Apparatus for Cutting Nonmetal
[Technical Field]
The present invention relates to an apparatus for cutting a substrate of a flat panel display
device, and more particularly, to an apparatus for cutting a glass substrate, by which the
glass substrate for fabricating such a flat panel display device as TFT-LCD, PDP, OLED
and the like can be cut quickly and stably with precision without causing a damage to the
substrate to enhance productivity and throughput.
[Background Art]
In general, in fabricating such a flat panel display device as TFT-LCD, PDP, PLED and
the like, it is necessary to cut a glass substrate to fit each module size after completion of a
boding process of a cell process.
As a glass cutting method according to a related art, there is a cutting method using a
mechanical instrument such as a diamond wheel. In this case, the mechanical instrument
occupies too large space and the corresponding process is complicated to lower productivity. As another cutting method according to a related art, there is a laser cutting method
consisting the steps of forming a primary micro-crack at a point where a scribe line starts,
heating a glass using a heating beam of CO2 laser, and then cooling down the heated portion
of the glass fast using a quencher to induce a secondary crack due to instant thermal
transformation.
In the above-explained two kinds of the cutting methods, an instrument for the laser cutting
method according to a related art is schematically explained as follows.
First of all, a laser cutter according to a related art consists of a support or table supporting a
glass substrate to be cut, an auxiliary cracker forming an auxiliary crack coinciding with a
cutting direction of the substrate, an optical heating system heating the substrate by applying
a heating beam to the substrate along a scribe line, and a quencher generating a crack by
quenching the portion heated by the optical heating system.
Glass cutting using the related art laser cutter consists of an auxiliary crack forming step
using a wheel, a heating step according to the auxiliary crack, a cutting-crack forming step
through quick-freeze using a quencher moving in the same direction to spray refrigerants
such as He, a re-irradiation step of a laser beam for scribe, and a re-quenching step.
A detailed configuration and operation of the related art laser cutter are described in Korean
Patent Application Laid-Open No. 2002-88258.
However, the above-explained related art laser cutter needs various unstable parts including
the crack generating means for generating the primary micro-crack, the laser beam generator,
the quencher and the like, whereby the system configuration of the cutter is complicated.
And, the related art laser cutting method fails in forming a straight glass cutting line that
proceeds from the primary crack, whereby throughput in productivity is lowered.
Specifically, in the heating and quick-free steps of the related art laser cutting method, a
glass cutting speed is limited to execute a cutting work at low speed, whereby productivity
becomes too low. Hence, the related art laser cutting method is not suitable for the
substantial application to the product line of the flat panel display device. [Disclosure]
[Technical Problem]
The present invention is directed to an apparatus for cutting nonmetal that substantially
obviates one or more problems due to limitations and disadvantages of the related art.
An object of the present invention is to provide an apparatus for cutting a substrate, by
which substrate damage is minimized in fabricating a display module such as TFT-LCD,
PDP, OLED and the like and by which quick and precise cutting is enabled to raise
productivity and product throughput.
[Technical Solution]
To achieve these objects and other advantages and in accordance with the purpose of the
invention, as embodied and broadly described herein, an apparatus for cutting nonmetal
according to the present invention includes a laser beam generator generating a UN short
wavelength laser beam, a torch condensing to apply the short wavelength laser beam to a
specific location on a nonmetallic substrate to be cut, and a relative movement means for
allowing the substrate and the laser beam to make a relative movement to cut the substrate.
Preferably, the laser beam generator includes a laser oscillator of an Νd-YAG medium, a
laser diode providing an exciting light source to the laser oscillator, and a wavelength
converter converting a wavelength of the laser beam generated from the laser oscillator to a
short wavelength.
More preferably, wherein the wavelength converter is a crystal.
Preferably, a wavelength of the laser beam applied via the torch lies between 200~400nm.
Preferably, a minimum frequency of the laser beam is 1 OKHz.
Preferably, a frequency of the laser beam lies between l~100KHz.
Preferably, the apparatus further includes an optical resonator making the laser beam into an
ultra short pulse by performing Q-switching on the laser beam optically to allow the laser
bean to have high energy.
Preferably, the apparatus further includes an optical system guiding a beam path of the short
wavelength laser beam generated from the laser beam generator to a portion specified for
irradiation.
It is to be understood that both the foregoing general description and the following detailed
description of the present invention are exemplary and explanatory and are intended to
provide further explanation of the invention as claimed. [Advantageous Effects] The present invention enables high-speed cutting in cutting the. substrate, thereby raising
the productivity.
And, the present invention enables the high-speed and high-precision cutting in cutting the
substrate, thereby considerably reducing the failure occurrence of the substrate.
Specifically, the present invention secures the stability in cutting the substrate despite an
increased size of the substrate and reduces the working time.
Additional advantages, objects, and features of the invention will be set forth in part in the
description which follows and in part will become apparent to those having ordinary skill in
the art upon examination of the following or may be learned from practice of the invention.
The objectives and other advantages of the invention may be realized and attained by the
structure particularly pointed out in the written description and claims hereof as well as the
appended drawings. [Best Mode]
The accompanying drawings, which are included to provide a further understanding of the
invention and are incorporated in and constitute a part of this application, illustrate
embodiment(s) of the invention and together with the description serve to explain the
principle of the invention. In the drawings: FIG. 1 is a perspective diagram of an apparatus
for cutting a substrate for fabricating a flat panel display device according to one
embodiment of the present invention; and FIG. 2 is a block diagram of a UN short
wavelength laser beam generator in FIG. 1.
Reference will now be made in detail to the preferred embodiments of the present invention,
examples of which are illustrated in the accompanying drawings. Wherever possible, the
same reference numbers will be used throughout the drawings to refer to the same or like
parts.
Referring to FIG. 1, an apparatus for cutting a substrate for fabricating a flat panel display
device according to one embodiment of the present invention includes a table 2 provided to
a central portion of a base 1 to support a glass substrate (not shown in the drawing), back-
and-forth guide columns 4 provided to both sides of the table 2, respectively, and a linear
motor & mover 5 provided to each of the back-and-forth guide column 4.
A right-to-left guide column 3 is provided to each of the movers 5 to guide a movement of a
torch 6 in right-to-left directions. And, a linear motor & mover separate from the former
linear motor & mover 5 provided on the back-and-forth guide column 4 is provided to the
right-to-left guide column 3.
A torch mount block 7 is mounted on the mover on the right-to-left guide column 3 so that
the torch 6 can be mounted on the mover. And, the torch 6, which condenses a UN short
wavelength laser beam to apply to a prescribed area of the glass substrate, is mounted on the
torch mount block 7.
And, the substrate cutting apparatus according to the present invention further includes an
optical system 11 guiding a laser, beam toward the torch 6 and a laser beam generator 10
generating the UN short wavelength layer beam.
Preferably, at least two torches 6 are provided to enhance a cutting speed. In this case, a
spectroscope is provided to an optical path of the optical system 11 guiding the laser beam
toward the torch 6 to allow the laser beam to be applied via each of the torches 6 by splitting
a beam path.
In the above-explained configuration, the substrate put on the table 2 is cut by the relative
movement of the torch(s) 6 and the UN short wavelength laser beam while staying still. Yet,
a configuration of a relative moving means for cutting the substrate by allowing the
substrate and the laser beam to make relative movements mutually is not limited to the
above-explained example.
Alternatively, unlike the former configuration, the table 2 can move back-and-forth and
right-to-left directions to perform the glass substrate cutting work while the torch(s) 6
remains still.
Meanwhile, the laser beam generator 10, as shown in FIG. 2, includes a laser oscillator of
Νd-YAG medium, a laser diode providing a exciting light source to the laser oscillator, and
a wavelength converter converting a wavelength of a laser beam generated from the laser
oscillator to a short wavelength.
The laser beam having a long wavelength coming through the Νd-YAG medium is
converted to a UN short wavelength of 200~400nm via crystal operative in wavelength
conversion.
Meanwhile, a frequency of the laser beam is at least lOKHz and is preferably 10~30KHz.
For reference, YAG corresponds to Yttrium, Aluminum and Garnet used in manufacturing
an oscillator for leaser beam generation. Νd (neodymium: atomic No. 60, atomic weight
144.2) is added to YAG to formNd-YAG.
A process of cutting a glass substrate in a flat panel display device using the above-
configured substrate cutting apparatus according to the present invention is explained as
follows.
First of all, in fabricating a display device such as TFT-LCD, PDP, PLED and the like, a
substrate cutting step is carried out after substrates have been bonded together.
The substrate includes a plurality of unit cells on a disc type glass substrate and needs to be
cut into a plurality of the unit cells.
For this, the glass substrate is loaded from outside on a mountable table 2 by a carrier robot
and the like.
The substrate put on the table 2 is horizontally fixed to by a support (not shown in the
drawing) provided to the table 2 or a multitude of vacuum holes formed at the table 2 to be
stably supported.
Subsequently, a relative disposition between the substrate and a laser beam to be applied
thereto is corrected so that the substrate fixed to the table 2 can be cut into a specific form.
In correcting the relative disposition, an image recognizer (e.g., vision camera) recognizes
to confirm a location of a correction mark formed on the substrate and the torch 6 from
which the laser beam is irradiated is relatively moved against the table 2 to correct the
relative disposition.
In the location confirmation of the laser beam, a test laser beam is applied to a dummy glass
to form a laser beam trace thereon and the laser beam trace is then grasped using the image
recognizer such as a vision camera or a location of the torch 6 from which the laser beam is
irradiated is then recognized using the image recognizer provided under the torch 6.
Meanwhile, after the relative disposition between the substrate and the laser beam has been
corrected, the substrate and the laser beam are relatively moved to cut the substrate into a
specific shape.
Namely, the laser beam generated from the laser oscillator using Nd-YAG as a medium is
provided to the torch 6 as a condensing part of the laser beam via the optical system 11 to be
applied to a predetermined location on the substrate. In doing so, the table 2 having the
substrate mounted thereon is fixed instead of being moved, whereas the torch 6 is moved.
As a result, the substrate is cut by the movement of the laser beam.
In this case, the laser beam generated from the laser oscillator uses the laser diode as a light
source. The generated laser beam changes it path via the optical system 11 including a
plurality of mirrors and the like to be provided to the torch 6 as a laser beam condensing
part. Since the torch 6 and the mirrors of the optical system 11 that send the laser beam
toward the torch 6 are moved horizontally and simultaneously, the UN short wavelength
laser beam is applied to the substrate regardless of the location variation of the torch 6.
Therefore, the substrate can be cut into a designed shape.
In this case, the wavelength of the light generated from the diode as the light source is
provided to the Nd-YAG medium to be excited by a gain medium so that the laser of
l,000nm can be oscillated. The oscillated laser is passed through the wavelength conversion
crystal to be oscillated as the short wavelength of 200~400nm.
Thus, the laser is converted to the short wavelength to use. By using the UN short
wavelength, this is to minimize the product breakage due to thermal transformation induced
by the long wavelength when the laser beam is applied to the nonmetallic substance such as
the glass substrate and the like to be cut.
Besides, to raise energy of the laser beam, Q-switching is optically performed using an
optical resonator to generate an ultra-short pulse of 1~100 nanoseconds (ns).
To raise a cutting speed, a frequency over several KHz is generated to apply the laser beam.
If so, clear cutting can be achieved even if a moving speed of the torch 6 or the table 2 is
high.
Meanwhile, in cutting the glass substrate substantially to cut the substrate into unit cells in
the back-and-forth direction, the substrate can be cut in the back-and-forth direction in a
manner that the laser beam is applied via the torch 6 while the right-to-left guide column 3
is moved in the back-and-forth direction by a guidance of the back-and-forth guide column
4 due to the action of the linear motor.
And, in cutting the glass substrate substantially to cut the substrate into unit cells in the
right-to-left direction, the substrate can be cut in the right-to-left direction in a manner that
the laser beam is applied via the torch 6 while the torch mount block 7 and the torch 6
mounted on the block 7 are moved in the right-to-left direction by a guidance of the right-to-
left guide column 3 due to the action of the linear motor provided to the right-to-left guide
column 3.
Thus, as the UN short wavelength laser beam alternately repeats the back-and-forth and
right-to-left movements so that the respective cells on the glass substrate can be separated
from each other individually and completely.
Q-switching optically performed to raise the energy of the laser beam and the optical
resonator applied to Q-switching are explained for reference in the following.
First of all, a gain of a laser medium in a normal oscillation mode corresponds to a value
barely exceeding a loss including an output drive-out component. In doing so, by increasing
an inversion distribution quantity to exceed a threshold, it is able to obtain a more powerful
laser beam.
Specifically, a loss of the optical resonator is raised to increase the inversion distribution
quantity to exceed an oscillation threshold. Namely, a Q value is lowered.
Thus, after the Q value has been artificially lowered, if the Q value is raised when the
inversion distribution quantity has a predetermined high value, a gain coefficient becomes
much higher than the oscillation threshold to bring about the oscillation of the powerful
laser beam. Such a technique is called Q-switching.
Meanwhile, in the optical resonator, since it is unable to make an efficient laser beam with
the amplification of beam by induction discharge, parallel mirrors enabling beam resonance
are used.
If the induction discharge occurs while the inversion distribution continues and if the beam
is fed back to a laser medium section by the reflective mirrors, the beam is amplified. If a
time for the beam to go and return between a pair of the mirrors becomes a multiple of an
integer, a standing wave is generated to abruptly increase the induction discharge. And, the
optical resonator has such a configuration to generate the laser beam. [Industrial Applicability]
The present invention enables high-speed cutting in cutting the substrate, thereby raising
the productivity.
And, the present invention enables the high-speed and high-precision cutting in cutting the
substrate, thereby considerably reducing the failure occurrence of the substrate.
Specifically, the present invention secures the stability in cutting the substrate despite an
increased size of the substrate and reduces the working time.