CN101142253A - 环氧树脂、环氧树脂组合物、使用该环氧树脂的预浸渍体及叠层板 - Google Patents
环氧树脂、环氧树脂组合物、使用该环氧树脂的预浸渍体及叠层板 Download PDFInfo
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- CN101142253A CN101142253A CNA2006800084759A CN200680008475A CN101142253A CN 101142253 A CN101142253 A CN 101142253A CN A2006800084759 A CNA2006800084759 A CN A2006800084759A CN 200680008475 A CN200680008475 A CN 200680008475A CN 101142253 A CN101142253 A CN 101142253A
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- resins
- epoxy
- epoxy resin
- resin
- prepreg
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- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
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- C08G59/22—Di-epoxy compounds
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- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
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- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
本发明的目的在于,提供一种耐热性、介电特性、耐水性、加工性优异的环氧树脂、含有该环氧树脂的环氧树脂组合物、预浸渍体及叠层板。本发明的环氧树脂用下述式(式中,R表示碳原子数为1~4的烃基,m表示1~4的整数,m为2~4时,各个R可以相同,也可以不同。n以平均值表示1~6的正数)表示。本发明的环氧树脂组合物含有本发明的环氧树脂及固化剂。
Description
技术领域
本发明涉及一种贮藏稳定性优异的环氧树脂、含有该环氧树脂的环氧树脂组合物、预浸渍体及叠层板。
背景技术
目前,在搭载LSI等电子配件的印刷电路板中,小型化的要求日益高涨,因而需要减小线宽,或者减小通孔直径减薄镀层厚度。但是,当减薄镀层厚度时,在热冲击时有可能发生镀层破裂,要求电路板具有高耐热性。同时,还有要求这些信息处理设备高速化、CPU时钟频率增高的倾向。因此,要求信息传输速度高速化,进而要求有利于高速化的低介电常数、低介质衰耗因素的基板。另外,在制备这样的基板时,通常使将环氧树脂等热固性树脂溶解于溶剂中而成的清漆浸渍于基材进行加热加压,这时,多要求清漆在长期保存时不发生结晶析出或相分离等现象。作为耐热性、介电特性优异的树脂组合物,专利文献1提案有特定结构的环氧树脂和氰酸酯树脂的组合物。但是,专利文献1记载的环氧树脂在结构上结晶性高,当将树脂组合物以清漆保存一定时间时,存在有结晶析出的问题。
专利文献1:特开2002-309085号公报
专利文献2:特开平5-117350号公报
专利文献3:特开平6-100667号公报
专利文献4:特开平8-143648号公报
发明内容
本发明是为了解决这样的问题而进行研究的结果,通过使用特定结构的环氧树脂,提供一种耐热性、介电特性、耐水性、加工性优异的树脂组合物、预浸渍体及叠层板。
亦即,本发明内容涉及:
(1)一种下述式(1)表示的环氧树脂;
(式中,R表示碳原子数为1~4的烃基,m表示1~4的整数,m为2~4时,各个R可以相同,也可以不同。n以平均值表示1~6的正数。)
(2)如上述(1)所述的环氧树脂,其特征在于,软化点为70℃以上;
(3)一种环氧树脂组合物,其含有上述(1)或(2)所述的环氧树脂及固化剂;
(4)如上述(3)所述的环氧树脂组合物,其含有固化促进剂;
(5)一种固化物,其通过将上述(3)或(4)所述的环氧树脂组合物固化而得到;
(6)一种清漆,其通过将上述(3)或(4)所述的环氧树脂组合物溶解于溶剂而得到;
(7)一种预浸渍体,其特征在于,其通过使上述(3)或(4)所述的环氧树脂组合物浸渍于基材而得到;
(8)一种叠层板,其通过对1片上述(7)所述的预浸渍体或对2片以上该预浸渍体的层叠体进行加热加压而得到;
(9)一种下述式(2)表示的酚醛树脂;
(式中,R表示碳原子数为1~4的烃基,m表示1~4的整数,m为2~4时,各个R可以相同,也可以不同。n以平均值表示1~6的正数。)
(10)如上述(9)所述的酚醛树脂,其特征在于,软化点为80℃以上;
(11)如上述(1)所述的环氧树脂,其中,所有R为碳原子数1~4的烷基;
(12)如上述(1)所述的环氧树脂,其中,该环氧树脂为式(1)中亚甲基在氧缩水甘油基邻位的结合和在对位的结合混合存在的混合物。
由于含有本发明的环氧树脂的环氧树脂组合物的耐热性、介电特性、耐水性、加工性优异,因此,可有效用于以预浸渍体及叠层板为基础的各种复合材料、粘结剂、涂料等。
具体实施方式
本发明的环氧树脂可以利用使下述式(2)表示的苯酚芳烷基树脂和表卤醇反应的缩水甘油化反应来得到。
(式中,R表示碳原子数为1~4的烃基,m表示1~4的整数,m为2~4时,各个R可以相同,也可以不同。n表示平均值为1~6的正数。)
式(2)的苯酚芳烷基树脂可以如专利文献2~4所示通过使下述式(3)(其中,X表示卤原子、烷氧基、羟基。)表示的联苯衍生物和烃基取代苯酚反应来得到。
式(3)表示的联苯衍生物可例举;二(氯甲基)联苯、二(甲氧基甲基)联苯、二(羟甲基)联苯等。
烃基取代苯酚可例举:邻甲酚、间甲酚、对甲酚、2,5-二叔丁基苯酚、2,6-二甲基苯酚、2,4-二甲基苯酚、2-叔丁基苯酚、2-叔丁基-5-甲基苯酚、2-叔丁基-4-甲基苯酚、2,3,6-三甲基苯酚等或2-烯丙基苯酚等具有碳原子数为1~4的烃基、优选含碳原子数为1~4的烷基的苯酚等,其中,优选邻甲酚、间甲酚、对甲酚。这些酚类可以单独使用,也可以两种以上混合使用。
需要说明的是,得到上述苯酚芳烷基树脂时的联苯衍生物和烃基取代苯酚的使用比例,相对于联苯衍生物1摩尔,烃基取代苯酚通常为1.1~5.0摩尔,但由于从得到的环氧树脂的溶剂溶解后的稳定性及固化物的耐热性方面考虑,优选得到的苯酚芳烷基树脂的软化点为80℃以上,因此,为了得到软化点为此范围的优选苯酚芳烷基树脂,优选烃基取代苯酚为1.2~2.6摩尔。
使本发明的苯酚芳烷基树脂和表卤醇反应,可以得到本发明的环氧树脂。
得到本发明的环氧树脂时的缩水甘油化反应中使用的表卤醇有:表氯醇、表溴醇、表碘醇等,优选工业上容易得到且廉价的表氯醇。可以以目前公知的方法为基准进行该反应。
例如,在上述苯酚芳烷基树脂和表卤醇的混合物中,添加氢氧化钠、氢氧化钾等碱金属氢氧化物的固体,或者一边添加一边使其在20~120℃反应0.5~10小时。此时,碱金属氢氧化物可以使用水溶液,该情况下连续添加该碱金属氢氧化物,同时在减压或常压下,从反应混合物中连续蒸馏除去水及表氯醇,再进行分液除去水,而表氯醇连续回到反应混合中的方法也可以。
在上述方法中,表卤醇的用量相对于苯酚芳烷基树脂的羟基1当量通常为0.5~20摩尔、优选为0.7~10摩尔。碱金属氢氧化物的用量相对于苯酚芳烷基树脂的羟基1当量通常为0.5~1.5摩尔、优选为0.7~1.2摩尔。另外,通过添加二甲砜、二甲亚砜、二甲基甲酰胺、1,3-二甲基-2-咪唑啉酮等非质子溶剂,可以得到如下定义的水解性卤素量低的环氧树脂,该环氧树脂特别适用于电子材料。
非质子性极性溶剂的用量相对于表卤醇的重量为5~200重量%、优选为10~100重量%。除了上述溶剂以外,通过添加甲醇、乙醇等醇类,容易增进反应。另外,也可以使用甲苯、二甲苯等。在此所谓的水解性卤素量,可以通过如下方法测定,例如,将该环氧树脂加入二噁烷中,一边进行回流数十分钟,一边用KOH/乙醇溶液进行滴定。
另外,在苯酚芳烷基树脂和过量的表卤醇的混合物中,使用四甲基氯化铵、四甲基溴化铵、三甲基苄基氯化铵等季铵盐作为催化剂,在50~150℃使其反应1~10小时,在得到的苯酚芳烷基树脂的卤代醇醚中,添加氢氧化钠、氢氧化钾等碱金属氢氧化物的固体或水溶液,再使其在20~120℃反应1~10小时,使卤代醇醚闭环,也可以得到本发明的环氧树脂。此时的季铵盐的用量相对于苯酚混合物的羟基1当量通常为0.001~0.2摩尔、优选为0.05~0.1摩尔。碱金属氢氧化物的用量相对于苯酚芳烷基树脂的羟基1当量通常为0.8~1.5摩尔、优选为0.9~1.1摩尔。
通常情况下,这些反应生成物在水洗后或不经过水洗在加热减压下除去过量的表卤醇类及溶剂等后,再溶解于甲苯、甲基异丁基酮等溶剂中,加入氢氧化钠、氢氧化钾等碱金属氢氧化物的水溶液,再进行反应,由此可以得到水解性卤素浓度低的本发明的环氧树脂。此时,碱金属氢氧化物的用量相对于苯酚芳烷基树脂的羟基1摩尔通常为0.01~0.2摩尔、优选为0.05~0.1摩尔。反应温度通常为50~120℃,反应时间通常为0.5~2小时。
反应结束后,通过过滤、水洗等除去副产物的盐,再在加热减压下除去甲苯、甲基异丁基酮等溶剂等,由此可以得到可水解的卤素浓度低的本发明的环氧树脂。
从溶剂溶解后的稳定性及固化物的耐热性方面考虑,本发明的环氧树脂的软化点优选为70℃以上。将软化点为80℃以上的本发明的苯酚芳烷基树脂如上所述进行环氧化,可以得到这样的环氧树脂。
下面,对本发明的环氧树脂组合物进行说明。本发明的环氧树脂组合物含有本发明的环氧树脂及固化剂。在本发明的环氧树脂组合物中,本发明的环氧树脂可以单独使用或者和其它环氧树脂并用。并用时,本发明的环氧树脂在全部环氧树脂中所占的比例优选为30重量%以上,特别优选为40重量%以上。
可以和本发明的环氧树脂并用的其它环氧树脂可例举:双酚A、双酚F、双酚S、芴双酚、萜烯二苯酚、4,4’-双酚、2,2’-双酚、3,3’,5,5’-四甲基-[1,1’-联苯基]-4,4’-二醇、对苯二酚、间苯二酚、萘二醇、三-(4-羟苯基)甲烷、1,1,2,2-四(4-羟苯基)乙烷、酚醛类(苯酚、烷基取代苯酚、萘酚、烷基取代萘酚、二羟基苯、二羟基萘等)和甲醛、乙醛、苯甲醛、对羟基苯甲醛、邻羟基苯甲醛、对羟基乙酰苯、邻羟基乙酰苯、二环戊二烯、糠醛、4,4’-二(氯甲基)-1,1’-联苯、4,4’-二(甲氧基甲基)-1,1’-联苯、1,4’-二(氯甲基)苯、1,4’-二(甲氧基甲基)苯等的缩聚物及这些物质的改性物、由四溴双酚A等卤化双酚类、醇类衍生的缩水甘油醚化物、脂环式环氧树脂、缩水甘油胺系环氧树脂、缩水甘油酯系环氧树脂等固态或液态环氧树脂,但并不限于这些环氧树脂。这些环氧树脂可以单独使用,也可以使用两种以上。
本发明的环氧树脂组合物含有的固化剂,可例举例如:胺系化合物、酸酐系化合物、酰胺系化合物、苯酚系化合物等。可以使用的固化剂的具体例可例举:二氨基二苯甲烷、二乙三胺、三乙四胺、二氨基二苯砜、异佛尔酮二胺、双氰胺、由亚麻酸的二聚体和乙二胺合成的聚酰胺树脂、邻苯二甲酸酐、偏苯三酸酐、均苯四酸酐、马来酸酐、四氢邻苯二甲酸酐、甲基四氢邻苯二甲酸酐、甲基降冰片烯二酸酐、六氢邻苯二甲酸酐、甲基六氢邻苯二甲酸酐、双酚A、双酚F、双酚S、芴双酚、萜烯二苯酚、4,4’-双酚、2,2’-双酚、3,3’,5,5’-四甲基-[1,1’-联苯基]-4,4’-二醇、对苯二酚、间苯二酚、萘二醇、三-(4-羟苯基)甲烷、1,1,2,2-四(4-羟苯基)乙烷、酚醛类(苯酚、烷基取代苯酚、萘酚、烷基取代萘酚、二羟基苯、二羟基萘等)和甲醛、乙醛、苯甲醛、对羟基苯甲醛、邻羟基苯甲醛、对羟基乙酰苯、邻羟基乙酰苯、二环戊二烯、糠醛、4,4’-二(氯甲基)-1,1’-联苯、4,4’-二(甲氧基甲基)-1,1’-联苯、1,4’-二(氯甲基)苯、1,4’-二(甲氧基甲基)苯等的缩聚物及这些物质的改性物、四溴双酚A等卤化双酚类、咪唑、BF3-胺络合物、胍衍生物等,但并不限定于这些固化剂。这些固化剂可以单独使用,也可以使用两种以上。
本发明的环氧树脂组合物中固化剂的用量,相对于环氧树脂的环氧基1当量优选为0.5~1.5当量、特别优选为0.6~1.2当量。当固化剂的用量相对于环氧基1当量优低于0.5当量或超过1.5当量时,都可能会使固化不完全,进而无法得到良好的固化物性。
另外,在使用上述固化剂时可以并用固化促进剂。可以使用的固化促进剂可例举例如:2-甲基咪唑、2-乙基咪唑、2-苯基咪唑、2-乙基-4-甲基咪唑等咪唑类;2-(二甲基氨甲基)苯酚、三乙二胺、三乙醇胺、1,8-二氮双环(5,4,0)十一碳烯-7等叔胺类;三苯基膦、二苯基膦、三丁基膦等有机膦类;辛酸锡等金属化合物、四苯基硼酸四苯基、乙基三苯基硼酸四苯基等四取代硼酸四取代、2-乙基-4-甲基咪唑·四苯基硼酸盐、N-甲基吗啉·四苯基硼酸盐等四苯基硼酸盐等。使用固化促进剂时的用量,相对于环氧树脂100重量份,根据需要可以使用固化促进剂0.01~15重量份。
而且,在本发明的环氧树脂组合物中,也可以并用氰酸酯树脂和/或以其为原料的预聚物、二马来酰亚胺-三嗪树脂、蜜胺树脂、热固性聚酰亚胺等其它热固性树脂、苯氧树脂、聚酰胺酰亚胺树脂、聚苯醚树脂、聚醚砜树脂等热塑性树脂。
另外,可以根据需要添加无机填充剂或硅烷偶合剂、着色剂、粘结剂树脂、均化剂、离子捕捉剂、脱模剂等各种配合剂。
无机填充剂可例举:熔融硅石、结晶硅石、碳化硅、氮化硅、氮化硼、碳酸钙、硫酸钡、硫酸钙、云母、滑石、粘土、氧化铝、氧化镁、氧化锆、氢氧化铝、氢氧化镁、硅酸钙、硅酸铝、硅酸锂铝、硅酸锆、钛酸钡、玻璃纤维、碳纤维、二硫化钼、石棉等,优选熔融硅石、结晶硅石、氮化硅、氮化硼、碳酸钙、硫酸钡、硫酸钙、云母、滑石、粘土、氧化铝、氢氧化铝。另外,这些填充材料可以单独使用一种,也可以两种以上混合使用。
偶合剂具体例如有:3-环氧丙氧基丙基三甲氧基硅烷、3-环氧丙氧基丙基三甲氧基硅烷、3-环氧丙氧基丙基甲基二甲氧基硅烷、3-环氧丙氧基丙基甲基二甲氧基硅烷、2-(3,4-环氧基环己基)乙基三甲氧基硅烷、N-(2-氨乙基)3-氨丙基甲基二甲氧基硅烷、N-(2-氨乙基)3-氨丙基甲基三甲氧基硅烷、3-氨丙基三乙氧基硅烷、3-巯基丙基三甲氧基硅烷、乙烯基三甲氧基硅烷、N-(2-(乙烯基苄氨基)乙基)3-氨丙基三甲氧基硅烷盐酸盐、3-甲基丙烯酰氧基丙基三甲氧基硅烷、3-氯丙基甲基二甲氧基硅烷、3-氯丙基三甲氧基硅烷等硅烷系偶合剂;异丙基(N-乙基氨乙基乙氨基)钛酸酯、二(二辛基焦磷酸酯)氧乙酸钛、四异丙基二(二辛基亚磷酸酯)钛酸酯、新烷氧基三(对-N-(β-氨乙基)氨苯基)钛酸酯等钛系偶合剂;乙酰丙酮络锆、Zr-甲基丙烯酸盐、Zr-丙酸盐、新烷氧基三(十二烷酰)苯磺酰锆酸酯、新烷氧基三(亚乙基二氨乙基)锆酸酯、新烷氧基三(间氨苯基)锆酸酯、碳酸锆铵、乙酰丙酮络铝、A1-甲基丙烯酸盐、A1-丙酸盐等锆或铝系偶合剂,优选硅系偶合剂。通过使用偶合剂,可以得到耐湿可靠性优良、吸湿后的粘结强度下降少的固化物。
着色剂没有特别限制,可例举:酞菁、偶氮、双偶氮、喹吖酮、蒽醌、黄蒽酮、紫环酮(perinone)、苝、二嗪、缩合偶氮、偶氮甲碱等各种有机系色素;氧化钛、硫酸铅、铬黄、锌铬黄、钼红、氧化铁红、钴紫、藏青、青、群青、碳黑、铬绿、氧化铬、钴绿等无机颜料。
本发明的环氧树脂组合物可以通过如下方法得到,即,将上述各种成分用亨舍尔混合机、行星式混合机等混合后,利用双轧辊、捏合机、挤压机、砂磨机等均匀进行分散。或者,通过在溶剂中均匀进行混合,可以得到清漆。而且,通过和目前已知的方法同样的方法,本发明的环氧树脂组合物可以容易地作成其固化物。
例如,得到本发明的环氧树脂组合物,利用熔融铸塑法或传递模塑法、喷射造型法、压缩成型法等将该环氧树脂组合物成型,再在80~200℃加热2~10小时,由此可以得到本发明的固化物。
另外,由于本发明的环氧树脂的溶剂溶解性优异不容易产生结晶,因此,通过将本发明的环氧树脂组合物溶解于溶剂作成清漆,可适于用作叠层板等的粘结剂。此时,例如,使本发明的环氧树脂组合物溶解于如下所述的溶剂,使其浸渍于玻璃纤维、碳纤维、聚酯纤维、聚酰胺纤维、氧化铝纤维、纸等基材,进行加热干燥,将由此得到的预浸渍体进行热压成型,可以得到固化物,或者可以将本发明环氧树脂组合物溶解于下列溶剂得到下述片材。所述溶剂例如有:γ-丁内酯、N-甲基吡咯烷酮(NMP)、N,N-二甲基甲酰胺(DMF)、N,N-二甲基乙酰胺、N,N-二甲基咪唑啉酮等酰胺系溶剂;四亚甲基砜等砜类;二乙二醇二甲醚、二乙二醇二乙醚、丙二醇、丙二醇一甲醚、丙二醇一甲醚一乙酸酯、丙二醇一丁醚等醚类溶剂;甲乙酮、甲基异丁基酮等酮类溶剂;甲苯、二甲苯等芳香族类溶剂。对此时的溶剂而言,在用于预浸渍体时,在本发明的环氧树脂组合物和该溶剂的混合物中,其用量通常为10~70重量%、优选为15~70重量%。另外,在用于片材用途时,其用量以使得到的清漆中的固体成分浓度(溶剂以外的成分的浓度)通常为10~80重量%、优选为20~70重量%为宜。
将上述清漆作成片材状使用时,将清漆其自身利用公知的照相凹板式涂敷法、网版印刷、金属掩模法、旋转涂敷法等各种涂敷方法涂敷在基材上,以使其干燥后的厚度为规定厚度、例如5~100μm,然后进行干燥使用,使用哪种涂敷法,可根据基材的种类、形状、大小、涂膜厚度来适当选择。基材例如有:由聚酰胺、聚酰胺酰亚胺、聚芳酯、聚对苯二甲酸乙二酯、聚对苯二甲酸丁二酯、聚醚醚酮、聚醚酰亚胺、聚醚酮、聚酮、聚乙烯、聚丙烯等各种高分子和/或其共聚物作成的薄膜或铜箔等金属箔,特别优选聚酰亚胺薄膜、铜箔。使用剥离膜时,可以作为粘结片使用。所谓粘结片是将单面涂敷粘结剂层(清漆)的剥离膜与另一脱模剂贴合而成的材料,作为将挠性印刷电路板和挠性印刷电路板贴合时等的粘结材料使用。通过将由此得到的片材加热,可以得到片状固化物。
实施例
下面,利用实施例进一步具体说明本发明,只要没有特别说明,下面的“份”即指“重量份”。
另外,环氧当量、软化点、熔融粘度在以下条件下进行测定。
·环氧当量
用以JIS K-7236为基准的方法进行测定,单位为g/eq。
·软化点
用以JIS K-7234为基准的方法进行测定。
·熔融粘度
150℃温度下的锥板法中的熔融粘度
测定设备:锥板(ICI)高温粘度计
(RESEACH EQUIPMENT(LONDON)LTD.制)
圆锥体No.:3(测定范围0~2.00Pa·s)
试样量:0.15±0.01g
实施例1
在备有搅拌器、温度计、传感器的四口烧瓶中,加入邻甲酚95份、对甲苯磺酸1份,在110℃一边搅拌一边用2小时加入4,4’-二(氯甲基)-1,1’-联苯151份,在120℃进行反应2小时。反应结束后,加入MIBK400份并反复进行水洗。接下来,在加热减压下,将未反应的甲酚及甲基异丁基酮(MIBK)从油层中蒸馏除去,由此得到本发明的苯酚芳烷基树脂(P1)180份。得到的苯酚芳烷基树脂(P1)的软化点为104℃、熔融粘度为2.0Pa·s以上、羟基当量为242g/eq。
实施例2
在实施例1中,将邻甲酚95份变更为间甲酚130份,除此之外,与实施例1同样操作,得到本发明的苯酚芳烷基树脂(P2)196份。得到的苯酚芳烷基树脂(P2)的软化点为109℃、熔融粘度为2.00Pa·s以上、羟基当量为235g/eq。
实施例3
在实施例1得到的苯酚芳烷基树脂(P1)120份中加入表氯醇275份、二甲亚砜64份溶解后,加热到55℃,用90分钟添加片状氢氧化钠(纯度99%)20份,然后,再使其在45℃反应2小时、在70℃反应1小时。接下来,反复进行水洗至回到中性后,在加热减压下,将过量的表氯醇从油层中蒸馏除去,在残留物中添加MIBK 296份进行溶解。进一步将该MIBK溶液加热到75℃,添加30重量%的氢氧化钠水溶液5份,使其反应1小时,然后,反复进行水洗至中性。接下来,在加热减压下,将MIBK从油层中蒸馏除去,由此得到本发明的环氧树脂(E1)88份。得到的环氧树脂(E1)的树脂物性为:环氧当量为323g/eq、软化点为85℃、熔融粘度为1.76Pa·s。
实施例4
在实施例3中,将实施例1得到的苯酚芳烷基树脂(P1)120份变更为实施例2得到的苯酚芳烷基树脂(P2)117份,除此之外,与实施例3同样操作,得到本发明的环氧树脂(E2)133份。得到的环氧树脂(E2)的树脂物性为:环氧当量为308g/eq、软化点为93℃、熔融粘度为2.00Pa·s以上。
试验例1~3
对于实施例3及4得到的环氧树脂(E1)、(E2)、比较用式(1)中的R为氢原子的环氧树脂(NC-3000、日本化药制、软化点为57℃),使其溶解于作为溶剂的甲乙酮中使得树脂浓度为70重量%,在5℃的环境下保存。将试验结果示于表1。需要说明的是,判定基准如下所示。
○:溶解后,即使经过2周以上也没有结晶析出
×:溶解后,在2周以内有结晶析出
表1
试验例1 | 试验例2 | 试验例3 | |
环氧树脂试验结果 | E1○ | E2○ | NC-3000× |
实施例5~7、比较例1
调整环氧树脂清漆组成为如表2所示。分别使得到的清漆浸渍于玻璃布(WEA18W105F115N:日东纺绩(株)制)后,在120℃的热风干燥机中干燥7分钟,得到半固化的预浸渍体。将上述预浸渍体8片和铜箔(Nikko-Gould(株)制、JTC箔、35μm)重叠,在40kgf/cm2、温度170℃进行加热加压成型60分钟,作成玻璃布叠层板。对于作成的叠层板,通过以下项目及方法测定其特性。将测定结果示于表2。
·玻璃化转变温度
热机械检测仪(TMA):真空理工TM-7000
升温速度:2℃/分
·铜箔剥离强度
拉伸试验机:Toyo Baldwin Tensilon RTM-500
拉伸方式:180°剥离
加载速度(クロスヘツドスピ一ド):200mm/分
测定温度:30℃
·吸水率
试验片:5cm×5cm
在100℃的热水中煮沸24小时后的重量增加量(重量%)
·介电常数
以JIS 6481为基准进行测定
表2
实施例5 | 实施例6 | 实施例7 | 比较例1 | |
配合比 | ||||
E1 | 100 | 100 | ||
E2 | 100 | |||
R-232 | 100 | |||
PN-80 | 33 | 34 | 28 | 22 |
2E4MZ | 0.3 | 0.3 | 0.3 | |
氰酸酯树脂 | ||||
MEK | 89 | 89 | 103 | 81 |
固化物性 | ||||
玻璃化转变温度(℃) | 150 | 145 | 170 | 125 |
铜箔剥离强度(kN/m) | 2.7 | 2.8 | 2.6 | 1.9 |
吸水率(%) | 0.5 | 0.5 | 0.4 | 0.5 |
介电常数 | 4.5 | 4.5 | 4.3 | 4.8 |
表中
R-232:溴化双酚A型环氧树脂(Epomick R-232:三井化学(株)制、环氧当量为483g/eq)
PN-80:酚醛清漆型树脂(PN-80:日本化药(株)制、羟基当量为105g/eq、软化点为86℃)
2E4MZ:2-乙基-4-甲基咪唑
氰酸酯树脂:氰酸酯树脂预聚物(B-40S:Asahi-ciba(株)制、双酚A二氰酸酯树脂、三聚率为40%、固体成分为75%的MEK溶液)
MEK:甲乙酮
由表1可知,本发明的环氧树脂的溶剂溶解后的稳定性优异,由表2可知,本发明的固化物与目前通常使用的双酚A型环氧树脂相比,耐热性、密合性、耐水性优异,且具有低介电特性。
Claims (12)
2.如权利要求1所述的环氧树脂,其特征在于,软化点为70℃以上。
3.一种环氧树脂组合物,其含有权利要求1或2所述的环氧树脂及固化剂。
4.如权利要求3所述的环氧树脂组合物,其含有固化促进剂。
5.一种固化物,其通过将权利要求3或4所述的环氧树脂组合物固化而得到。
6.一种清漆,其通过将权利要求3或4所述的环氧树脂组合物溶解于溶剂而得到。
7.一种预浸渍体,其特征在于,其通过使权利要求3或4所述的环氧树脂组合物浸渍于基材而得到。
8.一种叠层板,其通过对1片权利要求7所述的预浸渍体或对2片以上该预浸渍体的层叠体进行加热加压而得到。
9.一种下述式(2)表示的酚醛树脂:
式中,R表示碳原子数为1~4的烃基,m表示1~4的整数,m为2~4时,各个R可以相同,也可以不同;n以平均值表示1~6的正数。
10.如权利要求9所述的酚醛树脂,其特征在于,软化点为80℃以上。
11.如权利要求1所述的环氧树脂,其中,所有R为碳原子数1~4的烷基。
12.如权利要求1所述的环氧树脂,其中,该环氧树脂为式(1)中亚甲基在氧缩水甘油基邻位的结合和在对位的结合混合存在的混合物。
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EP1860133A1 (en) | 2007-11-28 |
US20090054587A1 (en) | 2009-02-26 |
TWI384006B (zh) | 2013-02-01 |
CN102604512A (zh) | 2012-07-25 |
WO2006098329A1 (ja) | 2006-09-21 |
KR101248294B1 (ko) | 2013-03-27 |
JPWO2006098329A1 (ja) | 2008-08-21 |
KR101260535B1 (ko) | 2013-05-06 |
JP5382761B2 (ja) | 2014-01-08 |
EP1860133A4 (en) | 2008-05-21 |
KR20070121672A (ko) | 2007-12-27 |
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