CN102515494B - 一种玻璃基板切割装置 - Google Patents
一种玻璃基板切割装置 Download PDFInfo
- Publication number
- CN102515494B CN102515494B CN201110400362.6A CN201110400362A CN102515494B CN 102515494 B CN102515494 B CN 102515494B CN 201110400362 A CN201110400362 A CN 201110400362A CN 102515494 B CN102515494 B CN 102515494B
- Authority
- CN
- China
- Prior art keywords
- cutting unit
- laser beam
- cutting
- emitting device
- beam emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 106
- 239000011521 glass Substances 0.000 title claims abstract description 71
- 239000000758 substrate Substances 0.000 title claims abstract description 65
- 238000000034 method Methods 0.000 title claims description 21
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 25
- 239000010432 diamond Substances 0.000 claims abstract description 25
- 230000008878 coupling Effects 0.000 claims description 8
- 238000010168 coupling process Methods 0.000 claims description 8
- 238000005859 coupling reaction Methods 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 2
- 230000003245 working effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
- C03B33/076—Laminated glass comprising interlayers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
Claims (1)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110400362.6A CN102515494B (zh) | 2011-12-05 | 2011-12-05 | 一种玻璃基板切割装置 |
US13/380,858 US20130140291A1 (en) | 2011-12-05 | 2011-12-14 | Glass Substrate Slicing Apparatus and Method |
PCT/CN2011/084010 WO2013082830A1 (zh) | 2011-12-05 | 2011-12-14 | 一种玻璃基板切割装置和方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110400362.6A CN102515494B (zh) | 2011-12-05 | 2011-12-05 | 一种玻璃基板切割装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102515494A CN102515494A (zh) | 2012-06-27 |
CN102515494B true CN102515494B (zh) | 2014-04-09 |
Family
ID=46286643
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110400362.6A Expired - Fee Related CN102515494B (zh) | 2011-12-05 | 2011-12-05 | 一种玻璃基板切割装置 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN102515494B (zh) |
WO (1) | WO2013082830A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104591531A (zh) * | 2015-01-20 | 2015-05-06 | 信利半导体有限公司 | 一种切割工艺 |
CN109794984A (zh) * | 2018-12-26 | 2019-05-24 | 惠科股份有限公司 | 切割机构、切割方法及显示面板 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015117172A1 (de) * | 2014-02-10 | 2015-08-13 | Lisec Austria Gmbh | Verfahren zum teilen von verbundglas |
JP2016069223A (ja) * | 2014-09-30 | 2016-05-09 | 三星ダイヤモンド工業株式会社 | ブレイク方法並びにブレイク装置 |
JP2016069222A (ja) * | 2014-09-30 | 2016-05-09 | 三星ダイヤモンド工業株式会社 | ブレイク方法並びにブレイク装置 |
CN105110622A (zh) * | 2015-08-31 | 2015-12-02 | 苏州凯锝微电子有限公司 | 一种基于激光引切的玻璃切割设备 |
CN105110619A (zh) * | 2015-08-31 | 2015-12-02 | 苏州凯锝微电子有限公司 | 一种基于激光引切的玻璃切割机 |
CN105084748A (zh) * | 2015-08-31 | 2015-11-25 | 苏州凯锝微电子有限公司 | 一种基于激光引切的玻璃切割装置 |
CN105665950B (zh) * | 2016-01-09 | 2017-10-13 | 长春理工大学 | 激光原位辅助透明金刚石压头印压成孔装置及方法 |
CN105798470B (zh) * | 2016-05-27 | 2017-09-29 | 京东方科技集团股份有限公司 | 一种激光切割机及其切割方法 |
CN108059335B (zh) * | 2018-01-04 | 2021-01-26 | 京东方科技集团股份有限公司 | 切割方法 |
CN109407362B (zh) * | 2018-11-26 | 2020-06-30 | 深圳市华星光电半导体显示技术有限公司 | 基板切割装置及基板切割方法 |
CN110047784B (zh) * | 2019-04-19 | 2024-05-28 | 湖南新锐微电子科技有限公司 | 一种半导体切割用激光裂片装置及其裂片方法 |
CN110466071B (zh) * | 2019-09-17 | 2020-04-03 | 杭州中禄新材料有限公司 | 一种高性能建筑玻璃的生产工艺 |
CN113800758B (zh) * | 2020-06-12 | 2023-06-13 | 深圳市大族半导体装备科技有限公司 | 一种玻璃模组的激光切割方法及激光切割装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1735490A (zh) * | 2002-11-06 | 2006-02-15 | 三星钻石工业股份有限公司 | 划线形成设备和划线形成方法 |
CN101296787A (zh) * | 2005-10-28 | 2008-10-29 | 三星钻石工业股份有限公司 | 脆性材料基板的划线形成方法及划线形成装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI409122B (zh) * | 2007-07-13 | 2013-09-21 | Mitsuboshi Diamond Ind Co Ltd | A method for processing a brittle material substrate and a crack forming apparatus for the method |
US8051679B2 (en) * | 2008-09-29 | 2011-11-08 | Corning Incorporated | Laser separation of glass sheets |
KR101404250B1 (ko) * | 2008-12-16 | 2014-06-09 | 가부시키가이샤 레미 | 취성 재료의 분할 장치 및 할단 방법 |
KR101041137B1 (ko) * | 2009-03-25 | 2011-06-13 | 삼성모바일디스플레이주식회사 | 기판 절단 장치 및 이를 이용한 기판 절단 방법 |
CN102030468B (zh) * | 2009-09-30 | 2013-05-08 | 富士迈半导体精密工业(上海)有限公司 | 激光切割装置及激光切割方法 |
JP5249979B2 (ja) * | 2010-03-18 | 2013-07-31 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の加工方法およびこれに用いるレーザ加工装置 |
-
2011
- 2011-12-05 CN CN201110400362.6A patent/CN102515494B/zh not_active Expired - Fee Related
- 2011-12-14 WO PCT/CN2011/084010 patent/WO2013082830A1/zh active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1735490A (zh) * | 2002-11-06 | 2006-02-15 | 三星钻石工业股份有限公司 | 划线形成设备和划线形成方法 |
CN101296787A (zh) * | 2005-10-28 | 2008-10-29 | 三星钻石工业股份有限公司 | 脆性材料基板的划线形成方法及划线形成装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104591531A (zh) * | 2015-01-20 | 2015-05-06 | 信利半导体有限公司 | 一种切割工艺 |
CN109794984A (zh) * | 2018-12-26 | 2019-05-24 | 惠科股份有限公司 | 切割机构、切割方法及显示面板 |
Also Published As
Publication number | Publication date |
---|---|
CN102515494A (zh) | 2012-06-27 |
WO2013082830A1 (zh) | 2013-06-13 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Cutting device and method of glass substrate Effective date of registration: 20190426 Granted publication date: 20140409 Pledgee: Bank of Beijing Limited by Share Ltd. Shenzhen branch Pledgor: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY Co.,Ltd. Registration number: 2019440020032 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20201016 Granted publication date: 20140409 Pledgee: Bank of Beijing Limited by Share Ltd. Shenzhen branch Pledgor: Shenzhen China Star Optoelectronics Technology Co.,Ltd. Registration number: 2019440020032 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140409 |