CN100542719C - 球形银粉及其制造方法 - Google Patents

球形银粉及其制造方法 Download PDF

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Publication number
CN100542719C
CN100542719C CNB2005100823565A CN200510082356A CN100542719C CN 100542719 C CN100542719 C CN 100542719C CN B2005100823565 A CNB2005100823565 A CN B2005100823565A CN 200510082356 A CN200510082356 A CN 200510082356A CN 100542719 C CN100542719 C CN 100542719C
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CN
China
Prior art keywords
silver powder
silver
spherical silver
spherical
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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CNB2005100823565A
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English (en)
Chinese (zh)
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CN1709619A (zh
Inventor
尾木孝造
藤野剛聡
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Tonghe Holding Group Co ltd
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Tonghe Holding Group Co ltd
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Publication of CN1709619A publication Critical patent/CN1709619A/zh
Application granted granted Critical
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/06—Metallic powder characterised by the shape of the particles
    • B22F1/065—Spherical particles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Nanotechnology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
CNB2005100823565A 2004-06-18 2005-06-20 球形银粉及其制造方法 Expired - Lifetime CN100542719C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004181479A JP2006002228A (ja) 2004-06-18 2004-06-18 球状銀粉およびその製造方法
JP2004181479 2004-06-18

Publications (2)

Publication Number Publication Date
CN1709619A CN1709619A (zh) 2005-12-21
CN100542719C true CN100542719C (zh) 2009-09-23

Family

ID=34937434

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005100823565A Expired - Lifetime CN100542719C (zh) 2004-06-18 2005-06-20 球形银粉及其制造方法

Country Status (8)

Country Link
US (1) US20050279970A1 (enExample)
EP (1) EP1609547B1 (enExample)
JP (1) JP2006002228A (enExample)
KR (1) KR101345441B1 (enExample)
CN (1) CN100542719C (enExample)
AT (1) ATE372183T1 (enExample)
DE (1) DE602005002299T2 (enExample)
TW (1) TWI351998B (enExample)

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* Cited by examiner, † Cited by third party
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JP2005240092A (ja) * 2004-02-26 2005-09-08 Dowa Mining Co Ltd 銀粉およびその製造方法
US20060231802A1 (en) * 2005-04-14 2006-10-19 Takuya Konno Electroconductive thick film composition, electrode, and solar cell formed therefrom
KR101046197B1 (ko) * 2005-09-21 2011-07-04 니혼한다가부시끼가이샤 페이스트형 은입자 조성물, 고형상 은의 제조 방법, 고형상은, 접합 방법 및 인쇄 배선판의 제조 방법
JP2007235082A (ja) 2006-02-02 2007-09-13 E I Du Pont De Nemours & Co 太陽電池電極用ペースト
JP4961601B2 (ja) * 2006-02-14 2012-06-27 Ｄｏｗａエレクトロニクス株式会社 銀粉とその製造方法及びこれを用いたペースト、電子回路部品、電気製品
JP2007270334A (ja) * 2006-03-31 2007-10-18 Dowa Holdings Co Ltd 銀粉及びその製造方法
JP5098098B2 (ja) * 2006-09-29 2012-12-12 Ｄｏｗａエレクトロニクス株式会社 銀粉およびその製造方法
KR100781326B1 (ko) * 2006-11-24 2007-11-30 제일모직주식회사 전극 형성용 페이스트 조성물 및 이를 이용하여 제조된전극을 포함하는 플라즈마 디스플레이 패널
CN101584010B (zh) * 2007-01-09 2012-08-29 同和电子科技有限公司 银粒子分散液及其制造方法
JP5252843B2 (ja) * 2007-01-09 2013-07-31 Ｄｏｗａエレクトロニクス株式会社 銀インクおよびその製法
KR101280489B1 (ko) * 2007-05-09 2013-07-01 주식회사 동진쎄미켐 태양전지 전극 형성용 페이스트
US8795837B2 (en) * 2007-08-20 2014-08-05 Diemat, Inc. Adhesives with thermal conductivity enhanced by mixed silver fillers
CN101835557B (zh) 2007-10-24 2015-01-07 同和电子科技有限公司 含微小银粒子的组合物、其制造方法、微小银粒子的制造方法及具有微小银粒子的糊料
TW201043359A (en) * 2009-05-01 2010-12-16 Du Pont Silver particles and a process for making them
US8231704B2 (en) * 2009-05-01 2012-07-31 E I Du Pont De Nemours And Company Silver particles and processes for making them
TW201108249A (en) * 2009-08-25 2011-03-01 Du Pont Silver thick film paste compositions and their use in conductors for photovoltaic cells
CN102222705A (zh) * 2010-04-14 2011-10-19 上海大洲电子材料有限公司 一种无铅环保银浆料及硅太阳能电池背面电极的形成方法
US8366799B2 (en) 2010-08-30 2013-02-05 E I Du Pont De Nemours And Company Silver particles and a process for making them
KR20130099998A (ko) * 2010-11-08 2013-09-06 나믹스 가부시끼가이샤 금속 입자 및 그 제조 방법
US8574338B2 (en) 2010-11-17 2013-11-05 E I Du Pont De Nemours And Company Reactor and continuous process for producing silver powders
JP6174301B2 (ja) * 2011-03-28 2017-08-02 Ｄｏｗａエレクトロニクス株式会社 銀粉および導電性ペースト
TWI532059B (zh) * 2011-03-31 2016-05-01 Taiyo Holdings Co Ltd Conductive paste, conductive pattern formation method and conductive pattern
JP5772241B2 (ja) * 2011-06-02 2015-09-02 住友金属鉱山株式会社 銀粉の製造方法
JP6047276B2 (ja) 2011-06-30 2017-07-05 三井金属鉱業株式会社 焼結型導電性ペースト用銀粉
CN102343441A (zh) * 2011-09-22 2012-02-08 上海交通大学 一种单分散高振实低团聚银粉的制备方法
CN102328094B (zh) * 2011-09-28 2013-04-03 上海交通大学 一种粒度均匀超细银粉的制备方法
CN102407346A (zh) * 2011-11-25 2012-04-11 中原工学院 一种制备银纤维前驱体的方法
JP5872440B2 (ja) * 2012-02-13 2016-03-01 Ｄｏｗａエレクトロニクス株式会社 球状銀粉およびその製造方法
KR101194273B1 (ko) 2012-04-27 2012-10-29 한국지질자원연구원 분산 특성이 우수한 구형 철 분말 제조 장치 및 그 제조 방법
JP5633045B2 (ja) * 2012-05-25 2014-12-03 Ｄｏｗａエレクトロニクス株式会社 銀粉およびその製造方法
JP5945480B2 (ja) * 2012-09-07 2016-07-05 ナミックス株式会社 銀ペースト組成物及びその製造方法
US9818718B2 (en) 2012-10-30 2017-11-14 Kaken Tech Co., Ltd. Conductive paste and die bonding method
CN103396744B (zh) * 2013-08-08 2015-07-29 京东方科技集团股份有限公司 一种导电银胶及其制备方法
JP6404554B2 (ja) * 2013-10-03 2018-10-10 住友金属鉱山株式会社 銀粉の製造方法
CN103551589B (zh) * 2013-10-30 2015-07-29 江苏理工学院 花状银微米颗粒的合成方法
CN104148665B (zh) * 2014-07-22 2017-04-12 西北大学 一种结晶银粉的制备方法
JP6029719B2 (ja) * 2014-07-31 2016-11-24 Ｄｏｗａエレクトロニクス株式会社 銀粉及びその製造方法、並びに導電性ペースト
CN104084599B (zh) * 2014-08-02 2016-03-30 天津市职业大学 一种导电银浆用超细球形银粉的生产方法
CN104096850B (zh) * 2014-08-12 2017-10-10 天津市职业大学 用对氨基苯酚还原银氨络合物制备超细球形银粉的方法
JP6096261B2 (ja) * 2014-09-29 2017-03-15 Ｄｏｗａエレクトロニクス株式会社 銀粉及びその製造方法、並びに親水性導電ペースト
CN105583407A (zh) * 2014-11-14 2016-05-18 中国振华集团云科电子有限公司 一种单分散高振实密度球形银粉的制备方法
JP5999220B2 (ja) * 2015-04-24 2016-09-28 住友金属鉱山株式会社 銀粉
JP6239067B2 (ja) * 2015-08-24 2017-11-29 Ｄｏｗａエレクトロニクス株式会社 銀粉およびその製造方法、ならびに導電性ペースト
JP6856350B2 (ja) * 2015-10-30 2021-04-07 Ｄｏｗａエレクトロニクス株式会社 銀粉およびその製造方法
US20180061536A1 (en) * 2016-08-26 2018-03-01 E I Du Pont De Nemours And Company Chip resistor
CN106251936A (zh) * 2016-09-27 2016-12-21 北京市合众创能光电技术有限公司 高导电性银浆及其制备方法
KR101930285B1 (ko) * 2016-10-31 2018-12-19 엘에스니꼬동제련 주식회사 태양전지 전극용 도전성 페이스트 및 이를 사용하여 제조된 태양전지
KR20180047528A (ko) * 2016-10-31 2018-05-10 엘에스니꼬동제련 주식회사 은 분말 및 이의 제조방법
JP7084730B2 (ja) * 2017-02-01 2022-06-15 Ｄｏｗａエレクトロニクス株式会社 銀合金粉末およびその製造方法
JP6561100B2 (ja) * 2017-10-04 2019-08-14 Ｊｘ金属株式会社 表面処理銅微粒子の製造方法
KR102061719B1 (ko) * 2017-10-30 2020-01-02 엘에스니꼬동제련 주식회사 은 분말 및 이의 제조방법
KR102122317B1 (ko) * 2017-10-31 2020-06-12 엘에스니꼬동제련 주식회사 은 분말의 제조방법 및 은 분말을 포함하는 도전성 페이스트
KR20200038742A (ko) * 2018-10-04 2020-04-14 대주전자재료 주식회사 은 분말 및 이의 제조 방법
KR102178009B1 (ko) * 2018-11-30 2020-11-12 엘에스니꼬동제련 주식회사 수축률 조절이 가능한 은 분말의 제조방법
EP4023361B1 (en) * 2019-08-26 2025-03-12 Kyocera Corporation Silver particles
CN110947953A (zh) * 2019-12-19 2020-04-03 苏州银瑞光电材料科技有限公司 用于太阳能正面银浆的高烧结活性的球形银粉的制备方法
US12296382B2 (en) 2020-03-24 2025-05-13 Dowa Electronics Materials Co., Ltd. Method for producing silver powder
CN112029430A (zh) * 2020-08-17 2020-12-04 湖南尚鑫新材料科技有限公司 一种纳米钛银杀菌膜及其制备方法
CN112371993B (zh) * 2020-10-16 2022-12-20 湖南中伟新银材料科技有限公司 一种银粉的制备方法
US12194541B2 (en) 2021-09-14 2025-01-14 Dowa Electronics Materials Co., Ltd. Method for producing silver powder
CN115519130B (zh) * 2022-08-05 2024-04-26 南通领跑者新材料科技有限公司 高分散性银粉的制备方法
CN115740482A (zh) * 2022-11-22 2023-03-07 广东先导稀材股份有限公司 一种银粉及其制备方法和导电银浆
CN115647353B (zh) * 2022-12-06 2024-05-28 武汉船用电力推进装置研究所（中国船舶重工集团公司第七一二研究所） 一种高烧结活性微米银粉的制备方法
CN116571734B (zh) * 2023-07-13 2023-09-26 深圳市哈深智材科技有限公司 一种银颗粒及其制备方法与应用
CN117282975B (zh) * 2023-09-25 2025-10-10 湖南纵骋新材料科技有限公司 用于hjt低温银浆的超细银粉及其制备方法
CN117444227B (zh) * 2023-11-02 2024-04-02 郴州市三分地环保信息科技有限公司 银粉、导电银浆及其制备方法和应用
CN118492388B (zh) * 2024-05-10 2025-08-05 南通连盛新材料科技有限公司 一种高比表面积球形银粉及其制备方法、导电浆料
CN119870488B (zh) * 2024-11-05 2025-11-18 环保金属粉末科技有限公司 一种银晶体粉末的制备方法及其应用

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US20030089199A1 (en) * 2000-09-18 2003-05-15 Kazushi Sano Copper powder for electrically conductive paste
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Also Published As

Publication number Publication date
JP2006002228A (ja) 2006-01-05
TWI351998B (en) 2011-11-11
KR20060048425A (ko) 2006-05-18
EP1609547B1 (en) 2007-09-05
DE602005002299T2 (de) 2008-05-29
KR101345441B1 (ko) 2013-12-27
CN1709619A (zh) 2005-12-21
US20050279970A1 (en) 2005-12-22
EP1609547A1 (en) 2005-12-28
TW200603923A (en) 2006-02-01
ATE372183T1 (de) 2007-09-15
DE602005002299D1 (de) 2007-10-18

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Granted publication date: 20090923