CN101044624A - 半导体器件 - Google Patents

半导体器件 Download PDF

Info

Publication number
CN101044624A
CN101044624A CNA2005800361121A CN200580036112A CN101044624A CN 101044624 A CN101044624 A CN 101044624A CN A2005800361121 A CNA2005800361121 A CN A2005800361121A CN 200580036112 A CN200580036112 A CN 200580036112A CN 101044624 A CN101044624 A CN 101044624A
Authority
CN
China
Prior art keywords
conductive layer
layer
organic compound
field effect
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2005800361121A
Other languages
English (en)
Chinese (zh)
Inventor
安部宽子
岩城裕司
汤川干央
山崎舜平
荒井康行
渡边康子
守屋芳隆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Publication of CN101044624A publication Critical patent/CN101044624A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K19/00Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0009RRAM elements whose operation depends upon chemical change
    • G11C13/0014RRAM elements whose operation depends upon chemical change comprising cells based on organic memory material
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B20/00Read-only memory [ROM] devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B69/00Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/20Organic diodes
    • H10K10/23Schottky diodes
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/04Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using optical elements ; using other beam accessed elements, e.g. electron or ion beam
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/60Organic compounds having low molecular weight
    • H10K85/611Charge transfer complexes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/60Organic compounds having low molecular weight
    • H10K85/631Amine compounds having at least two aryl rest on at least one amine-nitrogen atom, e.g. triphenylamine

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Semiconductor Memories (AREA)
  • Thin Film Transistor (AREA)
CNA2005800361121A 2004-10-22 2005-10-13 半导体器件 Pending CN101044624A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP308838/2004 2004-10-22
JP2004308838 2004-10-22

Publications (1)

Publication Number Publication Date
CN101044624A true CN101044624A (zh) 2007-09-26

Family

ID=36203026

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2005800361121A Pending CN101044624A (zh) 2004-10-22 2005-10-13 半导体器件

Country Status (6)

Country Link
US (2) US7781758B2 (enExample)
JP (1) JP5268197B2 (enExample)
KR (1) KR101258672B1 (enExample)
CN (1) CN101044624A (enExample)
TW (1) TWI434411B (enExample)
WO (1) WO2006043611A1 (enExample)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101676931B (zh) 2004-10-18 2012-06-27 株式会社半导体能源研究所 半导体器件以及防止用户伪造物体的方法
CN101044624A (zh) 2004-10-22 2007-09-26 株式会社半导体能源研究所 半导体器件
US7935958B2 (en) * 2004-10-22 2011-05-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR101187400B1 (ko) * 2004-11-26 2012-10-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치
US7960719B2 (en) * 2004-12-03 2011-06-14 Semiconductor Energy Laboratotry Co., Ltd. Semiconductor device
WO2006085633A1 (en) * 2005-02-10 2006-08-17 Semiconductor Energy Laboratory Co., Ltd. Memory element and semiconductor device
US7926726B2 (en) * 2005-03-28 2011-04-19 Semiconductor Energy Laboratory Co., Ltd. Survey method and survey system
US7700984B2 (en) * 2005-05-20 2010-04-20 Semiconductor Energy Laboratory Co., Ltd Semiconductor device including memory cell
US7868320B2 (en) 2005-05-31 2011-01-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US7935957B2 (en) * 2005-08-12 2011-05-03 Semiconductor Energy Laboratory Co., Ltd. Memory device and a semiconductor device
KR101369864B1 (ko) 2005-08-12 2014-03-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치 및 그 제조방법
US7912439B2 (en) 2005-11-25 2011-03-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and operating method thereof
CN102222765B (zh) * 2006-03-10 2012-12-12 株式会社半导体能源研究所 存储元件以及半导体器件
EP1850378A3 (en) * 2006-04-28 2013-08-07 Semiconductor Energy Laboratory Co., Ltd. Memory device and semicondutor device
US7719001B2 (en) 2006-06-28 2010-05-18 Semiconductor Energy Laboratory Co., Ltd Semiconductor device with metal oxides and an organic compound
US7988057B2 (en) 2006-11-28 2011-08-02 Semiconductor Energy Laboratory Co., Ltd. Memory device and semiconductor device
KR101485926B1 (ko) * 2007-02-02 2015-02-04 가부시키가이샤 한도오따이 에네루기 켄큐쇼 기억장치
US8283724B2 (en) 2007-02-26 2012-10-09 Semiconductor Energy Laboratory Co., Ltd. Memory element and semiconductor device, and method for manufacturing the same
USD645029S1 (en) * 2008-05-09 2011-09-13 Semiconductor Energy Laboratory Co., Ltd. Antenna
USD602922S1 (en) * 2008-05-09 2009-10-27 Semiconductor Energy Laboratory Co., Ltd. Contactless data carrier
KR101520285B1 (ko) * 2008-05-16 2015-05-14 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광소자 및 전자기기
USD605642S1 (en) * 2008-09-10 2009-12-08 Semiconductor Energy Laboratory Co., Ltd. Contactless data carrier
CN102770903B (zh) * 2010-02-26 2015-10-07 株式会社半导体能源研究所 显示装置及具备该显示装置的电子书阅读器
US9698129B2 (en) 2011-03-18 2017-07-04 Johnson & Johnson Vision Care, Inc. Stacked integrated component devices with energization
US10451897B2 (en) 2011-03-18 2019-10-22 Johnson & Johnson Vision Care, Inc. Components with multiple energization elements for biomedical devices
US8857983B2 (en) 2012-01-26 2014-10-14 Johnson & Johnson Vision Care, Inc. Ophthalmic lens assembly having an integrated antenna structure
US9793536B2 (en) 2014-08-21 2017-10-17 Johnson & Johnson Vision Care, Inc. Pellet form cathode for use in a biocompatible battery
US10361404B2 (en) 2014-08-21 2019-07-23 Johnson & Johnson Vision Care, Inc. Anodes for use in biocompatible energization elements
US10381687B2 (en) 2014-08-21 2019-08-13 Johnson & Johnson Vision Care, Inc. Methods of forming biocompatible rechargable energization elements for biomedical devices
US9599842B2 (en) 2014-08-21 2017-03-21 Johnson & Johnson Vision Care, Inc. Device and methods for sealing and encapsulation for biocompatible energization elements
US10361405B2 (en) 2014-08-21 2019-07-23 Johnson & Johnson Vision Care, Inc. Biomedical energization elements with polymer electrolytes
US9383593B2 (en) 2014-08-21 2016-07-05 Johnson & Johnson Vision Care, Inc. Methods to form biocompatible energization elements for biomedical devices comprising laminates and placed separators
US9715130B2 (en) 2014-08-21 2017-07-25 Johnson & Johnson Vision Care, Inc. Methods and apparatus to form separators for biocompatible energization elements for biomedical devices
US10627651B2 (en) 2014-08-21 2020-04-21 Johnson & Johnson Vision Care, Inc. Methods and apparatus to form biocompatible energization primary elements for biomedical devices with electroless sealing layers
US9941547B2 (en) 2014-08-21 2018-04-10 Johnson & Johnson Vision Care, Inc. Biomedical energization elements with polymer electrolytes and cavity structures
JP1555474S (enExample) * 2015-10-26 2016-08-08
JP1555473S (enExample) * 2015-10-26 2016-08-08
US10345620B2 (en) 2016-02-18 2019-07-09 Johnson & Johnson Vision Care, Inc. Methods and apparatus to form biocompatible energization elements incorporating fuel cells for biomedical devices

Family Cites Families (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3833894A (en) * 1973-06-20 1974-09-03 Ibm Organic memory device
US4115872A (en) 1977-05-31 1978-09-19 Burroughs Corporation Amorphous semiconductor memory device for employment in an electrically alterable read-only memory
US4177475A (en) * 1977-10-31 1979-12-04 Burroughs Corporation High temperature amorphous memory device for an electrically alterable read-only memory
IL61678A (en) 1979-12-13 1984-04-30 Energy Conversion Devices Inc Programmable cell and programmable electronic arrays comprising such cells
IL61671A (en) 1979-12-13 1984-04-30 Energy Conversion Devices Inc Diode and rom or eeprom devices using it
US4499557A (en) 1980-10-28 1985-02-12 Energy Conversion Devices, Inc. Programmable cell for use in programmable electronic arrays
JP2982286B2 (ja) 1990-10-30 1999-11-22 オムロン株式会社 データキャリア
US5375250A (en) * 1992-07-13 1994-12-20 Van Den Heuvel; Raymond C. Method of intelligent computing and neural-like processing of time and space functions
JPH06232271A (ja) * 1993-01-29 1994-08-19 Nippon Telegr & Teleph Corp <Ntt> 結線材料及び入出力制御方法
TW287313B (enExample) * 1995-02-20 1996-10-01 Matsushita Electric Industrial Co Ltd
US6340588B1 (en) * 1995-04-25 2002-01-22 Discovery Partners International, Inc. Matrices with memories
DE69723625T2 (de) * 1996-02-16 2004-04-22 Koninklijke Philips Electronics N.V. Einmal beschreibbares, mehrmals lesbares elektrisches speicherelement aus konjugiertem polymer oder oligomer
NO973993L (no) 1997-09-01 1999-03-02 Opticom As Leseminne og leseminneinnretninger
JP3761300B2 (ja) 1997-09-30 2006-03-29 株式会社東芝 シフトレジスター型記憶素子
JP2000113152A (ja) 1998-10-05 2000-04-21 Hitachi Maxell Ltd 非接触メモリ素子を内蔵した磁気ストライプテープ及びそれを利用して製造されたicカード及びicタグ
US6498240B1 (en) * 1999-09-17 2002-12-24 Millipore Corporation Method for sequencing reaction cleanup by constant pressure diffential ultrafiltration
US6509217B1 (en) * 1999-10-22 2003-01-21 Damoder Reddy Inexpensive, reliable, planar RFID tag structure and method for making same
JP2001189431A (ja) * 1999-12-28 2001-07-10 Seiko Epson Corp メモリのセル構造及びメモリデバイス
JP2003529223A (ja) 2000-03-28 2003-09-30 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ プログラム可能な記憶素子を有する集積回路
JP2001345431A (ja) 2000-05-31 2001-12-14 Japan Science & Technology Corp 有機強誘電体薄膜及び半導体デバイス
JP3377786B2 (ja) 2000-06-21 2003-02-17 日立マクセル株式会社 半導体チップ
DE10196382T1 (de) 2000-06-21 2003-12-04 Hitachi Maxell Halbleiterchip und Halbleitervorrichtung, für die der Halbleiterchip verwendet wird
JP2002026283A (ja) * 2000-06-30 2002-01-25 Seiko Epson Corp 多層構造のメモリ装置及びその製造方法
WO2002037500A1 (en) 2000-10-31 2002-05-10 The Regents Of The University Of California Organic bistable device and organic memory cells
SG117406A1 (en) 2001-03-19 2005-12-29 Miconductor Energy Lab Co Ltd Method of manufacturing a semiconductor device
WO2002091384A1 (en) * 2001-05-07 2002-11-14 Advanced Micro Devices, Inc. A memory device with a self-assembled polymer film and method of making the same
JP2003007982A (ja) * 2001-06-22 2003-01-10 Nec Corp 磁気記憶装置及び磁気記憶装置の設計方法
WO2003065377A1 (en) 2002-02-01 2003-08-07 Hitachi, Ltd. Storage device
JP2003243631A (ja) * 2002-02-18 2003-08-29 Mitsubishi Electric Corp 薄膜磁性体記憶装置ならびにそれを用いた無線チップ、流通管理システムおよび製造工程管理システム
US6683322B2 (en) 2002-03-01 2004-01-27 Hewlett-Packard Development Company, L.P. Flexible hybrid memory element
TWI223569B (en) * 2002-03-20 2004-11-01 Sanyo Electric Co Method for reducing light quantity of organic EL panel and organic EL panel
JP3940014B2 (ja) * 2002-03-29 2007-07-04 富士通株式会社 半導体集積回路、無線タグ、および非接触型icカード
JP4539007B2 (ja) * 2002-05-09 2010-09-08 日本電気株式会社 半導体記憶装置
US6847541B2 (en) * 2002-06-07 2005-01-25 Mitsubishi Chemical Corporation Information storage device, and information storage method and information regeneration method employing the information storage device
US6828685B2 (en) 2002-06-14 2004-12-07 Hewlett-Packard Development Company, L.P. Memory device having a semiconducting polymer film
JP2004128471A (ja) * 2002-08-07 2004-04-22 Canon Inc 不揮発メモリ装置
US6847047B2 (en) * 2002-11-04 2005-01-25 Advanced Micro Devices, Inc. Methods that facilitate control of memory arrays utilizing zener diode-like devices
JP4509467B2 (ja) 2002-11-08 2010-07-21 シャープ株式会社 不揮発可変抵抗素子、及び記憶装置
JP2004185755A (ja) * 2002-12-05 2004-07-02 Sharp Corp 不揮発性半導体記憶装置
US7220985B2 (en) * 2002-12-09 2007-05-22 Spansion, Llc Self aligned memory element and wordline
JP4101643B2 (ja) * 2002-12-26 2008-06-18 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP4671600B2 (ja) * 2002-12-27 2011-04-20 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP4323813B2 (ja) 2003-01-14 2009-09-02 キヤノン株式会社 基板の製造方法
US20040152276A1 (en) 2003-01-14 2004-08-05 Naoki Nishimura Device, and substrate on which circuit and antenna are formed
EP1594176B1 (en) 2003-02-14 2010-05-19 Fuji Electric Holdings Co., Ltd. Switching device
US7973313B2 (en) 2003-02-24 2011-07-05 Semiconductor Energy Laboratory Co., Ltd. Thin film integrated circuit device, IC label, container comprising the thin film integrated circuit, manufacturing method of the thin film integrated circuit device, manufacturing method of the container, and management method of product having the container
JP4566578B2 (ja) 2003-02-24 2010-10-20 株式会社半導体エネルギー研究所 薄膜集積回路の作製方法
US6977389B2 (en) * 2003-06-02 2005-12-20 Advanced Micro Devices, Inc. Planar polymer memory device
US7050326B2 (en) * 2003-10-07 2006-05-23 Hewlett-Packard Development Company, L.P. Magnetic memory device with current carrying reference layer
DE10355561A1 (de) * 2003-11-28 2005-06-30 Infineon Technologies Ag Halbleiteranordnung mit nichtflüchtigen Speichern
JP2005183619A (ja) * 2003-12-18 2005-07-07 Canon Inc 不揮発メモリ装置
CN100468740C (zh) 2004-04-02 2009-03-11 株式会社半导体能源研究所 半导体器件及其驱动方法
CN101676931B (zh) * 2004-10-18 2012-06-27 株式会社半导体能源研究所 半导体器件以及防止用户伪造物体的方法
US7935958B2 (en) * 2004-10-22 2011-05-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
CN101044624A (zh) 2004-10-22 2007-09-26 株式会社半导体能源研究所 半导体器件
KR101187400B1 (ko) * 2004-11-26 2012-10-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치
US8188461B2 (en) * 2005-05-31 2012-05-29 Semiconductor Energy Laboratory Co., Ltd. Organic memory device

Also Published As

Publication number Publication date
JP5268197B2 (ja) 2013-08-21
JP2011077535A (ja) 2011-04-14
TW200629549A (en) 2006-08-16
US8227802B2 (en) 2012-07-24
KR20070067706A (ko) 2007-06-28
TWI434411B (zh) 2014-04-11
US20080048180A1 (en) 2008-02-28
KR101258672B1 (ko) 2013-04-26
WO2006043611A1 (en) 2006-04-27
US20100295034A1 (en) 2010-11-25
US7781758B2 (en) 2010-08-24

Similar Documents

Publication Publication Date Title
CN101044624A (zh) 半导体器件
CN1873998A (zh) 半导体器件及其制造方法
CN100576557C (zh) 半导体器件及其制造方法
CN101044623A (zh) 半导体器件及其驱动方法
CN101064333A (zh) 存储器件以及半导体器件
CN101529596B (zh) 装置及其制造方法
CN1905164A (zh) 半导体装置及其制造方法
TWI430433B (zh) 半導體裝置和其製造方法
JP5475947B2 (ja) 紙及び半導体装置
CN100592520C (zh) 半导体器件及包括其的显示装置
CN1870261A (zh) 半导体器件及其制造方法
CN101064348A (zh) 半导体器件及半导体器件的制造方法
CN101069285A (zh) 半导体器件及其制造方法
CN1893033A (zh) 制造半导体器件的方法
CN1832179A (zh) 半导体器件及其制造方法
CN1841734A (zh) 半导体器件和其驱动方法
CN101034719A (zh) 半导体装置及其制造方法
CN1866568A (zh) 半导体装置
CN1797605A (zh) 半导体器件
CN1930580A (zh) 半导体设备、无线芯片、ic卡、ic标签、应答器、帐单、证券、护照、电子设备、书包和服装
JP4884784B2 (ja) 半導体装置の作製方法及び半導体装置
CN1873997A (zh) 半导体器件及用于制造半导体器件的方法
CN101064361A (zh) 存储元件以及半导体装置
CN101057329A (zh) 半导体器件
CN1959962A (zh) 半导体器件的制造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C12 Rejection of a patent application after its publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20070926