CN101002512B - 附有粘着辅助剂的金属箔及使用其的印刷配线板 - Google Patents
附有粘着辅助剂的金属箔及使用其的印刷配线板 Download PDFInfo
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- CN101002512B CN101002512B CN2005800259496A CN200580025949A CN101002512B CN 101002512 B CN101002512 B CN 101002512B CN 2005800259496 A CN2005800259496 A CN 2005800259496A CN 200580025949 A CN200580025949 A CN 200580025949A CN 101002512 B CN101002512 B CN 101002512B
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
- H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J129/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
- C09J129/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/04—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to rubbers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/0358—Resin coated copper [RCC]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/1266—O, S, or organic compound in metal component
- Y10T428/12667—Oxide of transition metal or Al
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/2887—Adhesive compositions including addition polymer from unsaturated monomer including nitrogen containing polymer [e.g., polyacrylonitrile, polymethacrylonitrile, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
处理工序 | 处理液 | 处理条件 |
清洗剂 | CLC-501 | 60℃、5分钟 |
热水洗 | 纯水 | 40℃、4分钟 |
蚀刻 | 过氧二硫酸铵187g/l | 25℃、10秒 |
流水洗 | 纯水 | 25℃、3分钟 |
酸处理 | 10vo1%硫酸 | 25℃、3分钟 |
流水洗 | 纯水 | 25℃、2分钟 |
赋予催化剂的前处理 | PD301 | 25℃、2分钟 |
赋予催化剂的处理 | HS-201B | 25℃、8分钟 |
流水洗 | 纯水 | 25℃、3分钟 |
密接促进剂 | ADP-201 | 25℃、4分钟 |
流水洗 | 纯水 | 25℃、2分钟 |
工序 | 溶液 | 浓度 | 液温 | 浸渍时间 |
脱脂 | Z-200 | 60℃ | 1分钟 | |
水洗 | 25℃ | 2分钟 | ||
轻蚀刻 | 过硫酸铵 | 100g/L | 25℃ | 1分钟 |
水洗 | 25℃ | 2分钟 | ||
酸洗 | 硫酸 | 10vo1% | 25℃ | 1分钟 |
水洗 | 25℃ | 2分钟 | ||
活化处理 | SA-100 | 25℃ | 5分钟 | |
水洗 | 25℃ | 2分钟 | ||
化学镀镍磷 | NIPS-100 | 85℃ | 20分钟 | |
水洗 | 25℃ | 2分钟 | ||
化学镀镍硼 | Top chemialloy66 | 65℃ | 5分钟 | |
水洗 | 25℃ | 2分钟 | ||
化学镀钯 | Pallet | 70℃ | 5分钟 | |
水洗 | 25℃ | 2分钟 | ||
取代镀金 | HGS-100 | 85℃ | 10分钟 | |
水洗 | 25℃ | 2分钟 | ||
化学镀金 | HGS-2000 | 65℃ | 40分钟 |
项目 | 条件 |
装置 | 岛津制作所(股)制Autograph AC-100C |
剥离速度 | 50mm/min |
试验宽度 | 1mm |
单位 | 使用 | |
IVH径 | μm | 80 |
IVH间距 | mm | 1.27 |
内层衬垫径 | μm | 150 |
外层焊盘直径 | μm | 150 |
IVH数 | 个 | 400 |
项目 | 导体剥离强度(kN/m) | 有无吸湿耐热性膨胀 |
实施例1 | 0.7 | 无 |
实施例2 | 0.9 | 无 |
实施例3 | 0.8 | 无 |
实施例4 | 0.7 | 无 |
实施例5 | 0.9 | 无 |
参考例1 | 0.2 | 有 |
参考例2 | 0.3 | 有 |
参考例3 | 0.7 | 有 |
Claims (30)
Priority Applications (1)
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CN201210397545.1A CN102917536B (zh) | 2004-11-10 | 2005-11-10 | 附有粘着辅助剂的金属箔及使用其的印刷配线板 |
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
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JP326649/2004 | 2004-11-10 | ||
JP2004326649 | 2004-11-10 | ||
JP2005005130 | 2005-01-12 | ||
JP005130/2005 | 2005-01-12 | ||
JP2005155331 | 2005-05-27 | ||
JP155331/2005 | 2005-05-27 | ||
PCT/JP2005/020621 WO2006051864A1 (ja) | 2004-11-10 | 2005-11-10 | 接着補助剤付金属箔及びそれを用いたプリント配線板 |
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CN201210397545.1A Division CN102917536B (zh) | 2004-11-10 | 2005-11-10 | 附有粘着辅助剂的金属箔及使用其的印刷配线板 |
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CN101002512A CN101002512A (zh) | 2007-07-18 |
CN101002512B true CN101002512B (zh) | 2013-12-04 |
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CN2005800259496A Active CN101002512B (zh) | 2004-11-10 | 2005-11-10 | 附有粘着辅助剂的金属箔及使用其的印刷配线板 |
CN201210397545.1A Active CN102917536B (zh) | 2004-11-10 | 2005-11-10 | 附有粘着辅助剂的金属箔及使用其的印刷配线板 |
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US (1) | US7740936B2 (zh) |
KR (1) | KR100910092B1 (zh) |
CN (2) | CN101002512B (zh) |
DE (1) | DE112005002748T5 (zh) |
MY (1) | MY143242A (zh) |
TW (2) | TWI494228B (zh) |
WO (1) | WO2006051864A1 (zh) |
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CN101002512A (zh) | 2007-07-18 |
WO2006051864A1 (ja) | 2006-05-18 |
MY143242A (en) | 2011-04-15 |
CN102917536A (zh) | 2013-02-06 |
CN102917536B (zh) | 2016-06-22 |
TWI395668B (zh) | 2013-05-11 |
US7740936B2 (en) | 2010-06-22 |
US20080145689A1 (en) | 2008-06-19 |
KR100910092B1 (ko) | 2009-07-30 |
TW200628311A (en) | 2006-08-16 |
TW201313487A (zh) | 2013-04-01 |
KR20070070255A (ko) | 2007-07-03 |
DE112005002748T5 (de) | 2007-09-06 |
TWI494228B (zh) | 2015-08-01 |
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