CN100581709C - 激光切割系统及切割方法 - Google Patents
激光切割系统及切割方法 Download PDFInfo
- Publication number
- CN100581709C CN100581709C CN200610157607A CN200610157607A CN100581709C CN 100581709 C CN100581709 C CN 100581709C CN 200610157607 A CN200610157607 A CN 200610157607A CN 200610157607 A CN200610157607 A CN 200610157607A CN 100581709 C CN100581709 C CN 100581709C
- Authority
- CN
- China
- Prior art keywords
- brittle substrate
- cooling device
- carrying platform
- laser
- scoring tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/703—Cooling arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
Claims (15)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200610157607A CN100581709C (zh) | 2006-12-13 | 2006-12-13 | 激光切割系统及切割方法 |
KR1020070128411A KR20080055657A (ko) | 2006-12-13 | 2007-12-11 | 레이저 절단장치 및 절단방법 |
JP2007321342A JP2008149716A (ja) | 2006-12-13 | 2007-12-12 | レーザー切断システム及び切断方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200610157607A CN100581709C (zh) | 2006-12-13 | 2006-12-13 | 激光切割系统及切割方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101200024A CN101200024A (zh) | 2008-06-18 |
CN100581709C true CN100581709C (zh) | 2010-01-20 |
Family
ID=39515485
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200610157607A Expired - Fee Related CN100581709C (zh) | 2006-12-13 | 2006-12-13 | 激光切割系统及切割方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2008149716A (zh) |
KR (1) | KR20080055657A (zh) |
CN (1) | CN100581709C (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102294542B (zh) * | 2010-06-24 | 2014-03-12 | 深圳市大族激光科技股份有限公司 | 一种镜片的激光切割方法 |
JP5696393B2 (ja) * | 2010-08-02 | 2015-04-08 | 日本電気硝子株式会社 | ガラスフィルムの割断方法 |
CN102717194B (zh) * | 2012-07-11 | 2015-12-16 | 苏州市世嘉科技股份有限公司 | 适于切割热轧钢板的激光切割工艺 |
KR20150084758A (ko) * | 2012-11-13 | 2015-07-22 | 니폰 덴키 가라스 가부시키가이샤 | 판 유리의 제조 방법 및 제조 장치 |
CN110204187B (zh) * | 2018-02-28 | 2021-06-08 | 深圳市裕展精密科技有限公司 | 激光切割装置 |
CN108406135B (zh) * | 2018-03-21 | 2019-12-27 | 厦门大学 | 一种陶瓷基板连续化激光切割装置及其切割方法 |
KR102161721B1 (ko) * | 2018-07-13 | 2020-10-05 | (주)엔피에스 | 레이저 절단 시스템 |
CN112492753A (zh) * | 2019-09-11 | 2021-03-12 | 川宝科技股份有限公司 | 自动化的基板加工方法与加工设备 |
CN112092096B (zh) * | 2020-09-07 | 2022-04-12 | 台州星星光电科技有限公司 | 一种玻璃面板表面覆盖保护膜的切割方法 |
CN112475636A (zh) * | 2020-12-10 | 2021-03-12 | 武汉贝赛尔科技有限公司 | 一种用于工件的激光切割方法 |
-
2006
- 2006-12-13 CN CN200610157607A patent/CN100581709C/zh not_active Expired - Fee Related
-
2007
- 2007-12-11 KR KR1020070128411A patent/KR20080055657A/ko not_active Application Discontinuation
- 2007-12-12 JP JP2007321342A patent/JP2008149716A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JP2008149716A (ja) | 2008-07-03 |
KR20080055657A (ko) | 2008-06-19 |
CN101200024A (zh) | 2008-06-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 201600 Shanghai city Songjiang District industrial zone of Songjiang science and Technology Park No. 500 Wen Ji Lu Patentee after: Foxsemicon Integrated Technology (Shanghai) Inc. Patentee after: Foxsemicon Integrated Technology Inc. Address before: 201600 Shanghai city Songjiang District industrial zone of Songjiang science and Technology Park No. 500 Wen Ji Lu Patentee before: Foxsemicon Integrated Technology (Shanghai) Inc. Patentee before: Foxsemicon Integrated Technology Inc. |
|
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 201600 Shanghai city Songjiang District industrial zone of Songjiang science and Technology Park No. 500 Wen Ji Lu Patentee after: Foxsemicon Integrated Technology (Shanghai) Inc. Patentee after: Foxsemicon Integrated Technology Inc. Address before: 201600 Shanghai city Songjiang District industrial zone of Songjiang science and Technology Park No. 500 Wen Ji Lu Patentee before: Foxsemicon Integrated Technology (Shanghai) Inc. Patentee before: Foxsemicon Integrated Technology Inc. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100120 Termination date: 20211213 |
|
CF01 | Termination of patent right due to non-payment of annual fee |