ltd Method of controlling oil-absorbing properties of a silicone rubber powder
JP5469874B2 (ja) * 2008-09-05 2014-04-16 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置
CN103930490B (zh) * 2011-09-13 2016-05-18 道康宁(中国)投资有限公司 填充的有机硅组合物及其制备和用途
WO2013037105A1 (en) * 2011-09-13 2013-03-21 Dow Corning (China) Holding Co., Ltd. Filled silicone composition, preparation and uses thereof
JP6052140B2 (ja) * 2013-11-08 2016-12-27 信越化学工業株式会社 ビスシリルアミノ基を有するオルガノキシシラン化合物及びその製造方法
CN113773505A (zh) 2013-12-27 2021-12-10 陶氏东丽株式会社 室温下可固化的有机硅橡胶组合物及其用途以及修复电子设备的方法
US10072151B2 (en) 2013-12-27 2018-09-11 Dow Corning Toray Co., Ltd. Room-temperature-curable silicone rubber composition, and the use thereof
CN106414613B (zh) * 2014-04-09 2019-12-27 陶氏东丽株式会社 导热有机硅组合物和电气电子设备
KR102385489B1 (ko) * 2014-04-09 2022-04-14 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 경화성 오르가노폴리실록산 조성물 및 전기·전자 부품의 보호제 또는 접착제 조성물
US11555118B2 (en) 2016-09-01 2023-01-17 Dow Toray Co., Ltd. Curable organopolysiloxane composition and a protectant or adhesive composition of electric/electronic parts
US11041101B2 (en) 2016-12-15 2021-06-22 Dow Silicones Corporation Condensation-curable electrically conductive silicone adhesive composition
KR102537899B1 (ko) * 2017-04-24 2023-05-31 헨켈 아게 운트 코. 카게아아 중부가 실리콘 제제를 위한 접착 촉진제
US20220119677A1 (en) * 2019-01-31 2022-04-21 Elkem Silicones Shanghai Co., Ltd. Curable silicone composition with a good flame resistance
CN113519051A (zh) 2019-03-29 2021-10-19 陶氏东丽株式会社 多组分导热硅酮凝胶组合物、导热部件以及散热结构体
US12091589B2 (en) 2019-04-01 2024-09-17 Shin-Etsu Chemical Co., Ltd. Self-adhesive silicone gel composition and silicone gel comprising cured product thereof
JPWO2021132345A1 (enExample) 2019-12-26 2021-07-01
CN115003760A (zh) 2019-12-26 2022-09-02 陶氏东丽株式会社 固化性聚有机硅氧烷组合物和其固化物、保护剂或粘接剂以及电气/电子设备
TW202225278A (zh) * 2020-09-25 2022-07-01 美商陶氏有機矽公司 可固化聚矽氧組成物及其固化產物

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0684476B2 (ja) * 1986-07-23 1994-10-26 東レ・ダウコ−ニング・シリコ−ン株式会社 硬化性オルガノポリシロキサン組成物
JPH04222871A (ja) * 1990-12-25 1992-08-12 Toray Dow Corning Silicone Co Ltd 硬化性オルガノポリシロキサン組成物
JP3270489B2 (ja) 1991-01-30 2002-04-02 東レ・ダウコーニング・シリコーン株式会社 硬化性オルガノポリシロキサン組成物
JP3461404B2 (ja) * 1995-03-29 2003-10-27 東レ・ダウコーニング・シリコーン株式会社 硬化性オルガノポリシロキサン組成物
JP3828612B2 (ja) * 1996-05-24 2006-10-04 東レ・ダウコーニング株式会社 液状シリコーンゴム組成物およびその製造方法
JP4823431B2 (ja) * 2001-01-30 2011-11-24 東レ・ダウコーニング株式会社 室温硬化性シリコーンゴム組成物
DE10139132A1 (de) * 2001-08-09 2003-02-27 Consortium Elektrochem Ind Alkoxyvernetzende einkomponentige feuchtigkeitshärtende Massen
DE10351804A1 (de) * 2003-11-06 2005-06-09 Wacker-Chemie Gmbh Verfahren zur Erhöhung der Elastizität von feuchtigkeitsgehärteten Elastomeren
JP4647941B2 (ja) 2004-06-23 2011-03-09 東レ・ダウコーニング株式会社 シリコーンレジンとシリコーンゴムの一体化成形体、その製造方法および硬化性シリコーンレジン組成物
JP4676735B2 (ja) 2004-09-22 2011-04-27 東レ・ダウコーニング株式会社 光半導体装置の製造方法および光半導体装置
JP4664032B2 (ja) 2004-10-13 2011-04-06 東レ・ダウコーニング株式会社 シリルアルコキシメチルハライドの製造方法
JP4528613B2 (ja) 2004-12-27 2010-08-18 東レ・ダウコーニング株式会社 シリコーン樹脂とエポキシ樹脂の接着複合体およびその製造方法
JP4849814B2 (ja) 2005-03-29 2012-01-11 東レ・ダウコーニング株式会社 ホットメルト型シリコーン系接着剤

Also Published As

Publication number Publication date
CN101198655A (zh) 2008-06-11
ATE412706T1 (de) 2008-11-15
US20090105441A1 (en) 2009-04-23
DE602006003433D1 (de) 2008-12-11
JP2006348119A (ja) 2006-12-28
KR101244204B1 (ko) 2013-03-18
WO2006135036A1 (en) 2006-12-21
JP5025917B2 (ja) 2012-09-12
EP1891160A1 (en) 2008-02-27
US7781560B2 (en) 2010-08-24
EP1891160B1 (en) 2008-10-29
KR20080021668A (ko) 2008-03-07

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