WO2013082830A1 - 一种玻璃基板切割装置和方法 - Google Patents

一种玻璃基板切割装置和方法 Download PDF

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Publication number
WO2013082830A1
WO2013082830A1 PCT/CN2011/084010 CN2011084010W WO2013082830A1 WO 2013082830 A1 WO2013082830 A1 WO 2013082830A1 CN 2011084010 W CN2011084010 W CN 2011084010W WO 2013082830 A1 WO2013082830 A1 WO 2013082830A1
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Prior art keywords
cutting
glass substrate
microgroove
laser
cutting device
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PCT/CN2011/084010
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English (en)
French (fr)
Inventor
庄益壮
蔡荣茂
廖学士
文松贤
邓明峰
Original Assignee
深圳市华星光电技术有限公司
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Application filed by 深圳市华星光电技术有限公司 filed Critical 深圳市华星光电技术有限公司
Priority to US13/380,858 priority Critical patent/US20130140291A1/en
Publication of WO2013082830A1 publication Critical patent/WO2013082830A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/076—Laminated glass comprising interlayers

Definitions

  • Embodiments of the present invention relate to the field of liquid crystal panels, and in particular, to a glass substrate cutting apparatus and method.
  • the main structure of the liquid crystal display panel is an array substrate and a color film substrate.
  • the liquid crystal is sandwiched between the two, and the array substrate provides a gate line for scanning signals, a signal line for data signals, and a pixel electrode.
  • the manufacturing process of the liquid crystal display panel mainly includes an array process of the array substrate and the color filter substrate, a box forming process of dropping the array substrate and the color filter substrate into the liquid crystal, and a subsequent module process.
  • a liquid crystal display panel having a plurality of cells on the glass substrate after the box is formed, and the liquid crystal display panels of the plurality of cells are separated by a cutting and splitting process.
  • FIG. 1 is a schematic structural view of a prior art glass substrate cutting device for cutting a glass substrate
  • FIG. 2 is a prior art glass substrate cutting device on a glass substrate surface.
  • the glass substrate cutting device 10 includes a cutter wheel 101 and a fixing device 102 for fixing the cutter wheel.
  • the cutter wheel 102 of the glass substrate cutting device 10 cuts the glass substrate along the cutting route, and the position where the cutter wheel 102 contacts the glass substrate becomes one. Damage zone 103, horizontal crack 104 and vertical crack 105.
  • the vertical crack 105 is a necessary condition for the subsequent splitting process, but the horizontal crack 104 is not required to be generated, and due to the generation of the horizontal crack 104, excess glass debris may appear, and the glass debris may adhere to the surface of the glass substrate and the glass.
  • the glass surface and the line On the circuit of the terminal area of the substrate, the glass surface and the line may be scratched or contaminated in the subsequent process, which affects the quality of the product.
  • the raised glass debris will also pollute the environment of the dust-free work shop.
  • the cutter wheel cuts the surface of the glass substrate, it will cause certain wear to the cutter wheel. When the cutter wheel is cut to a certain distance, the life of the cutter wheel will also end, and the cutter wheel needs to be replaced.
  • the technical problem to be solved by the present invention is to provide a glass substrate cutting apparatus and method which can effectively improve the accuracy of cutting a glass substrate.
  • the technical solution adopted by the embodiment of the present invention to solve the technical problem is to provide a glass substrate cutting device, comprising: a first laser emitting device, the first laser emitting device emitting a laser beam on the surface of the glass substrate to be cut, in the glass substrate The surface forms a microgroove; a first cutting device is used to cut the glass substrate at the position of the microgroove.
  • the first laser emitting device and the first cutting device are oppositely arranged along the cutting movement direction.
  • the movable connection of the connecting device holds the first laser emitting device and the first cutting device, so that the relative positions of the first laser device and the first cutting device can be adjusted and corrected.
  • the method further includes a cooling device for cooling the microgroove.
  • the combination of the second laser device and the second cutting device is disposed opposite to the combination of the first laser device and the first cutting device, so that the cutting device can simultaneously double-layer The glass substrate is cut.
  • the first cutting device comprises a cutter wheel fixing device and a diamond cutter wheel fixed thereon.
  • the present invention also provides a glass substrate cutting method comprising the steps of: forming a microgroove on a surface of a glass substrate along a pre-cut position; cutting at a microgroove position; and forming a plurality of cells of the liquid crystal display panel.
  • the step of forming the microgrooves is formed by using a laser device to emit a laser beam on the surface of the glass.
  • the step of cutting at the microgroove position is to use a diamond cutter wheel to cut at a position where the microgroove is left.
  • the diamond cutter wheel is embedded in the micro slot for cutting.
  • the method further comprises the step of cooling the microgroove.
  • the operation of forming microgrooves, dicing, and lobes on the double-layer glass substrate is simultaneously performed.
  • a laser beam is emitted by a laser emitting device to form a microgroove on the surface of the glass substrate, so that the diamond cutter wheel is cut at the position of the microgroove, thereby increasing the friction between the diamond cutter wheel and the glass substrate.
  • the force prevents the diamond cutter wheel from slipping during cutting, improves the cutting precision, reduces the horizontal crack and the glass debris generated after cutting, prevents the glass debris from scratching the glass substrate line, improves the quality of the product, and reduces the quality. Glass debris is contaminated by a dust-free workplace.
  • the wear of the diamond cutter wheel and the glass substrate can be reduced, the service life of the diamond cutter wheel can be prolonged, and the production cost can be reduced.
  • FIG. 1 is a schematic structural view of a glass substrate cutting device of the prior art cutting a glass substrate
  • FIG. 2 is a schematic structural view showing a crack of a glass substrate cutting device of the prior art on a surface of a glass substrate;
  • FIG. 3 is a schematic structural view of a glass substrate according to a first embodiment of the glass substrate cutting device of the present invention
  • FIG. 4 is a schematic structural view showing a micro-groove formed on a surface of a glass substrate by a laser emitting device according to a first embodiment of the glass substrate cutting device of the present invention
  • FIG. 5 is a schematic structural view showing a crack of a surface of a glass substrate in a cutting device according to a first embodiment of the glass substrate cutting device of the present invention
  • FIG. 6 is a schematic structural view of a cutting device for cutting a glass substrate according to a second embodiment of the glass substrate of the present invention.
  • Figure 7 is a flow chart showing a preferred embodiment of a glass substrate cutting method of the present invention.
  • the glass substrate cutting device of the first embodiment of the present invention includes a first laser emitting device 20, a first cutting device 30 and a connecting device 40, a first laser emitting device 20 and a first cutting device.
  • the connecting device 40 is connected to hold the first laser emitting device 20 and the first cutting device 30, and the connecting device 40 can be fixed between the first laser emitting device 20 and the first cutting device 30,
  • the movable connection also holds the first laser emitting device 20 and the first cutting device 30 such that the relative positions of the first laser device 20 and the first cutting device 30 can be adjusted and corrected.
  • the first laser emitting device 20 may include a cooling device (not shown) that emits a laser beam along the surface of the glass substrate 50 to be cut along a predetermined cutting position to form a microgroove on the surface of the glass substrate 50. 501. Then, the cooling device cools the microgroove 501, and the microgroove 501 is cooled and then proceeds to the next step.
  • a cooling device (not shown) that emits a laser beam along the surface of the glass substrate 50 to be cut along a predetermined cutting position to form a microgroove on the surface of the glass substrate 50. 501. Then, the cooling device cools the microgroove 501, and the microgroove 501 is cooled and then proceeds to the next step.
  • the first cutting device 30 includes a cutter wheel fixture 301 and a diamond cutter wheel 302 held thereon.
  • the diamond cutter wheel 302 is cut at a position where the microgroove 501 is left, and the diamond cutter wheel 302 is embedded in the microgroove. 501 performs cutting. Since the surface of the glass substrate 50 has the microgrooves 501, when the diamond cutter wheel 302 is embedded in the microgrooves 501 to cut the glass substrate 50, vertical cracks 502 are formed on the surface of the glass substrate 50, and then according to the formed vertical cracks 502.
  • the glass substrate 50 is subjected to a splitting treatment.
  • the glass substrate cutting device further includes a second laser emitting device 60, a second cutting device 70, and a second, based on the structure of the first embodiment.
  • the combination of the laser device 60 and the second cutting device 70 is disposed opposite the combination of the first laser device 20 and the first cutting device 30 such that the cutting device can simultaneously cut the double-glazed substrate.
  • the second laser device 60 and the second cutting device 70 are matched and connected by a second connecting device (not labeled) and are disposed opposite to each other in the cutting moving direction.
  • the second connecting device is connected to hold the second laser emitting device 60.
  • a second cutting device 70, and the connecting device can be fixed between the second laser emitting device 60 and the second cutting device 70, and can also be movably connected to hold the second laser emitting device 60 and the second cutting device 70, The relative position of the second laser device 60 and the second cutting device 70 can be adjusted and corrected.
  • the second cutting device 70 includes a cutter wheel fixture and a diamond cutter wheel retained thereon. Further, the second laser emitting device 60 can include a second cooling device (not shown). A cooling process for forming a microgroove on the surface of the glass substrate to be cut by the second laser emitting device 60.
  • a double-glazed substrate (not shown) is provided between the oppositely disposed combination of the first laser device 20 and the first cutting device 30 and the combination of the second laser device 60 and the second cutting device 70,
  • the upper and lower opposing first laser device 30 and second laser device 60 respectively emit laser beams on opposite surfaces of the double-glazed substrate to form microgrooves along a predetermined cutting direction, the upper and lower opposing first cutting devices 30 and second cutting
  • the diamond cutter wheel of the device 70 is cut along the position of the microgroove on the opposite surface of the double-glazed substrate, and the diamond cutter wheel can be inserted into the microgroove for cutting to form a vertical crack, and finally the splitting process is performed.
  • FIG. 7 is a flow chart of a preferred embodiment of a glass substrate cutting method according to the present invention.
  • Step S11 forming micro-grooves on the surface of the glass substrate along the pre-cut position
  • Step S12 cutting at the position of the microgroove
  • step S13 the lobes form a plurality of unit liquid crystal display panels.
  • the step of forming the microgroove is formed by using a laser device to emit a laser beam on the surface of the glass, and after forming the microgroove, the microgroove is cooled.
  • the step of cutting at the microgroove position is to use a diamond cutter wheel to cut at a position where the microgroove is left, and the diamond cutter wheel is embedded in the microgroove for cutting.
  • the operation of forming the microgrooves, the dicing, and the lobes on the double-layer glass substrate is simultaneously performed.
  • a laser beam is emitted in advance by using a laser emitting device to form a micro-groove on the surface of the glass substrate, so that the position of the diamond cutter wheel in the micro-groove can be embedded in the micro-groove for cutting, thereby increasing
  • the friction between the diamond cutter wheel and the glass substrate prevents the diamond cutter wheel from slipping during cutting, improves the cutting accuracy, reduces horizontal cracks and glass debris generated after cutting, and prevents the glass debris from scratching the glass substrate circuit. Improve the quality of the product, but also reduce the pollution of glass debris to the dust-free work room.
  • the wear of the diamond cutter wheel and the glass substrate can be reduced, the service life of the diamond cutter wheel can be prolonged, and the production cost can be reduced.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)

Abstract

一种玻璃基板切割装置和方法。玻璃基板切割装置包括激光发射装置（20，60）和切割装置（30，70）。激光发射装置（20，60）发射激光束于待切割的玻璃基板（50）表面，以在玻璃基板（50）表面形成微槽（501）。切割装置（30，70）用于嵌入微槽（501）位置对玻璃基板（50）进行切割，包括一刀轮固定装置（301）和固持于其上的金刚石刀轮（302）。该玻璃基板切割装置和方法可以增加刀轮与玻璃基板之间的摩擦力，防止在切割时金刚石刀轮产生滑动，提高切割的精确度。

Description

一种玻璃基板切割装置和方法
【技术领域】
本发明实施例涉及液晶面板领域，特别涉及一种玻璃基板切割装置和方法。
【背景技术】
目前，TFT（Thin Film Transistor：薄膜晶体管）液晶显示面板主要结构为阵列基板和彩膜基板将液晶夹设在两者之间成盒在一起，阵列基板提供扫描信号的栅线、数据信号的信号线以及像素电极。液晶显示面板的制造过程主要包括阵列基板和彩膜基板的阵列工艺、将阵列基板与彩膜基板对盒并滴入液晶的成盒工艺以及后续的模组工艺。在成盒后的玻璃基板上有多个单元的液晶显示面板，通过切割和裂片工艺将多个单元的液晶显示面板进行分离。
现有的切割技术中，请一并参阅图1和图2，图1是现有技术的玻璃基板切割装置切割玻璃基板的结构示意图，图2是现有技术的玻璃基板切割装置在玻璃基板表面产生裂痕的结构示意图。玻璃基板切割装置10包括刀轮101和固定刀轮的固定装置102，玻璃基板切割装置10的刀轮102沿着切割路线对玻璃基板进行切割，刀轮102与玻璃基板接触的位置会行成一个损伤区域103、水平裂痕104和垂直裂痕105。其中垂直裂痕105为后续裂片工艺的必须条件，但水平裂痕104是不需要产生的，且因水平裂痕104的产生，还会出现多余的玻璃碎屑，玻璃碎屑会附着在玻璃基板表面和玻璃基板端子区的线路上，在后续工艺中会对玻璃表面和线路造成刮伤或污染，影响产品的品质。同时扬起的玻璃碎屑还会对无尘工作车间的环境造成污染。另一方面，刀轮在对玻璃基板表面进行切割时，会对刀轮造成一定的磨损，在刀轮切割到一定的距离时，刀轮的寿命也将结束，需要重新更换刀轮。
【发明内容】
本发明解决的技术问题是提供一种可以有效提高切割玻璃基板的精确度的玻璃基板切割装置和方法。
本发明实施例为解决技术问题而采用的技术方案是提供一种玻璃基板切割装置，包括：第一激光发射装置，第一激光发射装置发射激光束于待切割的玻璃基板表面，以在玻璃基板表面形成微槽；第一切割装置，用于于微槽位置对玻璃基板进行切割。
其中，第一激光发射装置和第一切割装置沿切割移动方向相对设置。
其中，进一步包括一连接装置，连接固持第一激光发射装置和第一切割装置。
其中，连接装置可活动的连接固持第一激光发射装置和第一切割装置，以使得第一激光装置和第一切割装置的相对位置可以进行调整修正。
其中，进一步包括一冷却装置，对微槽进行冷却处理。
其中，进一步包括一第二激光装置和第二切割装置，第二激光装置和第二切割装置的组合与第一激光装置和第一切割装置的组合相对设置，以使得切割装置可同时对双层玻璃基板进行切割。
其中，第一切割装置包括一刀轮固定装置和固持于其上的金刚石刀轮。
本发明还提供一种玻璃基板切割方法，包括步骤：沿着预切割的位置在玻璃基板表面形成微槽；于微槽位置进行切割；裂片形成多个单元的液晶显示面板。
其中，形成微槽的步骤是利用激光装置发射激光束于玻璃表面而形成。
其中，于微槽位置进行切割的步骤是利用金刚石刀轮在留下微槽的位置进行切割。
其中，金刚石刀轮是嵌入微槽进行切割。
其中，进一步包括步骤，对微槽进行冷却处理。
其中，同时对双层玻璃基板进行形成微槽、切割以及裂片的作业。
本发明的玻璃基板切割装置和方法中，利用激光发射装置发射激光束形成玻璃基板表面微槽，使金刚石刀轮在微槽的位置进行切割，因而可以增加金刚石刀轮与玻璃基板之间的摩擦力，防止在切割时金刚石刀轮产生滑动，提高切割的精确度、减少水平裂痕和切割后产生的玻璃碎屑，避免玻璃碎屑刮伤玻璃基板线路，提高了产品的质量，同时也降低了玻璃碎屑对无尘工作间的污染。并且，可以减少金刚石刀轮与玻璃基板的磨损，延长金刚石刀轮的使用寿命，降低了生产的成本。
【附图说明】
图1是现有技术的玻璃基板切割装置切割玻璃基板的结构示意图；
图2是现有技术的玻璃基板切割装置在玻璃基板表面产生裂痕的结构示意图；
图3是本发明玻璃基板切割装置的第一实施方式切割玻璃基板的结构示意图；
图4是本发明玻璃基板切割装置的第一实施方式激光发射装置在玻璃基板表面形成微槽的结构示意图；
图5是本发明玻璃基板切割装置的第一实施方式切割装置在玻璃基板表面产生裂痕的结构示意图；
图6是本发明玻璃基板的第二实施方式切割装置切割玻璃基板的结构示意图；及
图7是本发明一种玻璃基板切割方法较佳实施例的流程图。
【具体实施方式】
请一并参阅图3至图5，本发明第一实施例的玻璃基板切割装置包括第一激光发射装置20、第一切割装置30及连接装置40，第一激光发射装置20和第一切割装置30沿切割移动方向相对设置，连接装置40连接固持第一激光发射装置20和第一切割装置30，并且该连接装置40可固定于该第一激光发射装置20、第一切割装置30之间，也可活动的连接固持该第一激光发射装置20和第一切割装置30，以使得第一激光装置20和第一切割装置30的相对位置可以进行调整修正。
第一激光发射装置20可以包括一冷却装置（图未示），第一激光发射装置20沿着预定切割的位置发射激光束于待切割的玻璃基板50表面，以在玻璃基板50表面形成微槽501，然后冷却装置对微槽501进行冷却处理，微槽501冷却处理后进行下一步骤。
第一切割装置30包括一刀轮固定装置301和固持于其上的金刚石刀轮302，进行切割作业时，金刚石刀轮302在留下微槽501的位置进行切割，并且金刚石刀轮302是嵌入微槽501进行切割，由于玻璃基板50表面具有微槽501的原因，金刚石刀轮302嵌入微槽501对玻璃基板50进行切割时，会在玻璃基板50表面形成垂直裂痕502，然后根据形成的垂直裂痕502对玻璃基板50进行裂片处理。
请再参阅图6，作为本发明的另一种实施方式，玻璃基板切割装置在如上述第一实施方式的结构基础之上，还包括第二激光发射装置60、第二切割装置70，第二激光装置60和第二切割装置70的组合与第一激光装置20和第一切割装置30的组合相对设置，以使得切割装置可同时对双层玻璃基板进行切割。
该第二激光装置60和第二切割装置70之间通过一第二连接装置（未标示）进行匹配连接，且沿切割移动方向相对设置，该第二连接装置连接固持该第二激光发射装置60和第二切割装置70，并且该连接装置可固定于该第二激光发射装置60、第二切割装置70之间，也可活动的连接固持该第二激光发射装置60和第二切割装置70，以使得该第二激光装置60和第二切割装置70的相对位置可以进行调整修正。
与该第一切割装置30类似，该第二切割装置70包括一刀轮固定装置和固持于其上的金刚石刀轮。进一步的，该第二激光发射装置60可以包括一第二冷却装置（图未示）。用于对第二激光发射装置60于待切割的玻璃基板表面形成微槽后的冷却处理。
进行切割作业时，同时配备双层玻璃基板（未标示）于相对设置的第一激光装置20与第一切割装置30的组合和第二激光装置60与第二切割装置70的组合之间，该上下相对的第一激光装置30和第二激光装置60分别发射激光束于双层玻璃基板的相对表面，形成沿预设切割方向的微槽，该上下相对的第一切割装置30和第二切割装置70的金刚石刀轮沿着双层玻璃基板相对表面上的微槽位置进行切割，并且金刚石刀轮可以嵌入微槽进行切割，形成垂直裂痕，最后进行裂片处理。
请继续参阅图7，图7是本发明一种玻璃基板切割方法较佳实施例的流程图。
步骤S11，沿着预切割的位置在玻璃基板表面形成微槽；
步骤S12，于微槽位置进行切割；
步骤S13，裂片形成多个单元的液晶显示面板。
其中，形成微槽的步骤是利用激光装置发射激光束于玻璃表面而形成，在形成微槽后，对微槽进行冷却处理。于微槽位置进行切割的步骤是利用金刚石刀轮在留下微槽的位置进行切割，而且金刚石刀轮是嵌入微槽进行切割。
作为本发明的另一种实施方式，同时对双层玻璃基板进行形成微槽、切割以及裂片的作业。
综上所述，本发明的玻璃基板切割装置和方法中，预先利用激光发射装置发射激光束形成玻璃基板表面微槽，使金刚石刀轮在微槽的位置可以嵌入微槽进行切割，因而可以增加金刚石刀轮与玻璃基板之间的摩擦力，防止在切割时金刚石刀轮产生滑动，提高切割的精确度、减少水平裂痕和切割后产生的玻璃碎屑，避免玻璃碎屑刮伤玻璃基板线路，提高了产品的质量，同时也降低了玻璃碎屑对无尘工作间的污染。并且，可以减少金刚石刀轮与玻璃基板的磨损，延长金刚石刀轮的使用寿命，降低了生产的成本。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其它相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (13)

  1. 一种玻璃基板切割装置，其特征在于包括：
    第一激光发射装置，所述第一激光发射装置发射激光束于待切割的玻璃基板表面，以在玻璃基板表面形成微槽；
    第一切割装置，用于于所述微槽位置对所述玻璃基板进行切割。
  2. 根据权利要求1所述的切割装置，其特征在于：所述第一激光发射装置和所述第一切割装置沿切割移动方向相对设置。
  3. 根据权利要求2所述的切割装置，其特征在于：进一步包括一连接装置，连接固持所述第一激光发射装置和所述第一切割装置。
  4. 根据权利要求3所述的切割装置，其特征在于：所述连接装置可活动的连接固持所述第一激光发射装置和所述第一切割装置，以使得所述第一激光装置和所述第一切割装置的相对位置可以进行调整修正。
  5. 根据权利要求1所述的切割装置，其特征在于：进一步包括一冷却装置，对所述微槽进行冷却处理。
  6. 根据权利要求1所述的切割装置，其特征在于：进一步包括一第二激光装置和第二切割装置，所述第二激光装置和第二切割装置的组合与所述第一激光装置和第一切割装置的组合相对设置，以使得所述切割装置可同时对双层玻璃基板进行切割。
  7. 根据权利要求1所述的切割装置，其特征在于：所述第一切割装置包括一刀轮固定装置和固持于其上的金刚石刀轮。
  8. 一种玻璃基板切割方法，其特征在于包括步骤：
    沿着预切割的位置在玻璃基板表面形成微槽；
    于所述微槽位置进行切割；
    裂片形成多个单元的液晶显示面板。
  9. 根据权利要求8所述的方法，其特征在于：所述形成微槽的步骤是利用激光装置发射激光束于玻璃表面而形成。
  10. 根据权利要求7所述的方法，其特征在于：所述于所述微槽位置进行切割的步骤是利用金刚石刀轮在留下微槽的位置进行切割。
  11. 根据权利要求10所述的方法，其特征在于：所述金刚石刀轮是嵌入所述微槽进行切割。
  12. 根据权利要求8所述的方法，其特征在于：进一步包括步骤，对所述微槽进行冷却处理。
  13. 根据权利要求8所述的方法，其特征在于：同时对双层所述玻璃基板进行所述形成微槽、所述切割以及所述裂片的作业。
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