CN100528507C - 划线形成设备和划线形成方法 - Google Patents

划线形成设备和划线形成方法 Download PDF

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Publication number
CN100528507C
CN100528507C CNB2003801083232A CN200380108323A CN100528507C CN 100528507 C CN100528507 C CN 100528507C CN B2003801083232 A CNB2003801083232 A CN B2003801083232A CN 200380108323 A CN200380108323 A CN 200380108323A CN 100528507 C CN100528507 C CN 100528507C
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CN
China
Prior art keywords
scribe line
brittle substrate
vertical crack
substrate
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CNB2003801083232A
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English (en)
Chinese (zh)
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CN1735490A (zh
Inventor
若山治雄
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Publication of CN1735490A publication Critical patent/CN1735490A/zh
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/02—Other than completely through work thickness
    • Y10T83/0333—Scoring
    • Y10T83/0341—Processes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Thermal Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Liquid Crystal (AREA)
  • Laser Beam Processing (AREA)
CNB2003801083232A 2002-11-06 2003-11-04 划线形成设备和划线形成方法 Expired - Fee Related CN100528507C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002323112 2002-11-06
JP323112/2002 2002-11-06
PCT/JP2003/014080 WO2004041493A1 (ja) 2002-11-06 2003-11-04 スクライブライン形成装置及びスクライブライン形成方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN200910139536.0A Division CN101602230B (zh) 2002-11-06 2003-11-04 划线形成方法

Publications (2)

Publication Number Publication Date
CN1735490A CN1735490A (zh) 2006-02-15
CN100528507C true CN100528507C (zh) 2009-08-19

Family

ID=32310410

Family Applications (2)

Application Number Title Priority Date Filing Date
CN200910139536.0A Expired - Fee Related CN101602230B (zh) 2002-11-06 2003-11-04 划线形成方法
CNB2003801083232A Expired - Fee Related CN100528507C (zh) 2002-11-06 2003-11-04 划线形成设备和划线形成方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN200910139536.0A Expired - Fee Related CN101602230B (zh) 2002-11-06 2003-11-04 划线形成方法

Country Status (8)

Country Link
US (1) US8348115B2 (enExample)
EP (1) EP1579970A4 (enExample)
JP (2) JP4373922B2 (enExample)
KR (1) KR100657196B1 (enExample)
CN (2) CN101602230B (enExample)
AU (1) AU2003280723A1 (enExample)
TW (2) TWI290543B (enExample)
WO (1) WO2004041493A1 (enExample)

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KR101043674B1 (ko) * 2004-05-11 2011-06-23 엘지디스플레이 주식회사 스크라이빙 장치 및 방법
JP4818120B2 (ja) * 2004-10-13 2011-11-16 三星ダイヤモンド工業株式会社 脆性材料基板のスクライブ方法ならびにスクライブ装置および脆性材料基板の分断システム。
JP4890462B2 (ja) * 2005-10-28 2012-03-07 三星ダイヤモンド工業株式会社 脆性材料基板のスクライブライン形成方法およびスクライブライン形成装置
TWI457305B (zh) * 2005-12-01 2014-10-21 Mitsuboshi Diamond Ind Co Ltd And a cutter retainer mounting structure for the scribing device
KR100972488B1 (ko) * 2005-12-29 2010-07-26 엘지디스플레이 주식회사 레이저를 이용한 액정표시소자 절단장치 및 절단방법, 이를이용한 액정표시소자 제조방법
JP2007268953A (ja) * 2006-03-31 2007-10-18 Toray Eng Co Ltd 初期亀裂形成機構
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JP5235987B2 (ja) * 2007-04-30 2013-07-10 コーニング インコーポレイテッド 移動中の帯状ガラスに切断線を設ける装置、システム及び方法
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JP5414983B2 (ja) * 2007-10-19 2014-02-12 株式会社ジャパンディスプレイセントラル 液晶表示装置の製造方法、及びガラス基板切断装置
KR100848854B1 (ko) * 2008-04-21 2008-07-30 주식회사 탑 엔지니어링 취성기판의 스크라이빙 장치 및 그 방법
JP2010188427A (ja) * 2009-02-13 2010-09-02 Mimaki Engineering Co Ltd カッティングプロッタおよびそのカット方法
JP5173885B2 (ja) * 2009-02-24 2013-04-03 三星ダイヤモンド工業株式会社 スクライブ装置及びスクライブ方法
JP2010229005A (ja) * 2009-03-30 2010-10-14 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の分断方法
JP5627201B2 (ja) * 2009-06-17 2014-11-19 三星ダイヤモンド工業株式会社 脆性材料基板の割断方法
JP5478957B2 (ja) * 2009-06-30 2014-04-23 三星ダイヤモンド工業株式会社 脆性材料基板の割断方法
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CN102741179B (zh) * 2009-11-30 2015-11-25 康宁股份有限公司 用于激光刻划和分割玻璃基板的方法
US8946590B2 (en) * 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
KR101089174B1 (ko) * 2010-01-04 2011-12-02 주식회사 탑 엔지니어링 칩 전처리기를 포함하는 스크라이빙 장치 및 스크라이빙 방법
JP5249979B2 (ja) * 2010-03-18 2013-07-31 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法およびこれに用いるレーザ加工装置
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TWI715718B (zh) * 2016-02-26 2021-01-11 日商三星鑽石工業股份有限公司 脆性基板之分斷方法
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TWI734931B (zh) * 2018-09-17 2021-08-01 鴻超光電科技股份有限公司 軸調光斑方法及其系統
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CN115521056A (zh) * 2022-10-25 2022-12-27 深圳市益铂晶科技有限公司 一种玻璃激光切割的劈裂方法
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CN117417118A (zh) * 2023-09-28 2024-01-19 江苏华鸥玻璃有限公司 一种高精度玻璃切割设备及其切割方法
CN118023727B (zh) * 2024-03-23 2024-08-23 江苏晟驰微电子有限公司 一种释放划片应力的激光切割设备
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JP2001151525A (ja) * 1999-11-25 2001-06-05 Mitsuboshi Diamond Industrial Co Ltd ガラス板分割方法及び装置
JP2002308637A (ja) * 2001-04-04 2002-10-23 Sony Corp ガラス基板の製造方法およびガラス基板の製造装置

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US8348115B2 (en) 2013-01-08
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