JP5138273B2 - プリント基板加工機 - Google Patents
プリント基板加工機 Download PDFInfo
- Publication number
- JP5138273B2 JP5138273B2 JP2007138281A JP2007138281A JP5138273B2 JP 5138273 B2 JP5138273 B2 JP 5138273B2 JP 2007138281 A JP2007138281 A JP 2007138281A JP 2007138281 A JP2007138281 A JP 2007138281A JP 5138273 B2 JP5138273 B2 JP 5138273B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- pressing
- tool
- pressing piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/06—Platens or press rams
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T408/00—Cutting by use of rotating axially moving tool
- Y10T408/50—Cutting by use of rotating axially moving tool with product handling or receiving means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T408/00—Cutting by use of rotating axially moving tool
- Y10T408/55—Cutting by use of rotating axially moving tool with work-engaging structure other than Tool or tool-support
- Y10T408/561—Having tool-opposing, work-engaging surface
- Y10T408/5623—Having tool-opposing, work-engaging surface with presser foot
- Y10T408/56245—Having tool-opposing, work-engaging surface with presser foot including tool-guide [or bushing]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T408/00—Cutting by use of rotating axially moving tool
- Y10T408/55—Cutting by use of rotating axially moving tool with work-engaging structure other than Tool or tool-support
- Y10T408/561—Having tool-opposing, work-engaging surface
- Y10T408/5623—Having tool-opposing, work-engaging surface with presser foot
- Y10T408/56253—Base supported machine
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Drilling And Boring (AREA)
- Milling Processes (AREA)
Description
2 工具、エンドミル
3 テーブル
4 ワーク(プリント基板)
6 プレッシャフット(昇降部材)
10 回転部材(移動部材)
13 モータ(移動駆動手段)
20 シリンダ(昇降駆動手段)
30(30A,30B,30C) 押さえピース
30ab 繊維状部材
30ak 基部
30ah 貫通穴
30bh 貫通穴
30ch 貫通穴
40 2ポート電磁弁(昇降駆動手段)
41 減圧弁
48 制御部(制御手段)
100 プリント基板加工機
101 押さえ装置
Claims (1)
- テーブルと、
前記テーブルに載置されたプリント基板を加工する工具を保持して回転昇降可能なスピンドルと、
前記プリント基板を加工する際に、前記プリント基板を前記テーブルに押圧する押さえ装置と、を備え、
前記押さえ装置が、
前記スピンドルに沿って昇降可能な昇降部材と、
前記工具が貫通する貫通穴が形成された複数の押さえピースを有し、かつ前記複数の押さえピースの内、少なくとも1つの押さえピースが、前記プリント基板を押圧する環状のブラシであって、前記昇降部材に、前記複数の押さえピースの内、1個を選択可能に設けられた移動部材と、
前記押さえピースの貫通穴が前記工具の軸心と一致するように、前記移動部材を移動させる移動駆動手段と、
前記昇降部材を昇降させて、前記選択した押さえピースを前記プリント基板に押圧させる昇降駆動手段と、
前記工具と前記押さえピースとの所定の相対位置を検出する検出手段と、を備え、
前記移動駆動手段を、前記工具の種類と直径とに応じて、前記押さえピースを選択するように制御可能であり、かつ前記選択した押さえピースに対応して、前記昇降駆動手段を、前記プリント基板への押圧力を変更するように制御可能であり、前記スピンドルに溝加工用の工具が保持されて、前記移動駆動手段を制御して前記押さえピースとして前記ブラシを選択した場合、前記昇降駆動手段を制御して前記押圧力を所定の押圧力に設定し、前記溝加工中に前記検出手段が、前記所定の相対位置を検出したときに、前記溝加工を停止する制御手段を備えた、
ことを特徴とするプリント基板加工機。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007138281A JP5138273B2 (ja) | 2007-05-24 | 2007-05-24 | プリント基板加工機 |
TW097117813A TWI398314B (zh) | 2007-05-24 | 2008-05-15 | 印刷電路基板加工機 |
US12/153,591 US7959385B2 (en) | 2007-05-24 | 2008-05-21 | Printed circuit board machining apparatus |
KR1020080047924A KR101451913B1 (ko) | 2007-05-24 | 2008-05-23 | 프린트 기판 가공기 |
CN2008100977336A CN101310919B (zh) | 2007-05-24 | 2008-05-23 | 印刷基板加工机 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007138281A JP5138273B2 (ja) | 2007-05-24 | 2007-05-24 | プリント基板加工機 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008290193A JP2008290193A (ja) | 2008-12-04 |
JP2008290193A5 JP2008290193A5 (ja) | 2010-04-15 |
JP5138273B2 true JP5138273B2 (ja) | 2013-02-06 |
Family
ID=40072559
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007138281A Expired - Fee Related JP5138273B2 (ja) | 2007-05-24 | 2007-05-24 | プリント基板加工機 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7959385B2 (ja) |
JP (1) | JP5138273B2 (ja) |
KR (1) | KR101451913B1 (ja) |
CN (1) | CN101310919B (ja) |
TW (1) | TWI398314B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018001375A (ja) * | 2016-07-06 | 2018-01-11 | セイコータイムシステム株式会社 | 孔開け装置 |
JP2018001376A (ja) * | 2016-07-06 | 2018-01-11 | セイコータイムシステム株式会社 | 孔開け装置 |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4311686B2 (ja) * | 2006-09-27 | 2009-08-12 | 日立ビアメカニクス株式会社 | プリント基板の加工方法 |
DE102007062202B4 (de) * | 2007-12-21 | 2021-06-10 | Vitesco Technologies GmbH | Beschreibung Verfahren zur Kontaktierung einer starren Leiterplatte mit einem Kontaktpartner und Anordnung aus starrer Leiterplatte und Kontaktpartner |
US9370372B2 (en) | 2013-09-04 | 2016-06-21 | Mcginley Engineered Solutions, Llc | Drill bit penetration measurement systems and methods |
JP6244167B2 (ja) * | 2013-10-29 | 2017-12-06 | 株式会社東興 | プリント基板加工装置 |
US9833244B2 (en) | 2013-11-08 | 2017-12-05 | Mcginley Engineered Solutions, Llc | Surgical saw with sensing technology for determining cut through of bone and depth of the saw blade during surgery |
EP3188671A4 (en) | 2014-09-05 | 2018-03-14 | Mcginley Engineered Solutions LLC | Instrument leading edge measurement system and method |
US10390869B2 (en) | 2015-10-27 | 2019-08-27 | Mcginley Engineered Solutions, Llc | Techniques and instruments for placement of orthopedic implants relative to bone features |
WO2017075044A1 (en) | 2015-10-27 | 2017-05-04 | Mcginley Engineered Solutions, Llc | Unicortical path detection for a surgical depth measurement system |
EP3370629A4 (en) | 2015-11-06 | 2019-07-24 | Mcginley Engineered Solutions LLC | MEASURING SYSTEM TO BE ASSOCIATED WITH A SURGICAL STRAW-TYPE INSTRUMENT |
CN105835120B (zh) * | 2016-06-06 | 2017-06-23 | 大连理工大学 | 负压逆向冷却的纤维增强复合材料高质量加工方法 |
CN106392157A (zh) * | 2016-11-22 | 2017-02-15 | 上海电机学院 | 一种电子产品印制板板边自动切割系统 |
DE102017213717A1 (de) * | 2017-08-07 | 2019-02-07 | Lufthansa Technik Ag | Bearbeitungsvorrichtung für ein Luftfahrzeug |
AU2018321969B2 (en) | 2017-08-25 | 2022-08-11 | Mcginley Engineered Solutions, Llc | Sensing of surgical instrument placement relative to anatomic structures |
CN107457839A (zh) * | 2017-09-25 | 2017-12-12 | 镇宁自治县正鑫竹制品有限公司 | 可调节标准钻孔机 |
EP3648663A4 (en) | 2017-10-02 | 2021-06-30 | McGinley Engineered Solutions, LLC | REAL-TIME NAVIGATION AID SURGICAL INSTRUMENT |
CN109451669B (zh) * | 2018-11-30 | 2020-07-14 | 深圳市得鑫自动化设备有限公司 | 一种自动打靶装置及电路板加工系统 |
TWI673133B (zh) * | 2019-03-27 | 2019-10-01 | 大量科技股份有限公司 | 浮動式壓力定位器 |
US11529180B2 (en) | 2019-08-16 | 2022-12-20 | Mcginley Engineered Solutions, Llc | Reversible pin driver |
CN117583643A (zh) * | 2024-01-18 | 2024-02-23 | 常州科力源工具有限公司 | 一种具有安装定位结构的合金深孔钻组件 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2991380B2 (ja) * | 1990-06-02 | 1999-12-20 | 日立ビアメカニクス株式会社 | プリント基板の加工方法及び加工装置 |
JP2969231B2 (ja) * | 1991-05-30 | 1999-11-02 | 日立ビアメカニクス株式会社 | プリント基板押え装置 |
JPH0810480A (ja) | 1994-07-01 | 1996-01-16 | Juki Corp | ミシンの釜装置 |
JPH08168932A (ja) * | 1994-12-15 | 1996-07-02 | Oiles Ind Co Ltd | プリント基板外形加工機用プレッシャフット |
TW368785B (en) * | 1995-11-15 | 1999-09-01 | Hitachi Via Mechanics Ltd | Fixture for printed circuit board |
JP3230426B2 (ja) * | 1995-11-15 | 2001-11-19 | 日立ビアメカニクス株式会社 | プリント基板押さえ装置 |
JP3280565B2 (ja) * | 1996-03-29 | 2002-05-13 | 日立ビアメカニクス株式会社 | プリント基板押さえ装置 |
JP3909909B2 (ja) * | 1997-04-14 | 2007-04-25 | 日立ビアメカニクス株式会社 | プリント基板加工機 |
JP3560209B2 (ja) * | 1997-06-03 | 2004-09-02 | 日立ビアメカニクス株式会社 | プリント基板穴明機 |
JP2000334697A (ja) * | 1999-05-25 | 2000-12-05 | Hitachi Via Mechanics Ltd | プリント基板押え装置 |
JP4526690B2 (ja) * | 2000-11-14 | 2010-08-18 | 日立ビアメカニクス株式会社 | プリント基板の穴明け加工方法 |
TW200541434A (en) * | 2004-04-30 | 2005-12-16 | Hitachi Via Mechanics Ltd | Printed circuit board and method for processing printed circuit board and method for manufacturing printed circuit board |
-
2007
- 2007-05-24 JP JP2007138281A patent/JP5138273B2/ja not_active Expired - Fee Related
-
2008
- 2008-05-15 TW TW097117813A patent/TWI398314B/zh not_active IP Right Cessation
- 2008-05-21 US US12/153,591 patent/US7959385B2/en not_active Expired - Fee Related
- 2008-05-23 KR KR1020080047924A patent/KR101451913B1/ko not_active IP Right Cessation
- 2008-05-23 CN CN2008100977336A patent/CN101310919B/zh not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018001375A (ja) * | 2016-07-06 | 2018-01-11 | セイコータイムシステム株式会社 | 孔開け装置 |
JP2018001376A (ja) * | 2016-07-06 | 2018-01-11 | セイコータイムシステム株式会社 | 孔開け装置 |
Also Published As
Publication number | Publication date |
---|---|
US7959385B2 (en) | 2011-06-14 |
KR101451913B1 (ko) | 2014-10-16 |
KR20080103451A (ko) | 2008-11-27 |
CN101310919A (zh) | 2008-11-26 |
CN101310919B (zh) | 2012-07-18 |
TWI398314B (zh) | 2013-06-11 |
JP2008290193A (ja) | 2008-12-04 |
TW200846106A (en) | 2008-12-01 |
US20080292416A1 (en) | 2008-11-27 |
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