JP5268197B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP5268197B2 JP5268197B2 JP2010259096A JP2010259096A JP5268197B2 JP 5268197 B2 JP5268197 B2 JP 5268197B2 JP 2010259096 A JP2010259096 A JP 2010259096A JP 2010259096 A JP2010259096 A JP 2010259096A JP 5268197 B2 JP5268197 B2 JP 5268197B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive layer
- layer
- organic compound
- semiconductor device
- data
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K19/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/20—Organic diodes
- H10K10/23—Schottky diodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0009—RRAM elements whose operation depends upon chemical change
- G11C13/0014—RRAM elements whose operation depends upon chemical change comprising cells based on organic memory material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B20/00—Read-only memory [ROM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/04—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using optical elements ; using other beam accessed elements, e.g. electron or ion beam
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/611—Charge transfer complexes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/631—Amine compounds having at least two aryl rest on at least one amine-nitrogen atom, e.g. triphenylamine
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Semiconductor Memories (AREA)
- Thin Film Transistor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010259096A JP5268197B2 (ja) | 2004-10-22 | 2010-11-19 | 半導体装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004308838 | 2004-10-22 | ||
| JP2004308838 | 2004-10-22 | ||
| JP2010259096A JP5268197B2 (ja) | 2004-10-22 | 2010-11-19 | 半導体装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005304375A Division JP4767653B2 (ja) | 2004-10-22 | 2005-10-19 | 半導体装置及び無線チップ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011077535A JP2011077535A (ja) | 2011-04-14 |
| JP2011077535A5 JP2011077535A5 (enExample) | 2011-05-26 |
| JP5268197B2 true JP5268197B2 (ja) | 2013-08-21 |
Family
ID=36203026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010259096A Expired - Fee Related JP5268197B2 (ja) | 2004-10-22 | 2010-11-19 | 半導体装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US7781758B2 (enExample) |
| JP (1) | JP5268197B2 (enExample) |
| KR (1) | KR101258672B1 (enExample) |
| CN (1) | CN101044624A (enExample) |
| TW (1) | TWI434411B (enExample) |
| WO (1) | WO2006043611A1 (enExample) |
Families Citing this family (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101676931B (zh) | 2004-10-18 | 2012-06-27 | 株式会社半导体能源研究所 | 半导体器件以及防止用户伪造物体的方法 |
| CN101044624A (zh) | 2004-10-22 | 2007-09-26 | 株式会社半导体能源研究所 | 半导体器件 |
| US7935958B2 (en) * | 2004-10-22 | 2011-05-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| KR101187400B1 (ko) * | 2004-11-26 | 2012-10-02 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치 |
| US7960719B2 (en) * | 2004-12-03 | 2011-06-14 | Semiconductor Energy Laboratotry Co., Ltd. | Semiconductor device |
| WO2006085633A1 (en) * | 2005-02-10 | 2006-08-17 | Semiconductor Energy Laboratory Co., Ltd. | Memory element and semiconductor device |
| US7926726B2 (en) * | 2005-03-28 | 2011-04-19 | Semiconductor Energy Laboratory Co., Ltd. | Survey method and survey system |
| US7700984B2 (en) * | 2005-05-20 | 2010-04-20 | Semiconductor Energy Laboratory Co., Ltd | Semiconductor device including memory cell |
| US7868320B2 (en) | 2005-05-31 | 2011-01-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US7935957B2 (en) * | 2005-08-12 | 2011-05-03 | Semiconductor Energy Laboratory Co., Ltd. | Memory device and a semiconductor device |
| KR101369864B1 (ko) | 2005-08-12 | 2014-03-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치 및 그 제조방법 |
| US7912439B2 (en) | 2005-11-25 | 2011-03-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and operating method thereof |
| CN102222765B (zh) * | 2006-03-10 | 2012-12-12 | 株式会社半导体能源研究所 | 存储元件以及半导体器件 |
| EP1850378A3 (en) * | 2006-04-28 | 2013-08-07 | Semiconductor Energy Laboratory Co., Ltd. | Memory device and semicondutor device |
| US7719001B2 (en) | 2006-06-28 | 2010-05-18 | Semiconductor Energy Laboratory Co., Ltd | Semiconductor device with metal oxides and an organic compound |
| US7988057B2 (en) | 2006-11-28 | 2011-08-02 | Semiconductor Energy Laboratory Co., Ltd. | Memory device and semiconductor device |
| KR101485926B1 (ko) * | 2007-02-02 | 2015-02-04 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 기억장치 |
| US8283724B2 (en) | 2007-02-26 | 2012-10-09 | Semiconductor Energy Laboratory Co., Ltd. | Memory element and semiconductor device, and method for manufacturing the same |
| USD645029S1 (en) * | 2008-05-09 | 2011-09-13 | Semiconductor Energy Laboratory Co., Ltd. | Antenna |
| USD602922S1 (en) * | 2008-05-09 | 2009-10-27 | Semiconductor Energy Laboratory Co., Ltd. | Contactless data carrier |
| KR101520285B1 (ko) * | 2008-05-16 | 2015-05-14 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광소자 및 전자기기 |
| USD605642S1 (en) * | 2008-09-10 | 2009-12-08 | Semiconductor Energy Laboratory Co., Ltd. | Contactless data carrier |
| CN102770903B (zh) * | 2010-02-26 | 2015-10-07 | 株式会社半导体能源研究所 | 显示装置及具备该显示装置的电子书阅读器 |
| US9698129B2 (en) | 2011-03-18 | 2017-07-04 | Johnson & Johnson Vision Care, Inc. | Stacked integrated component devices with energization |
| US10451897B2 (en) | 2011-03-18 | 2019-10-22 | Johnson & Johnson Vision Care, Inc. | Components with multiple energization elements for biomedical devices |
| US8857983B2 (en) | 2012-01-26 | 2014-10-14 | Johnson & Johnson Vision Care, Inc. | Ophthalmic lens assembly having an integrated antenna structure |
| US9793536B2 (en) | 2014-08-21 | 2017-10-17 | Johnson & Johnson Vision Care, Inc. | Pellet form cathode for use in a biocompatible battery |
| US10361404B2 (en) | 2014-08-21 | 2019-07-23 | Johnson & Johnson Vision Care, Inc. | Anodes for use in biocompatible energization elements |
| US10381687B2 (en) | 2014-08-21 | 2019-08-13 | Johnson & Johnson Vision Care, Inc. | Methods of forming biocompatible rechargable energization elements for biomedical devices |
| US9599842B2 (en) | 2014-08-21 | 2017-03-21 | Johnson & Johnson Vision Care, Inc. | Device and methods for sealing and encapsulation for biocompatible energization elements |
| US10361405B2 (en) | 2014-08-21 | 2019-07-23 | Johnson & Johnson Vision Care, Inc. | Biomedical energization elements with polymer electrolytes |
| US9383593B2 (en) | 2014-08-21 | 2016-07-05 | Johnson & Johnson Vision Care, Inc. | Methods to form biocompatible energization elements for biomedical devices comprising laminates and placed separators |
| US9715130B2 (en) | 2014-08-21 | 2017-07-25 | Johnson & Johnson Vision Care, Inc. | Methods and apparatus to form separators for biocompatible energization elements for biomedical devices |
| US10627651B2 (en) | 2014-08-21 | 2020-04-21 | Johnson & Johnson Vision Care, Inc. | Methods and apparatus to form biocompatible energization primary elements for biomedical devices with electroless sealing layers |
| US9941547B2 (en) | 2014-08-21 | 2018-04-10 | Johnson & Johnson Vision Care, Inc. | Biomedical energization elements with polymer electrolytes and cavity structures |
| JP1555474S (enExample) * | 2015-10-26 | 2016-08-08 | ||
| JP1555473S (enExample) * | 2015-10-26 | 2016-08-08 | ||
| US10345620B2 (en) | 2016-02-18 | 2019-07-09 | Johnson & Johnson Vision Care, Inc. | Methods and apparatus to form biocompatible energization elements incorporating fuel cells for biomedical devices |
Family Cites Families (57)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3833894A (en) * | 1973-06-20 | 1974-09-03 | Ibm | Organic memory device |
| US4115872A (en) | 1977-05-31 | 1978-09-19 | Burroughs Corporation | Amorphous semiconductor memory device for employment in an electrically alterable read-only memory |
| US4177475A (en) * | 1977-10-31 | 1979-12-04 | Burroughs Corporation | High temperature amorphous memory device for an electrically alterable read-only memory |
| IL61678A (en) | 1979-12-13 | 1984-04-30 | Energy Conversion Devices Inc | Programmable cell and programmable electronic arrays comprising such cells |
| IL61671A (en) | 1979-12-13 | 1984-04-30 | Energy Conversion Devices Inc | Diode and rom or eeprom devices using it |
| US4499557A (en) | 1980-10-28 | 1985-02-12 | Energy Conversion Devices, Inc. | Programmable cell for use in programmable electronic arrays |
| JP2982286B2 (ja) | 1990-10-30 | 1999-11-22 | オムロン株式会社 | データキャリア |
| US5375250A (en) * | 1992-07-13 | 1994-12-20 | Van Den Heuvel; Raymond C. | Method of intelligent computing and neural-like processing of time and space functions |
| JPH06232271A (ja) * | 1993-01-29 | 1994-08-19 | Nippon Telegr & Teleph Corp <Ntt> | 結線材料及び入出力制御方法 |
| TW287313B (enExample) * | 1995-02-20 | 1996-10-01 | Matsushita Electric Industrial Co Ltd | |
| US6340588B1 (en) * | 1995-04-25 | 2002-01-22 | Discovery Partners International, Inc. | Matrices with memories |
| DE69723625T2 (de) * | 1996-02-16 | 2004-04-22 | Koninklijke Philips Electronics N.V. | Einmal beschreibbares, mehrmals lesbares elektrisches speicherelement aus konjugiertem polymer oder oligomer |
| NO973993L (no) | 1997-09-01 | 1999-03-02 | Opticom As | Leseminne og leseminneinnretninger |
| JP3761300B2 (ja) | 1997-09-30 | 2006-03-29 | 株式会社東芝 | シフトレジスター型記憶素子 |
| JP2000113152A (ja) | 1998-10-05 | 2000-04-21 | Hitachi Maxell Ltd | 非接触メモリ素子を内蔵した磁気ストライプテープ及びそれを利用して製造されたicカード及びicタグ |
| US6498240B1 (en) * | 1999-09-17 | 2002-12-24 | Millipore Corporation | Method for sequencing reaction cleanup by constant pressure diffential ultrafiltration |
| US6509217B1 (en) * | 1999-10-22 | 2003-01-21 | Damoder Reddy | Inexpensive, reliable, planar RFID tag structure and method for making same |
| JP2001189431A (ja) * | 1999-12-28 | 2001-07-10 | Seiko Epson Corp | メモリのセル構造及びメモリデバイス |
| JP2003529223A (ja) | 2000-03-28 | 2003-09-30 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | プログラム可能な記憶素子を有する集積回路 |
| JP2001345431A (ja) | 2000-05-31 | 2001-12-14 | Japan Science & Technology Corp | 有機強誘電体薄膜及び半導体デバイス |
| JP3377786B2 (ja) | 2000-06-21 | 2003-02-17 | 日立マクセル株式会社 | 半導体チップ |
| DE10196382T1 (de) | 2000-06-21 | 2003-12-04 | Hitachi Maxell | Halbleiterchip und Halbleitervorrichtung, für die der Halbleiterchip verwendet wird |
| JP2002026283A (ja) * | 2000-06-30 | 2002-01-25 | Seiko Epson Corp | 多層構造のメモリ装置及びその製造方法 |
| WO2002037500A1 (en) | 2000-10-31 | 2002-05-10 | The Regents Of The University Of California | Organic bistable device and organic memory cells |
| SG117406A1 (en) | 2001-03-19 | 2005-12-29 | Miconductor Energy Lab Co Ltd | Method of manufacturing a semiconductor device |
| WO2002091384A1 (en) * | 2001-05-07 | 2002-11-14 | Advanced Micro Devices, Inc. | A memory device with a self-assembled polymer film and method of making the same |
| JP2003007982A (ja) * | 2001-06-22 | 2003-01-10 | Nec Corp | 磁気記憶装置及び磁気記憶装置の設計方法 |
| WO2003065377A1 (en) | 2002-02-01 | 2003-08-07 | Hitachi, Ltd. | Storage device |
| JP2003243631A (ja) * | 2002-02-18 | 2003-08-29 | Mitsubishi Electric Corp | 薄膜磁性体記憶装置ならびにそれを用いた無線チップ、流通管理システムおよび製造工程管理システム |
| US6683322B2 (en) | 2002-03-01 | 2004-01-27 | Hewlett-Packard Development Company, L.P. | Flexible hybrid memory element |
| TWI223569B (en) * | 2002-03-20 | 2004-11-01 | Sanyo Electric Co | Method for reducing light quantity of organic EL panel and organic EL panel |
| JP3940014B2 (ja) * | 2002-03-29 | 2007-07-04 | 富士通株式会社 | 半導体集積回路、無線タグ、および非接触型icカード |
| JP4539007B2 (ja) * | 2002-05-09 | 2010-09-08 | 日本電気株式会社 | 半導体記憶装置 |
| US6847541B2 (en) * | 2002-06-07 | 2005-01-25 | Mitsubishi Chemical Corporation | Information storage device, and information storage method and information regeneration method employing the information storage device |
| US6828685B2 (en) | 2002-06-14 | 2004-12-07 | Hewlett-Packard Development Company, L.P. | Memory device having a semiconducting polymer film |
| JP2004128471A (ja) * | 2002-08-07 | 2004-04-22 | Canon Inc | 不揮発メモリ装置 |
| US6847047B2 (en) * | 2002-11-04 | 2005-01-25 | Advanced Micro Devices, Inc. | Methods that facilitate control of memory arrays utilizing zener diode-like devices |
| JP4509467B2 (ja) | 2002-11-08 | 2010-07-21 | シャープ株式会社 | 不揮発可変抵抗素子、及び記憶装置 |
| JP2004185755A (ja) * | 2002-12-05 | 2004-07-02 | Sharp Corp | 不揮発性半導体記憶装置 |
| US7220985B2 (en) * | 2002-12-09 | 2007-05-22 | Spansion, Llc | Self aligned memory element and wordline |
| JP4101643B2 (ja) * | 2002-12-26 | 2008-06-18 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP4671600B2 (ja) * | 2002-12-27 | 2011-04-20 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP4323813B2 (ja) | 2003-01-14 | 2009-09-02 | キヤノン株式会社 | 基板の製造方法 |
| US20040152276A1 (en) | 2003-01-14 | 2004-08-05 | Naoki Nishimura | Device, and substrate on which circuit and antenna are formed |
| EP1594176B1 (en) | 2003-02-14 | 2010-05-19 | Fuji Electric Holdings Co., Ltd. | Switching device |
| US7973313B2 (en) | 2003-02-24 | 2011-07-05 | Semiconductor Energy Laboratory Co., Ltd. | Thin film integrated circuit device, IC label, container comprising the thin film integrated circuit, manufacturing method of the thin film integrated circuit device, manufacturing method of the container, and management method of product having the container |
| JP4566578B2 (ja) | 2003-02-24 | 2010-10-20 | 株式会社半導体エネルギー研究所 | 薄膜集積回路の作製方法 |
| US6977389B2 (en) * | 2003-06-02 | 2005-12-20 | Advanced Micro Devices, Inc. | Planar polymer memory device |
| US7050326B2 (en) * | 2003-10-07 | 2006-05-23 | Hewlett-Packard Development Company, L.P. | Magnetic memory device with current carrying reference layer |
| DE10355561A1 (de) * | 2003-11-28 | 2005-06-30 | Infineon Technologies Ag | Halbleiteranordnung mit nichtflüchtigen Speichern |
| JP2005183619A (ja) * | 2003-12-18 | 2005-07-07 | Canon Inc | 不揮発メモリ装置 |
| CN100468740C (zh) | 2004-04-02 | 2009-03-11 | 株式会社半导体能源研究所 | 半导体器件及其驱动方法 |
| CN101676931B (zh) * | 2004-10-18 | 2012-06-27 | 株式会社半导体能源研究所 | 半导体器件以及防止用户伪造物体的方法 |
| US7935958B2 (en) * | 2004-10-22 | 2011-05-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| CN101044624A (zh) | 2004-10-22 | 2007-09-26 | 株式会社半导体能源研究所 | 半导体器件 |
| KR101187400B1 (ko) * | 2004-11-26 | 2012-10-02 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치 |
| US8188461B2 (en) * | 2005-05-31 | 2012-05-29 | Semiconductor Energy Laboratory Co., Ltd. | Organic memory device |
-
2005
- 2005-10-13 CN CNA2005800361121A patent/CN101044624A/zh active Pending
- 2005-10-13 KR KR1020077010486A patent/KR101258672B1/ko not_active Expired - Fee Related
- 2005-10-13 WO PCT/JP2005/019253 patent/WO2006043611A1/en not_active Ceased
- 2005-10-13 US US11/587,441 patent/US7781758B2/en not_active Expired - Fee Related
- 2005-10-20 TW TW094136697A patent/TWI434411B/zh not_active IP Right Cessation
-
2010
- 2010-07-30 US US12/847,352 patent/US8227802B2/en not_active Expired - Fee Related
- 2010-11-19 JP JP2010259096A patent/JP5268197B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011077535A (ja) | 2011-04-14 |
| TW200629549A (en) | 2006-08-16 |
| US8227802B2 (en) | 2012-07-24 |
| KR20070067706A (ko) | 2007-06-28 |
| TWI434411B (zh) | 2014-04-11 |
| US20080048180A1 (en) | 2008-02-28 |
| KR101258672B1 (ko) | 2013-04-26 |
| WO2006043611A1 (en) | 2006-04-27 |
| CN101044624A (zh) | 2007-09-26 |
| US20100295034A1 (en) | 2010-11-25 |
| US7781758B2 (en) | 2010-08-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5268197B2 (ja) | 半導体装置 | |
| CN100576557C (zh) | 半导体器件及其制造方法 | |
| JP5303588B2 (ja) | 半導体装置の作製方法 | |
| US8647942B2 (en) | Semiconductor device and manufacturing method thereof | |
| US8223531B2 (en) | Semiconductor device and driving method of the same | |
| US7358590B2 (en) | Semiconductor device and driving method thereof | |
| US20080093462A1 (en) | Semiconductor Device and Manufacturing Method Thereof | |
| JP4767653B2 (ja) | 半導体装置及び無線チップ | |
| JP4912671B2 (ja) | 半導体装置 | |
| JP5052055B2 (ja) | 記憶装置及び半導体装置の作製方法 | |
| JP2006148088A (ja) | 半導体装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110309 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130129 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130131 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130213 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130326 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130403 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130430 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130506 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 5268197 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |