JP4311686B2 - プリント基板の加工方法 - Google Patents

プリント基板の加工方法 Download PDF

Info

Publication number
JP4311686B2
JP4311686B2 JP2006262443A JP2006262443A JP4311686B2 JP 4311686 B2 JP4311686 B2 JP 4311686B2 JP 2006262443 A JP2006262443 A JP 2006262443A JP 2006262443 A JP2006262443 A JP 2006262443A JP 4311686 B2 JP4311686 B2 JP 4311686B2
Authority
JP
Japan
Prior art keywords
spindle
tool
amount
rotational speed
machining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2006262443A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008080434A (ja
Inventor
博文 角
勝浩 長沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Via Mechanics Ltd
Original Assignee
Hitachi Via Mechanics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Via Mechanics Ltd filed Critical Hitachi Via Mechanics Ltd
Priority to JP2006262443A priority Critical patent/JP4311686B2/ja
Priority to TW096129359A priority patent/TWI411492B/zh
Priority to KR1020070083239A priority patent/KR101420259B1/ko
Priority to CN2007101452877A priority patent/CN101152698B/zh
Priority to DE102007039768.4A priority patent/DE102007039768B4/de
Publication of JP2008080434A publication Critical patent/JP2008080434A/ja
Application granted granted Critical
Publication of JP4311686B2 publication Critical patent/JP4311686B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/02—Perforating by punching, e.g. with relatively-reciprocating punch and bed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B41/00—Boring or drilling machines or devices specially adapted for particular work; Accessories specially adapted therefor
    • B23B41/14—Boring or drilling machines or devices specially adapted for particular work; Accessories specially adapted therefor for very small holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B2270/00—Details of turning, boring or drilling machines, processes or tools not otherwise provided for
    • B23B2270/54—Methods of turning, boring or drilling not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0207—Partly drilling through substrate until a controlled depth, e.g. with end-point detection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Drilling And Boring (AREA)
  • Automatic Control Of Machine Tools (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Numerical Control (AREA)
  • Inking, Control Or Cleaning Of Printing Machines (AREA)
JP2006262443A 2006-09-27 2006-09-27 プリント基板の加工方法 Active JP4311686B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2006262443A JP4311686B2 (ja) 2006-09-27 2006-09-27 プリント基板の加工方法
TW096129359A TWI411492B (zh) 2006-09-27 2007-08-09 印刷基板之加工方法及印刷基板加工機
KR1020070083239A KR101420259B1 (ko) 2006-09-27 2007-08-20 프린트기판의 가공방법
CN2007101452877A CN101152698B (zh) 2006-09-27 2007-08-21 印刷基板的加工方法
DE102007039768.4A DE102007039768B4 (de) 2006-09-27 2007-08-22 Verfahren zur Bearbeitung von Leiterplatten

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006262443A JP4311686B2 (ja) 2006-09-27 2006-09-27 プリント基板の加工方法

Publications (2)

Publication Number Publication Date
JP2008080434A JP2008080434A (ja) 2008-04-10
JP4311686B2 true JP4311686B2 (ja) 2009-08-12

Family

ID=39134629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006262443A Active JP4311686B2 (ja) 2006-09-27 2006-09-27 プリント基板の加工方法

Country Status (5)

Country Link
JP (1) JP4311686B2 (de)
KR (1) KR101420259B1 (de)
CN (1) CN101152698B (de)
DE (1) DE102007039768B4 (de)
TW (1) TWI411492B (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012071404A (ja) * 2010-09-29 2012-04-12 Howa Mach Ltd 工作機械の熱変位補正方法及び工作機械
JP4927985B1 (ja) * 2010-11-22 2012-05-09 ファナック株式会社 工作機械のテーブル又は工具を移動させる互いに直交した少なくとも二つの送り軸を有するサーボモータの駆動制御装置
JP6444717B2 (ja) * 2014-12-12 2018-12-26 Ｔｏｗａ株式会社 切断装置及び切断方法
JP6235453B2 (ja) * 2014-12-24 2017-11-22 Ｔｏｗａ株式会社 切断装置及び切断方法
CN114245576A (zh) * 2021-11-17 2022-03-25 南京晟通信息技术有限公司 一种基于Mark点对PCB分板程序的轨迹校正方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0623647A (ja) 1992-07-06 1994-02-01 Hitachi Seiko Ltd プリント基板穴明機
JP3418453B2 (ja) 1994-06-06 2003-06-23 日立ビアメカニクス株式会社 プリント基板加工機における主軸ユニットの冷却装置
JP3792266B2 (ja) 1994-06-16 2006-07-05 森精機興産株式会社 工作機械の熱変位補正方法及びその装置
JPH0970739A (ja) * 1995-09-08 1997-03-18 Mitsui Seiki Kogyo Co Ltd ダイナミック熱変位補正方法
JP3783260B2 (ja) * 1995-12-19 2006-06-07 イビデン株式会社 多層プリント配線板のスルーホール穴明け機
JP3711629B2 (ja) * 1996-05-30 2005-11-02 日立ビアメカニクス株式会社 座ぐり加工方法
JP3413068B2 (ja) 1997-08-19 2003-06-03 オークマ株式会社 工作機械の熱変位推定方法
US6030154A (en) * 1998-06-19 2000-02-29 International Business Machines Corporation Minimum error algorithm/program
JP2001062677A (ja) * 1999-08-24 2001-03-13 Canon Inc 工作機械における加工方法及び装置
JP3805945B2 (ja) * 1999-10-15 2006-08-09 株式会社ムラキ 基準穴穴開け機
EP1407331A2 (de) * 2001-01-09 2004-04-14 Excellon Automation Co. Schrittweise operierendes bohrsystem und verfahren
JP4080181B2 (ja) * 2001-06-22 2008-04-23 日立ビアメカニクス株式会社 加工装置およびプリント基板加工機
JP2004090199A (ja) * 2002-09-03 2004-03-25 Toshiba Mach Co Ltd 加工機の回転工具接触検知装置、その回転工具接触検知装置を使用した加工機の回転工具補正装置、加工機のｎｃ装置、加工機の回転工具接触検知装置を使用した加工機の回転工具位置補正方法
JP4554460B2 (ja) * 2005-07-22 2010-09-29 日立ビアメカニクス株式会社 穴明け加工方法
JP5138273B2 (ja) * 2007-05-24 2013-02-06 日立ビアメカニクス株式会社 プリント基板加工機

Also Published As

Publication number Publication date
CN101152698B (zh) 2012-06-06
CN101152698A (zh) 2008-04-02
JP2008080434A (ja) 2008-04-10
KR20080028761A (ko) 2008-04-01
DE102007039768A1 (de) 2008-04-03
DE102007039768B4 (de) 2022-03-31
TWI411492B (zh) 2013-10-11
KR101420259B1 (ko) 2014-07-16
TW200821085A (en) 2008-05-16

Similar Documents

Publication Publication Date Title
KR101157249B1 (ko) 프린트기판의 천공방법 및 프린트기판가공기
JP4311686B2 (ja) プリント基板の加工方法
JP2007125648A (ja) 熱変位補正装置
WO2018047363A1 (ja) 細穴放電加工機
JP5951019B2 (ja) 放電加工用電極の交換判定装置および交換判定方法
WO2018179280A1 (ja) 主軸装置
JP2018051725A (ja) 工具の刃先位置計測方法及び工作機械
JPWO2014207928A1 (ja) 工作機械の主軸装置および工作機械
JP5405160B2 (ja) 深穴加工方法および深穴加工装置
JP3117939U (ja) タッピング装置
JP6498702B2 (ja) 工作機械
JP4078366B2 (ja) 工作機械の熱変位補正装置
JP5786436B2 (ja) 数値制御装置および加工方法
JP6698106B2 (ja) 工作機械のクーラント装置
JP2010082724A (ja) 工作機械の熱変位補正装置及び熱変位補正方法
KR100997053B1 (ko) 대형 중공체의 내경 엔씨가공 전용장치
JP2007301705A (ja) 精密ロール旋盤のサドル案内冷却装置
JP3418453B2 (ja) プリント基板加工機における主軸ユニットの冷却装置
US20180304426A1 (en) Control device and control method
JP2020082284A (ja) 工具動特性解析装置及び工作機械
JPWO2006068083A1 (ja) 加工装置
JP2021020298A (ja) 工具ホルダ及び加工方法
KR100997051B1 (ko) 내경 엔씨가공 전용장치를 이용한 대형 중공체의 내경 가공방법
KR20180115492A (ko) 공작기계 주축의 냉각 장치
JPH10277886A (ja) 工作機械

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080825

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20081120

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20081202

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090202

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20090507

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20090508

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120522

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4311686

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130522

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140522

Year of fee payment: 5

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313532

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350