CN101152698B - Processing method of printing substrate - Google Patents
Processing method of printing substrate Download PDFInfo
- Publication number
- CN101152698B CN101152698B CN2007101452877A CN200710145287A CN101152698B CN 101152698 B CN101152698 B CN 101152698B CN 2007101452877 A CN2007101452877 A CN 2007101452877A CN 200710145287 A CN200710145287 A CN 200710145287A CN 101152698 B CN101152698 B CN 101152698B
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- China
- Prior art keywords
- guide shaft
- mentioned
- rotating speed
- instrument
- displacement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/02—Perforating by punching, e.g. with relatively-reciprocating punch and bed
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B41/00—Boring or drilling machines or devices specially adapted for particular work; Accessories specially adapted therefor
- B23B41/14—Boring or drilling machines or devices specially adapted for particular work; Accessories specially adapted therefor for very small holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B2270/00—Details of turning, boring or drilling machines, processes or tools not otherwise provided for
- B23B2270/54—Methods of turning, boring or drilling not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0207—Partly drilling through substrate until a controlled depth, e.g. with end-point detection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
Abstract
The object of the invention is to provide a machining method of printing substrate which can improve the machining precision (pit depth precision) even under the condition that the temperature of the principal axis unit is changed, and a printing substrate produce machine. The relation between the operating time of a guide shaft and the displacement Delta of the front end of the tool kept on the guide shaft is calculated in advance based on the rotation speed of the guide shaft, and the cutting mete of the tool is compensated based on the rotation speed of the guide shaft defined for machining, the passing time after the machining begins, and the displacement Delta calculated in advance.
Description
Technical field
The present invention relates to a kind of printed base plate processing method and the printing substrate processing machine that uses this processing method.
Background technology
Fig. 2 is the structure chart of printing substrate processing machine.
In figure, along being fixed on the supported movably workbench 3 of linear guidance device 2 on the support 1, and driven through motor 4 through feed screw mechanism.Pillar 5 is fixed on the support 1 with the mode of crossing over workbench 3.Along being fixed in the supported movably cross-slide 7 of linear guidance device 6 on the pillar 5, and driven through motor 8 through feed screw mechanism.Saddle 9 is supported on movably: be fixed on the diagram abridged linear guidance device on the cross-slide 7, and this saddle 9 is through feed screw mechanism, and driven through motor 10.Support to omit the main axle unit 11 of illustrated guide shaft, be fixed on the saddle 9, and this guide shaft keeps omitting illustrated instrument, and rotation.Pressure base 12 is supported on an end of main axle unit 11 movably on guide shaft is axial.The pipe arrangement 13 that this pressure base 12 is used through control of dust and be connected in dust collect plant 14.Cooling device 15 is connected in main axle unit 11 through pipe arrangement 16, in the path that in main axle unit 11, forms, makes the cold-producing medium circulation of liquid, thereby cools off main axle unit 11.
And, make to keep the guide shaft of outfit to rotate with required rotating speed, make dust collect plant 14 actions simultaneously, come the inside of suction pressure base 12 through pipe arrangement 13.In this state, the workbench 3 that puts workpiece W is relatively moved with cross-slide 7 on the XY direction, and after making instrument be in the position relative, saddle 9 is descended with the Working position of workpiece.So, at first, pressure base 12 contact workpiece W, and push workpiece W.In case saddle 9 is further descended, main axle unit 11 relatively moves with pressure base 12, and instrument is clamp-oned workpiece W, carries out the processing of workpiece W.
Owing to order about the heating of guide shaft motor rotating; Main axle unit 11 will be in high temperature; So (5～15 minutes) make cooling device 15 action through at a certain time interval, and in main axle unit 11 circulating refrigerant, the temperature maintenance that makes main axle unit 11 is in required temperature range.
Yet; When bit change took place more continually, in case the cooling device start, main axle unit was owing to sub-cooled has exceeded required temperature range; The situation that Working position precision, crudy (for example, the surface roughness in the finished hole) reduction then can occur.Therefore, a kind of like this technology is arranged, promptly; Can replace being provided with cooling device, be formed with a plurality of air flow paths that are connected with dust collect plant, between circulation flow path and dust collect plant, dispose flow regulator in the inside of the shell that supports guide shaft; In the guide shaft rotation, increase the flow that is flowing in the air in the circulation flow path, rise to more than the design temperature to prevent main axle unit; When changing workpiece, guide shaft rotation when changing instrument etc. under the situation stop; Reduce the flow of the air that circulates in the circulation flow path, preventing the supercooling of main axle unit, thereby can the temperature of main axle unit be controlled in the narrower and small scope.(patent documentation 1)
In addition, also have plenty of, cover the printed base plate tapping machine,, suppress the variations in temperature of printed base plate tapping machine through the air after the adjustment is sent to outer cover inside with outer cover.(patent documentation 2)
Patent documentation 1: japanese kokai publication hei 7-328889 communique
Patent documentation 2: japanese kokai publication hei 6-023647 communique
Summary of the invention
Yet according to the technology of patent documentation 1, though can dwindle the scope of variations in temperature, even the flow of control air, the temperature of main axle unit can not change at once yet, so not necessarily can improve machining accuracy.
In addition, the situation of the technology of patent documentation 2 is technological the same with patent documentation 1 also, because the temperature of main axle unit can not change at once, so not necessarily can improve machining accuracy.
The objective of the invention is to, even, also can improve the processing method and the printing substrate processing machine of the printed base plate of machining accuracy (hole depth precision) for addressing the above problem under the situation that a kind of variations in temperature at main axle unit is provided.
In order to solve above-mentioned problem; The processing method of the printed base plate of first invention of the present invention is characterized in that, presses each rotating speed of guide shaft; Come to solve in advance the duration of runs of above-mentioned guide shaft and remain on the relation of front end between the displacement on the axis direction of the instrument on this guide shaft; According to the rotating speed and the elapsed time of processing after beginning of the above-mentioned guide shaft of setting in order to process, and the above-mentioned displacement to try to achieve in advance, the approach of above-mentioned instrument is carried out revisal.
In addition; The processing method of the printed base plate of second invention of the present invention; It is characterized in that, be altered to from first rotating speed under the situation of second rotating speed, each rotating speed by above-mentioned first and second in rotation with guide shaft; Solve the duration of runs of above-mentioned above-mentioned guide shaft after changing in advance and remain on the relation of front end between the displacement on the axis direction of the instrument on this guide shaft; According to above-mentioned second rotating speed, with the elapsed time that is altered to behind second rotating speed, and the above-mentioned displacement to try to achieve in advance carries out revisal to the approach of above-mentioned instrument.
In addition; The printing substrate processing machine of the 3rd invention of the present invention has guide shaft that makes the instrument rotation and the mobile device that above-mentioned guide shaft is moved on the axis direction of above-mentioned instrument, and makes above-mentioned instrument on the axis direction of above-mentioned instrument, move the distance according to command value; Process; It is characterized in that, be provided with storage device, arithmetic unit and timer, and this storage device; By each rotating speed of above-mentioned guide shaft, come in advance storing duration of runs of above-mentioned guide shaft and the relation of front end between the displacement on the axis direction that remain on the instrument on the above-mentioned guide shaft; In when beginning processing, the elapsed time after beginning according to the rotating speed of the above-mentioned guide shaft of setting for processing, with the processing that goes out by above-mentioned timer measuring, and above-mentioned displacement, the approach of above-mentioned instrument is carried out revisal to try to achieve in advance.
According to the present invention, rise corresponding to the temperature of main axle unit, the approach of suitable revisal instrument, thus can improve the precision of hole depth.
Description of drawings
Fig. 1 is the actual measurement data of the elongation of actual measurement guide shaft front end.
Fig. 2 is the stereogram of the formation of explanation printing substrate processing machine.
δ ... displacement; 20... storage device;
21... arithmetic unit; 22... timer;
The specific embodiment
Fig. 1 be the actual measurement amount of movement that remains on the front end of the instrument on the guide shaft (below, claim displacement.) actual measurement data, transverse axis express time, the longitudinal axis are represented displacement δ.In addition, the total length of main axle unit is about 300mm, is provided with at main axle unit: the path of its internal flow cooling medium.In addition, displacement δ=0th, the position of the instrument front end when temperature is 20 degrees centigrade.
Shown in figure, with walk around speed rotation of per minute 200,000, and when supplying with 17 degrees centigrade cooling medium simultaneously (T0 constantly), and then, through shrinking main axle unit, the front end of instrument is moved to minus side, but then is moved to positive side within one minute at guide shaft.And, the T1 after approximately through 5 minutes constantly, displacement is saturated basically.
Afterwards, change (T2 constantly) in case decelerate to per minute 30,000, owing to supply with the braking current value bigger than common current value; So that the temperature of main axle unit rises; So displacement δ is temporary increase, but through diminishing again after a while; In the T4 moment (approximately through 8 minutes), displacement δ reaches capacity.In this case, because cooling effect is bigger, so when being 20 degrees centigrade, then be moved to minus side for temperature.
On the other hand, be carved into T2 during from T0 constantly, guide shaft is stopped, in case make guide shaft with the per minute 30,000 speed revolution of walking around constantly at T2, the displacement of instrument front end is then as that kind shown in figure two chain-dotted lines.
At this, the displacement δ of instrument front end is by deciding the guide shaft rotating speed and the duration of runs (elapsed time after the processing beginning), so deviation is very small basically.Therefore; As long as solve the relation between the displacement δ of the duration of runs and instrument front end of guide shaft in advance; Adding rotating speed and the duration of runs of man-hour with reference to the instrument that uses in processing; Displacement δ with the instrument front end of trying to achieve in advance carries out revisal to the approach of appointed instrument, just can carry out the very high processing of cutting-in precision.
In addition, for example, when instrument is drill bit; Confirm to use rotating speed by each diameter; That is to say that diameter rotating speed when 0.3mm is following is per minute 16～200,000 commentaries on classics, diameter is in 0.4mm～1mm scope the time; Rotating speed is per minute 6～80,000 commentaries on classics, so need not take data to each bit diameter.
Yet, the printed base plate tapping machine, except as the drill bit of instrument to the life-span, or when changing for the hole that processes different-diameter, nearly all be in continuous running.
Therefore; Under the situation that is altered to second rotating speed from first rotating speed (Fig. 1 T2 constantly time), as long as solve the relation between the displacement δ of the rotating speed duration of runs and instrument front end after changing in advance, according to the duration of runs of second rotating speed; And with the displacement δ of the tool front end of trying to achieve in advance; Approach to appointed instrument is carried out revisal, the rotating speed and the duration of runs of guide shaft approach is carried out revisal, can carry out the very high processing of cutting-in precision compared with merely.
In addition,, printing substrate processing machine is described, have guide shaft that makes the instrument rotation and the mobile device 10 that guide shaft is moved on this printing substrate processing machine on the axis direction of instrument with reference to figure 1 and Fig. 2; And according to command value; Instrument is moved on the axis direction of instrument; Process, this printing substrate processing machine is provided with storage device 20, arithmetic unit 21 and timer 22, and this storage device; Press each rotating speed of guide shaft, the relation of front end between the displacement δ on the axis direction of storing in advance the duration of runs of guide shaft and remaining on the instrument on the guide shaft stored; When the processing beginning; As long as the elapsed time after beginning according to the rotating speed of the guide shaft set for processing and, the processing of measuring by timer; And, the approach of instrument is carried out revisal with the displacement δ of the instrument front end of trying to achieve in advance, just can carry out the very high processing of cutting-in precision.In addition, above-mentioned storage device 20, arithmetic unit 21 and timer 22 all are arranged in the NC device 23.
Claims (1)
1. printed base plate processing method; It is characterized in that; Press each rotating speed of guide shaft; Come to solve in advance the duration of runs of above-mentioned guide shaft and remain on the relation of front end between the displacement on the axis direction of the instrument on this guide shaft, and solve the duration of runs of above-mentioned guide shaft under the rotation speed change situation of above-mentioned guide shaft, after changing and remain on the relation of front end between the displacement on the axis direction of the instrument on this guide shaft according to each rotating speed of before changing guide shaft
According to first rotating speed and the elapsed time of processing after beginning of the above-mentioned guide shaft of setting in order to process, the unit of this time is min, and with the displacement δ under above-mentioned first rotating speed of trying to achieve in advance, the approach of above-mentioned instrument is carried out revisal,
When above-mentioned first rotating speed changes to second rotating speed continuously; Based on above-mentioned second rotating speed and the elapsed time that changes to behind above-mentioned second rotating speed; Change to the above-mentioned displacement under the situation of second rotating speed with what try to achieve in advance from above-mentioned first rotating speed, the approach of above-mentioned instrument is carried out revisal.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006-262443 | 2006-09-27 | ||
| JP2006262443 | 2006-09-27 | ||
| JP2006262443A JP4311686B2 (en) | 2006-09-27 | 2006-09-27 | Method for processing printed circuit boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101152698A CN101152698A (en) | 2008-04-02 |
| CN101152698B true CN101152698B (en) | 2012-06-06 |
Family
ID=39134629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101452877A Active CN101152698B (en) | 2006-09-27 | 2007-08-21 | Processing method of printing substrate |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP4311686B2 (en) |
| KR (1) | KR101420259B1 (en) |
| CN (1) | CN101152698B (en) |
| DE (1) | DE102007039768B4 (en) |
| TW (1) | TWI411492B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012071404A (en) * | 2010-09-29 | 2012-04-12 | Howa Mach Ltd | Thermal displacement correction method for machine tool and machine tool |
| JP4927985B1 (en) * | 2010-11-22 | 2012-05-09 | ファナック株式会社 | Drive control apparatus for servo motor having at least two feed axes orthogonal to each other for moving table or tool of machine tool |
| JP6444717B2 (en) * | 2014-12-12 | 2018-12-26 | Ｔｏｗａ株式会社 | Cutting apparatus and cutting method |
| JP6235453B2 (en) * | 2014-12-24 | 2017-11-22 | Ｔｏｗａ株式会社 | Cutting apparatus and cutting method |
| CN114245576A (en) * | 2021-11-17 | 2022-03-25 | 南京晟通信息技术有限公司 | Mark point pair-based track correction method for PCB splitting program |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0623647A (en) | 1992-07-06 | 1994-02-01 | Hitachi Seiko Ltd | Printed board drill |
| JP3418453B2 (en) | 1994-06-06 | 2003-06-23 | 日立ビアメカニクス株式会社 | Cooling device for spindle unit in printed circuit board processing machine |
| JP3792266B2 (en) | 1994-06-16 | 2006-07-05 | 森精機興産株式会社 | Method and apparatus for correcting thermal displacement of machine tool |
| JPH0970739A (en) * | 1995-09-08 | 1997-03-18 | Mitsui Seiki Kogyo Co Ltd | Dynamic thermal displacement correcting method |
| JP3783260B2 (en) * | 1995-12-19 | 2006-06-07 | イビデン株式会社 | Through-hole drilling machine for multilayer printed wiring boards |
| JP3711629B2 (en) * | 1996-05-30 | 2005-11-02 | 日立ビアメカニクス株式会社 | Counterboring method |
| JP3413068B2 (en) | 1997-08-19 | 2003-06-03 | オークマ株式会社 | Estimation method of thermal displacement of machine tools |
| US6030154A (en) * | 1998-06-19 | 2000-02-29 | International Business Machines Corporation | Minimum error algorithm/program |
| JP2001062677A (en) * | 1999-08-24 | 2001-03-13 | Canon Inc | Machining method and device in machine tool |
| JP3805945B2 (en) * | 1999-10-15 | 2006-08-09 | 株式会社ムラキ | Reference hole drilling machine |
| EP1407331A2 (en) * | 2001-01-09 | 2004-04-14 | Excellon Automation Co. | Incremental step drilling system and method |
| JP4080181B2 (en) * | 2001-06-22 | 2008-04-23 | 日立ビアメカニクス株式会社 | Processing device and printed circuit board processing machine |
| JP2004090199A (en) * | 2002-09-03 | 2004-03-25 | Toshiba Mach Co Ltd | Rotary tool contact detector of finishing machine, rotary tool correcting device of the machine using the rotary tool contact detector, nc device of the machine, position correcting method of the machine using the detectorc device of the machine, and rotary tool position correcting method of the machine using the detector |
| JP4554460B2 (en) * | 2005-07-22 | 2010-09-29 | 日立ビアメカニクス株式会社 | Drilling method |
| JP5138273B2 (en) * | 2007-05-24 | 2013-02-06 | 日立ビアメカニクス株式会社 | Printed circuit board processing machine |
-
2006
- 2006-09-27 JP JP2006262443A patent/JP4311686B2/en active Active
-
2007
- 2007-08-09 TW TW096129359A patent/TWI411492B/en active
- 2007-08-20 KR KR1020070083239A patent/KR101420259B1/en active IP Right Grant
- 2007-08-21 CN CN2007101452877A patent/CN101152698B/en active Active
- 2007-08-22 DE DE102007039768.4A patent/DE102007039768B4/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN101152698A (en) | 2008-04-02 |
| TWI411492B (en) | 2013-10-11 |
| JP4311686B2 (en) | 2009-08-12 |
| TW200821085A (en) | 2008-05-16 |
| KR20080028761A (en) | 2008-04-01 |
| DE102007039768A1 (en) | 2008-04-03 |
| DE102007039768B4 (en) | 2022-03-31 |
| JP2008080434A (en) | 2008-04-10 |
| KR101420259B1 (en) | 2014-07-16 |
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