ATE412706T1 - Härtbare organopolysiloxanzusammensetzung - Google Patents

Härtbare organopolysiloxanzusammensetzung

Info

Publication number
ATE412706T1
ATE412706T1 AT06747310T AT06747310T ATE412706T1 AT E412706 T1 ATE412706 T1 AT E412706T1 AT 06747310 T AT06747310 T AT 06747310T AT 06747310 T AT06747310 T AT 06747310T AT E412706 T1 ATE412706 T1 AT E412706T1
Authority
AT
Austria
Prior art keywords
organopolysiloxane
molecule
alkoxysilyl
silicon
bonded
Prior art date
Application number
AT06747310T
Other languages
English (en)
Inventor
Yoshito Ushio
Osamu Mitani
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Application granted granted Critical
Publication of ATE412706T1 publication Critical patent/ATE412706T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
AT06747310T 2005-06-15 2006-06-09 Härtbare organopolysiloxanzusammensetzung ATE412706T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005174430A JP5025917B2 (ja) 2005-06-15 2005-06-15 硬化性オルガノポリシロキサン組成物

Publications (1)

Publication Number Publication Date
ATE412706T1 true ATE412706T1 (de) 2008-11-15

Family

ID=36954445

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06747310T ATE412706T1 (de) 2005-06-15 2006-06-09 Härtbare organopolysiloxanzusammensetzung

Country Status (8)

Country Link
US (1) US7781560B2 (de)
EP (1) EP1891160B1 (de)
JP (1) JP5025917B2 (de)
KR (1) KR101244204B1 (de)
CN (1) CN101198655B (de)
AT (1) ATE412706T1 (de)
DE (1) DE602006003433D1 (de)
WO (1) WO2006135036A1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4839041B2 (ja) 2005-08-29 2011-12-14 東レ・ダウコーニング株式会社 絶縁性液状ダイボンディング剤および半導体装置
JP4955984B2 (ja) 2005-11-04 2012-06-20 東レ・ダウコーニング株式会社 有機ケイ素重合体およびその製造方法
JP4965111B2 (ja) 2005-11-09 2012-07-04 東レ・ダウコーニング株式会社 硬化性シリコーン組成物
TW200720359A (en) 2005-11-17 2007-06-01 Dow Corning Toray Co Ltd Method of controlling oil-absorbing properties of a silicone rubber powder
JP5469874B2 (ja) * 2008-09-05 2014-04-16 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置
WO2013037105A1 (en) * 2011-09-13 2013-03-21 Dow Corning (China) Holding Co., Ltd. Filled silicone composition, preparation and uses thereof
CN103930490B (zh) * 2011-09-13 2016-05-18 道康宁(中国)投资有限公司 填充的有机硅组合物及其制备和用途
JP6052140B2 (ja) * 2013-11-08 2016-12-27 信越化学工業株式会社 ビスシリルアミノ基を有するオルガノキシシラン化合物及びその製造方法
WO2015098119A1 (en) * 2013-12-27 2015-07-02 Dow Corning Toray Co., Ltd. Room-temperature-curable silicone rubber composition, and the use thereof
EP3087143B1 (de) * 2013-12-27 2021-03-31 Dow Toray Co., Ltd. Bei raumtemperatur härtbare silikonkautschukzusammensetzung, verwendung davon und verfahren zur reparatur einer elektronischen vorrichtung
EP3141583B1 (de) * 2014-04-09 2021-03-10 Dow Toray Co., Ltd. Wärmeleitfähige silikonzusammensetzung und elektrische/elektronische vorrichtung
KR102385489B1 (ko) * 2014-04-09 2022-04-14 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 경화성 오르가노폴리실록산 조성물 및 전기·전자 부품의 보호제 또는 접착제 조성물
CN110088206B (zh) 2016-09-01 2021-08-20 陶氏东丽株式会社 固化性有机聚硅氧烷组合物以及电气电子零部件的保护剂或粘合剂组合物
US11041101B2 (en) 2016-12-15 2021-06-22 Dow Silicones Corporation Condensation-curable electrically conductive silicone adhesive composition
CN110546229B (zh) * 2017-04-24 2022-11-22 汉高股份有限及两合公司 用于加聚有机硅配制物的粘合促进剂
JP7322157B2 (ja) * 2019-01-31 2023-08-07 エルケム・シリコーンズ・シャンハイ・カンパニー・リミテッド 優れた難燃性を備えた硬化性シリコーン組成物
JP7422742B2 (ja) 2019-03-29 2024-01-26 ダウ・東レ株式会社 多成分型熱伝導性シリコーンゲル組成物、熱伝導性部材および放熱構造体
EP3950803B1 (de) 2019-04-01 2024-02-28 Shin-Etsu Chemical Co., Ltd. Selbstklebende silikongelzusammensetzung und silikongel mit gehärtetem produkt daraus
EP4083141A4 (de) 2019-12-26 2024-01-24 Dow Toray Co., Ltd. Härtbare organopolysiloxanzusammensetzung und gehärtetes produkt daraus, schutzmittel oder klebstoff und elektrisches/elektronisches gerät
EP4083127A4 (de) 2019-12-26 2024-01-17 Dow Toray Co., Ltd. Härtbare organopolysiloxanzusammensetzung, gehärtetes produkt davon, schutzmittel oder klebstoff und elektronische vorrichtung
CN115244466A (zh) * 2020-03-16 2022-10-25 中央硝子株式会社 组合物、组合物前体的溶液、组合物的制造方法、基板和带有图案的基板的制造方法
US12559628B2 (en) 2020-09-25 2026-02-24 Dow Silicones Corporation Curable silicone composition and cured product thereof

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0684476B2 (ja) 1986-07-23 1994-10-26 東レ・ダウコ−ニング・シリコ−ン株式会社 硬化性オルガノポリシロキサン組成物
JPH04222871A (ja) * 1990-12-25 1992-08-12 Toray Dow Corning Silicone Co Ltd 硬化性オルガノポリシロキサン組成物
JP3270489B2 (ja) 1991-01-30 2002-04-02 東レ・ダウコーニング・シリコーン株式会社 硬化性オルガノポリシロキサン組成物
JP3461404B2 (ja) * 1995-03-29 2003-10-27 東レ・ダウコーニング・シリコーン株式会社 硬化性オルガノポリシロキサン組成物
JP3828612B2 (ja) * 1996-05-24 2006-10-04 東レ・ダウコーニング株式会社 液状シリコーンゴム組成物およびその製造方法
JP4823431B2 (ja) * 2001-01-30 2011-11-24 東レ・ダウコーニング株式会社 室温硬化性シリコーンゴム組成物
DE10139132A1 (de) * 2001-08-09 2003-02-27 Consortium Elektrochem Ind Alkoxyvernetzende einkomponentige feuchtigkeitshärtende Massen
DE10351804A1 (de) * 2003-11-06 2005-06-09 Wacker-Chemie Gmbh Verfahren zur Erhöhung der Elastizität von feuchtigkeitsgehärteten Elastomeren
JP4647941B2 (ja) 2004-06-23 2011-03-09 東レ・ダウコーニング株式会社 シリコーンレジンとシリコーンゴムの一体化成形体、その製造方法および硬化性シリコーンレジン組成物
JP4676735B2 (ja) 2004-09-22 2011-04-27 東レ・ダウコーニング株式会社 光半導体装置の製造方法および光半導体装置
JP4664032B2 (ja) 2004-10-13 2011-04-06 東レ・ダウコーニング株式会社 シリルアルコキシメチルハライドの製造方法
JP4528613B2 (ja) 2004-12-27 2010-08-18 東レ・ダウコーニング株式会社 シリコーン樹脂とエポキシ樹脂の接着複合体およびその製造方法
JP4849814B2 (ja) 2005-03-29 2012-01-11 東レ・ダウコーニング株式会社 ホットメルト型シリコーン系接着剤

Also Published As

Publication number Publication date
US7781560B2 (en) 2010-08-24
EP1891160A1 (de) 2008-02-27
WO2006135036A1 (en) 2006-12-21
KR101244204B1 (ko) 2013-03-18
EP1891160B1 (de) 2008-10-29
DE602006003433D1 (de) 2008-12-11
US20090105441A1 (en) 2009-04-23
CN101198655B (zh) 2011-01-19
KR20080021668A (ko) 2008-03-07
CN101198655A (zh) 2008-06-11
JP5025917B2 (ja) 2012-09-12
JP2006348119A (ja) 2006-12-28

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