CN101152698B - 印刷基板的加工方法 - Google Patents

印刷基板的加工方法 Download PDF

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Publication number
CN101152698B
CN101152698B CN2007101452877A CN200710145287A CN101152698B CN 101152698 B CN101152698 B CN 101152698B CN 2007101452877 A CN2007101452877 A CN 2007101452877A CN 200710145287 A CN200710145287 A CN 200710145287A CN 101152698 B CN101152698 B CN 101152698B
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CN
China
Prior art keywords
guide shaft
mentioned
rotating speed
instrument
displacement
Prior art date
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Active
Application number
CN2007101452877A
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English (en)
Chinese (zh)
Other versions
CN101152698A (zh
Inventor
角博文
长沢胜浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Via Mechanics Ltd
Original Assignee
Hitachi Via Mechanics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Via Mechanics Ltd filed Critical Hitachi Via Mechanics Ltd
Publication of CN101152698A publication Critical patent/CN101152698A/zh
Application granted granted Critical
Publication of CN101152698B publication Critical patent/CN101152698B/zh
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/02—Perforating by punching, e.g. with relatively-reciprocating punch and bed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B41/00—Boring or drilling machines or devices specially adapted for particular work; Accessories specially adapted therefor
    • B23B41/14—Boring or drilling machines or devices specially adapted for particular work; Accessories specially adapted therefor for very small holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B2270/00—Details of turning, boring or drilling machines, processes or tools not otherwise provided for
    • B23B2270/54—Methods of turning, boring or drilling not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0207—Partly drilling through substrate until a controlled depth, e.g. with end-point detection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Drilling And Boring (AREA)
  • Numerical Control (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Automatic Control Of Machine Tools (AREA)
  • Inking, Control Or Cleaning Of Printing Machines (AREA)
CN2007101452877A 2006-09-27 2007-08-21 印刷基板的加工方法 Active CN101152698B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006-262443 2006-09-27
JP2006262443 2006-09-27
JP2006262443A JP4311686B2 (ja) 2006-09-27 2006-09-27 プリント基板の加工方法

Publications (2)

Publication Number Publication Date
CN101152698A CN101152698A (zh) 2008-04-02
CN101152698B true CN101152698B (zh) 2012-06-06

Family

ID=39134629

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007101452877A Active CN101152698B (zh) 2006-09-27 2007-08-21 印刷基板的加工方法

Country Status (5)

Country Link
JP (1) JP4311686B2 (de)
KR (1) KR101420259B1 (de)
CN (1) CN101152698B (de)
DE (1) DE102007039768B4 (de)
TW (1) TWI411492B (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012071404A (ja) * 2010-09-29 2012-04-12 Howa Mach Ltd 工作機械の熱変位補正方法及び工作機械
JP4927985B1 (ja) * 2010-11-22 2012-05-09 ファナック株式会社 工作機械のテーブル又は工具を移動させる互いに直交した少なくとも二つの送り軸を有するサーボモータの駆動制御装置
JP6444717B2 (ja) * 2014-12-12 2018-12-26 Ｔｏｗａ株式会社 切断装置及び切断方法
JP6235453B2 (ja) * 2014-12-24 2017-11-22 Ｔｏｗａ株式会社 切断装置及び切断方法
CN114245576A (zh) * 2021-11-17 2022-03-25 南京晟通信息技术有限公司 一种基于Mark点对PCB分板程序的轨迹校正方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0623647A (ja) 1992-07-06 1994-02-01 Hitachi Seiko Ltd プリント基板穴明機
JP3418453B2 (ja) 1994-06-06 2003-06-23 日立ビアメカニクス株式会社 プリント基板加工機における主軸ユニットの冷却装置
JP3792266B2 (ja) 1994-06-16 2006-07-05 森精機興産株式会社 工作機械の熱変位補正方法及びその装置
JPH0970739A (ja) * 1995-09-08 1997-03-18 Mitsui Seiki Kogyo Co Ltd ダイナミック熱変位補正方法
JP3783260B2 (ja) * 1995-12-19 2006-06-07 イビデン株式会社 多層プリント配線板のスルーホール穴明け機
JP3711629B2 (ja) * 1996-05-30 2005-11-02 日立ビアメカニクス株式会社 座ぐり加工方法
JP3413068B2 (ja) 1997-08-19 2003-06-03 オークマ株式会社 工作機械の熱変位推定方法
US6030154A (en) * 1998-06-19 2000-02-29 International Business Machines Corporation Minimum error algorithm/program
JP2001062677A (ja) * 1999-08-24 2001-03-13 Canon Inc 工作機械における加工方法及び装置
JP3805945B2 (ja) * 1999-10-15 2006-08-09 株式会社ムラキ 基準穴穴開け機
WO2002056123A2 (en) * 2001-01-09 2002-07-18 Excellon Automation Co. Incremental step drilling system and method
JP4080181B2 (ja) * 2001-06-22 2008-04-23 日立ビアメカニクス株式会社 加工装置およびプリント基板加工機
JP2004090199A (ja) * 2002-09-03 2004-03-25 Toshiba Mach Co Ltd 加工機の回転工具接触検知装置、その回転工具接触検知装置を使用した加工機の回転工具補正装置、加工機のｎｃ装置、加工機の回転工具接触検知装置を使用した加工機の回転工具位置補正方法
JP4554460B2 (ja) * 2005-07-22 2010-09-29 日立ビアメカニクス株式会社 穴明け加工方法
JP5138273B2 (ja) * 2007-05-24 2013-02-06 日立ビアメカニクス株式会社 プリント基板加工機

Also Published As

Publication number Publication date
DE102007039768B4 (de) 2022-03-31
KR101420259B1 (ko) 2014-07-16
JP2008080434A (ja) 2008-04-10
JP4311686B2 (ja) 2009-08-12
TWI411492B (zh) 2013-10-11
CN101152698A (zh) 2008-04-02
KR20080028761A (ko) 2008-04-01
DE102007039768A1 (de) 2008-04-03
TW200821085A (en) 2008-05-16

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