EP1579970A4 - Scribe line forming device and scribe line forming method - Google Patents
Scribe line forming device and scribe line forming methodInfo
- Publication number
- EP1579970A4 EP1579970A4 EP03770142A EP03770142A EP1579970A4 EP 1579970 A4 EP1579970 A4 EP 1579970A4 EP 03770142 A EP03770142 A EP 03770142A EP 03770142 A EP03770142 A EP 03770142A EP 1579970 A4 EP1579970 A4 EP 1579970A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- scribe line
- produced
- material substrate
- line forming
- fragile material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 5
- 239000000463 material Substances 0.000 abstract 4
- 239000011521 glass Substances 0.000 abstract 3
- 239000002826 coolant Substances 0.000 abstract 1
- 238000001816 cooling Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
- C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/027—Scoring tool holders; Driving mechanisms therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/10—Methods
- Y10T225/12—With preliminary weakening
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/30—Breaking or tearing apparatus
- Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
- Y10T225/321—Preliminary weakener
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/02—Other than completely through work thickness
- Y10T83/0333—Scoring
- Y10T83/0341—Processes
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Liquid Crystal (AREA)
- Laser Beam Processing (AREA)
Abstract
A scribe line forming method, wherein the wheel tip (5a) of a glass cutter (5) is moved in contact with the surface of a fragile material substrate (S) with a load of such a degree that does not give a damage to the surface of the fragile material substrate (S), a vertical crack is produced on the fragile material substrate (S) at a specified position by an armature (6) which gives a sharp impact force to produce the vertical crack of a specified depth to the glass cutter (5) moving on the fragile substrate (S), and the vertical crack formed by the wheel tip (5a) of the glass cutter (5) is extended along a predicted scribe line by a stress gradient produced by a compressive stress produced in a radiated area where laser beam is radiated from a laser beam transmitter (8) on the fragile material substrate (S) to the vertical cracks and a tensile stress produced in a cooled area which is produced by a cooling medium jetted from a cooling nozzle (7) to form a scribe line.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002323112 | 2002-11-06 | ||
JP2002323112 | 2002-11-06 | ||
PCT/JP2003/014080 WO2004041493A1 (en) | 2002-11-06 | 2003-11-04 | Scribe line forming device and scribe line forming method |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1579970A1 EP1579970A1 (en) | 2005-09-28 |
EP1579970A4 true EP1579970A4 (en) | 2006-09-20 |
Family
ID=32310410
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP03770142A Withdrawn EP1579970A4 (en) | 2002-11-06 | 2003-11-04 | Scribe line forming device and scribe line forming method |
Country Status (8)
Country | Link |
---|---|
US (1) | US8348115B2 (en) |
EP (1) | EP1579970A4 (en) |
JP (2) | JP4373922B2 (en) |
KR (1) | KR100657196B1 (en) |
CN (2) | CN100528507C (en) |
AU (1) | AU2003280723A1 (en) |
TW (2) | TW200415128A (en) |
WO (1) | WO2004041493A1 (en) |
Families Citing this family (59)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101043674B1 (en) * | 2004-05-11 | 2011-06-23 | 엘지디스플레이 주식회사 | Apparatus and method for scribing |
US20090050610A1 (en) * | 2004-10-13 | 2009-02-26 | Mitsuboshi Diamond Industrial Co., Ltd. | Method and apparatus for scribing brittle material board and system for breaking brittle material board |
CN101296787B (en) * | 2005-10-28 | 2012-02-15 | 三星钻石工业股份有限公司 | Method of forming scribe line on substrate of brittle material and scribe line forming apparatus |
KR100992449B1 (en) * | 2005-12-01 | 2010-11-05 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | Tip holder installation |
KR100972488B1 (en) * | 2005-12-29 | 2010-07-26 | 엘지디스플레이 주식회사 | Apparatus and method of cutting liquid crystal display device and method of fabricating liquid crystal display device using thereof |
JP2007268953A (en) * | 2006-03-31 | 2007-10-18 | Toray Eng Co Ltd | Initial crack forming mechanism |
JPWO2008126502A1 (en) * | 2007-03-30 | 2010-07-22 | Thk株式会社 | Scribing apparatus and scribing method |
WO2008133800A1 (en) * | 2007-04-30 | 2008-11-06 | Corning Incorporated | Apparatus, system, and method for scoring a moving glass ribbon |
TW200911442A (en) * | 2007-09-11 | 2009-03-16 | Nat Applied Res Laboratories | Machining method and apparatus for brittle material |
JP5414983B2 (en) * | 2007-10-19 | 2014-02-12 | 株式会社ジャパンディスプレイセントラル | Manufacturing method of liquid crystal display device and glass substrate cutting device |
KR100848854B1 (en) * | 2008-04-21 | 2008-07-30 | 주식회사 탑 엔지니어링 | Scribing apparatus of fragile substrate and method thereof |
JP2010188427A (en) * | 2009-02-13 | 2010-09-02 | Mimaki Engineering Co Ltd | Cutting plotter and method of cut-plotting |
JP5173885B2 (en) * | 2009-02-24 | 2013-04-03 | 三星ダイヤモンド工業株式会社 | Scribing apparatus and scribing method |
JP2010229005A (en) * | 2009-03-30 | 2010-10-14 | Mitsuboshi Diamond Industrial Co Ltd | Method for dividing brittle material substrate |
JP5627201B2 (en) * | 2009-06-17 | 2014-11-19 | 三星ダイヤモンド工業株式会社 | Cleaving method of brittle material substrate |
JP5478957B2 (en) * | 2009-06-30 | 2014-04-23 | 三星ダイヤモンド工業株式会社 | Cleaving method of brittle material substrate |
WO2011002089A1 (en) * | 2009-07-03 | 2011-01-06 | 旭硝子株式会社 | Cutting method and cutting device for brittle material substrate, and vehicle window glass obtained by the cutting method |
US8932510B2 (en) * | 2009-08-28 | 2015-01-13 | Corning Incorporated | Methods for laser cutting glass substrates |
TWI580652B (en) * | 2009-11-30 | 2017-05-01 | 康寧公司 | Methods of forming intersecting scribe vents in strengthened glass substrate comprising compressive surface layer and inner tension layer |
US8946590B2 (en) * | 2009-11-30 | 2015-02-03 | Corning Incorporated | Methods for laser scribing and separating glass substrates |
KR101089174B1 (en) * | 2010-01-04 | 2011-12-02 | 주식회사 탑 엔지니어링 | A scribing apparatus including chip pre-processing unit, and the scribing method |
JP5249979B2 (en) * | 2010-03-18 | 2013-07-31 | 三星ダイヤモンド工業株式会社 | Method of processing brittle material substrate and laser processing apparatus used therefor |
TWI494284B (en) * | 2010-03-19 | 2015-08-01 | Corning Inc | Mechanical scoring and separation of strengthened glass |
US8864005B2 (en) | 2010-07-16 | 2014-10-21 | Corning Incorporated | Methods for scribing and separating strengthened glass substrates |
TWI513670B (en) * | 2010-08-31 | 2015-12-21 | Corning Inc | Methods of separating strengthened glass substrates |
KR20150021575A (en) * | 2011-01-07 | 2015-03-02 | 반도키코 가부시키가이샤 | Method and apparatus for scribing silicon carbide board |
JP5686291B2 (en) * | 2011-03-04 | 2015-03-18 | 旭硝子株式会社 | Rectangular plate-like material cutting device and manufacturing method |
JP5878623B2 (en) * | 2011-04-14 | 2016-03-08 | コーニング インコーポレイテッド | Method for mechanically forming crack initiation scratches on a thin glass substrate |
CN102515494B (en) * | 2011-12-05 | 2014-04-09 | 深圳市华星光电技术有限公司 | Cutting device and method of glass substrate |
US20130140291A1 (en) * | 2011-12-05 | 2013-06-06 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Glass Substrate Slicing Apparatus and Method |
US10351460B2 (en) | 2012-05-22 | 2019-07-16 | Corning Incorporated | Methods of separating strengthened glass sheets by mechanical scribing |
US9938180B2 (en) | 2012-06-05 | 2018-04-10 | Corning Incorporated | Methods of cutting glass using a laser |
KR102048921B1 (en) | 2012-06-20 | 2019-11-27 | 삼성디스플레이 주식회사 | Cell cutting device and Cell cutting method |
DE102012210527A1 (en) * | 2012-06-21 | 2013-12-24 | Robert Bosch Gmbh | Method of making a diode and diode |
JP2014004776A (en) * | 2012-06-26 | 2014-01-16 | Mitsuboshi Diamond Industrial Co Ltd | Processing device of substrate |
JPWO2014010488A1 (en) | 2012-07-10 | 2016-06-23 | 旭硝子株式会社 | Glass plate processing method |
US9610653B2 (en) | 2012-09-21 | 2017-04-04 | Electro Scientific Industries, Inc. | Method and apparatus for separation of workpieces and articles produced thereby |
US9212081B2 (en) * | 2012-11-21 | 2015-12-15 | Corning Incorporated | Methods of cutting a laminate strengthened glass substrate |
JP2015063020A (en) * | 2013-09-24 | 2015-04-09 | 三星ダイヤモンド工業株式会社 | Scribe head, scribe device and scribe method |
TWI651182B (en) * | 2014-06-26 | 2019-02-21 | 日商三星鑽石工業股份有限公司 | Method for cutting brittle substrate and scribing device |
CN104148811A (en) * | 2014-07-30 | 2014-11-19 | 苏州市华宁机械制造有限公司 | Laser cutting machine with long service life |
CN104148812A (en) * | 2014-07-30 | 2014-11-19 | 苏州市华宁机械制造有限公司 | Laser cutting machine |
JP6526200B2 (en) * | 2014-12-18 | 2019-06-05 | サン−ゴバン グラス フランスSaint−Gobain Glass France | Method of manufacturing multi-layered board provided with functional coating treated with corrosion protection |
CN104708726B (en) * | 2015-04-02 | 2016-08-24 | 沈阳华夏光微电子装备有限责任公司 | A kind of real-time monitoring tool temperature and the scribing machine of wear intensity and control method |
TW202039193A (en) * | 2016-02-26 | 2020-11-01 | 日商三星鑽石工業股份有限公司 | Method of dividing brittle substrate |
WO2017204055A1 (en) * | 2016-05-25 | 2017-11-30 | 三星ダイヤモンド工業株式会社 | Brittle substrate cutting method |
CN106938884B (en) * | 2017-04-19 | 2019-04-26 | 重庆坤秀门窗有限公司 | A kind of glass cutting machine for glass door cutting |
JP2018183838A (en) * | 2017-04-26 | 2018-11-22 | 川崎重工業株式会社 | Brittle material fragmentation device and brittle material fragmentation method |
US11131611B2 (en) | 2017-09-07 | 2021-09-28 | Corning Incorporated | Impact testing apparatus and methods |
JP2019147225A (en) * | 2018-02-27 | 2019-09-05 | 三星ダイヤモンド工業株式会社 | Cutter wheel and cutting method |
CN108818983A (en) * | 2018-06-12 | 2018-11-16 | 华中科技大学 | The micro- laser assisted system of processing and its application method of optics hard brittle material |
CN109204985B (en) * | 2018-08-27 | 2021-09-17 | 奕瑞影像科技(太仓)有限公司 | Packaging film removing device and method |
TWI734931B (en) * | 2018-09-17 | 2021-08-01 | 鴻超光電科技股份有限公司 | Axis dimming spot method and system |
CN109227972B (en) * | 2018-10-12 | 2020-09-29 | 台州来智科技有限公司 | Stone natural surface processing tool |
CN110405959B (en) * | 2019-08-10 | 2021-07-23 | 连云港奥林匹亚石材有限公司 | Stone material trimming mechanism |
TWI787933B (en) * | 2021-08-02 | 2022-12-21 | 錼創顯示科技股份有限公司 | Mass transfer equipment |
CN113594308A (en) * | 2021-08-02 | 2021-11-02 | 錼创显示科技股份有限公司 | Mass transfer apparatus |
CN114454240B (en) * | 2022-04-11 | 2022-06-17 | 中国空气动力研究与发展中心高速空气动力研究所 | Scribing device and scribing method for shock tube diaphragm |
CN115521056A (en) * | 2022-10-25 | 2022-12-27 | 深圳市益铂晶科技有限公司 | Splitting method for glass laser cutting |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1036773A2 (en) * | 1999-03-18 | 2000-09-20 | Thk Co. Ltd. | Scribing method and apparatus |
US6252197B1 (en) * | 1998-12-01 | 2001-06-26 | Accudyne Display And Semiconductor Systems, Inc. | Method and apparatus for separating non-metallic substrates utilizing a supplemental mechanical force applicator |
JP2002121039A (en) * | 2000-08-11 | 2002-04-23 | Mitsuboshi Diamond Industrial Co Ltd | Cutter for cutting brittle material, scriber using the same and scribing method |
US20020125232A1 (en) * | 1998-08-26 | 2002-09-12 | Choo Dae-Ho | Laser cutting apparatus and method |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3276302A (en) * | 1963-04-15 | 1966-10-04 | Saint Gobain Corp | Glass cutter |
JPS6048102B2 (en) | 1980-12-25 | 1985-10-25 | 富士通株式会社 | scribing equipment |
JPH08175837A (en) * | 1994-12-26 | 1996-07-09 | Asahi Glass Co Ltd | Method for dividing plate glass and device therefor |
JPH08231239A (en) * | 1994-12-27 | 1996-09-10 | Asahi Glass Co Ltd | Method for cutting glass ribbon and device therefor |
JPH10189496A (en) | 1996-12-24 | 1998-07-21 | Toshiba Corp | Method and machine for cutting wafer |
JP2000063137A (en) | 1998-08-10 | 2000-02-29 | Toyota Motor Corp | Method for cutting plate glass and apparatus therefor |
JP2000061676A (en) | 1998-08-19 | 2000-02-29 | Asahi Glass Co Ltd | Method and device for splitting glass plate |
EP1074517B1 (en) * | 1999-08-06 | 2005-12-14 | THK Co., Ltd. | Scribing apparatus |
JP2001058317A (en) | 1999-08-20 | 2001-03-06 | Berudekkusu:Kk | Method and apparatus for scribing |
DE19952331C1 (en) | 1999-10-29 | 2001-08-30 | Schott Spezialglas Gmbh | Method and device for quickly cutting a workpiece from brittle material using laser beams |
CN1413136A (en) * | 1999-11-24 | 2003-04-23 | 应用光子学公司 | Method and apparatus for separating non-metallic materials |
JP4390937B2 (en) * | 1999-11-25 | 2009-12-24 | 三星ダイヤモンド工業株式会社 | Glass plate dividing method and apparatus |
JP2001176820A (en) | 1999-12-15 | 2001-06-29 | Hitachi Cable Ltd | Method for machining substrate and machining device thereof |
KR100673073B1 (en) * | 2000-10-21 | 2007-01-22 | 삼성전자주식회사 | Method and Apparatus for cutting non-metal substrate using a laser beam |
JP4631196B2 (en) * | 2001-04-04 | 2011-02-16 | ソニー株式会社 | Glass substrate manufacturing method and glass substrate manufacturing apparatus |
JP2003025323A (en) * | 2001-07-18 | 2003-01-29 | Seiko Epson Corp | Method and device for laser cutting, method for cutting electro-optical panel |
-
2003
- 2003-11-04 JP JP2004549606A patent/JP4373922B2/en not_active Expired - Fee Related
- 2003-11-04 AU AU2003280723A patent/AU2003280723A1/en not_active Abandoned
- 2003-11-04 KR KR1020057008097A patent/KR100657196B1/en not_active IP Right Cessation
- 2003-11-04 WO PCT/JP2003/014080 patent/WO2004041493A1/en active Application Filing
- 2003-11-04 US US10/533,650 patent/US8348115B2/en not_active Expired - Fee Related
- 2003-11-04 EP EP03770142A patent/EP1579970A4/en not_active Withdrawn
- 2003-11-04 CN CNB2003801083232A patent/CN100528507C/en not_active Expired - Fee Related
- 2003-11-04 CN CN200910139536.0A patent/CN101602230B/en not_active Expired - Fee Related
- 2003-11-06 TW TW920131047A patent/TW200415128A/zh unknown
- 2003-11-06 TW TW92131047A patent/TWI290543B/en not_active IP Right Cessation
-
2009
- 2009-07-10 JP JP2009163271A patent/JP2009274951A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020125232A1 (en) * | 1998-08-26 | 2002-09-12 | Choo Dae-Ho | Laser cutting apparatus and method |
US6252197B1 (en) * | 1998-12-01 | 2001-06-26 | Accudyne Display And Semiconductor Systems, Inc. | Method and apparatus for separating non-metallic substrates utilizing a supplemental mechanical force applicator |
EP1036773A2 (en) * | 1999-03-18 | 2000-09-20 | Thk Co. Ltd. | Scribing method and apparatus |
JP2002121039A (en) * | 2000-08-11 | 2002-04-23 | Mitsuboshi Diamond Industrial Co Ltd | Cutter for cutting brittle material, scriber using the same and scribing method |
Non-Patent Citations (2)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 2002, no. 08 5 August 2002 (2002-08-05) * |
See also references of WO2004041493A1 * |
Also Published As
Publication number | Publication date |
---|---|
CN101602230B (en) | 2015-06-10 |
JP2009274951A (en) | 2009-11-26 |
US8348115B2 (en) | 2013-01-08 |
US20060137505A1 (en) | 2006-06-29 |
CN100528507C (en) | 2009-08-19 |
CN1735490A (en) | 2006-02-15 |
JP4373922B2 (en) | 2009-11-25 |
TWI290543B (en) | 2007-12-01 |
KR100657196B1 (en) | 2006-12-14 |
WO2004041493A1 (en) | 2004-05-21 |
KR20050084974A (en) | 2005-08-29 |
TW200415128A (en) | 2004-08-16 |
AU2003280723A1 (en) | 2004-06-07 |
EP1579970A1 (en) | 2005-09-28 |
CN101602230A (en) | 2009-12-16 |
JPWO2004041493A1 (en) | 2006-03-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1579970A4 (en) | Scribe line forming device and scribe line forming method | |
KR101804585B1 (en) | Methods for laser scribing and breaking thin glass | |
CN101462822B (en) | Friable non-metal workpiece with through hole and method of processing the same | |
US6700639B2 (en) | Liquid crystal display apparatus and production method | |
JP5194076B2 (en) | Laser cleaving device | |
US20110095062A1 (en) | Breaking apparatus and breaking method | |
JP5325209B2 (en) | Processing method of brittle material substrate | |
KR101165985B1 (en) | Method for dividing brittle material substrate | |
JP5314674B2 (en) | Processing method of brittle material substrate | |
JP2010232603A (en) | Substrate fixing device | |
US20040251290A1 (en) | Cutting method for brittle non-metallic materials (two variants) | |
WO2001085387A1 (en) | System for cutting brittle materials | |
Tsai et al. | Laser cutting with controlled fracture and pre-bending applied to LCD glass separation | |
JP2012061681A (en) | Laser cleaving apparatus | |
JP2005212364A (en) | Fracturing system of brittle material and method thereof | |
WO2003013816A1 (en) | Method and device for scribing brittle material substrate | |
CN102229466A (en) | Method and device for performing nano-second laser cutting on glass | |
JP5171186B2 (en) | Brittle material substrate cleaving apparatus and cleaving method | |
JP5590642B2 (en) | Scribing apparatus and scribing method | |
KR100845391B1 (en) | Cutting method for brittle non-metallic materialstwo variants | |
US20160318790A1 (en) | Method and system for scribing heat processed transparent materials | |
CN101530951A (en) | Brittle substrate and laser cutting method therefor | |
JP5443851B2 (en) | Scribing method and scribing apparatus for thin glass substrate | |
KR100371011B1 (en) | Cutting method of non-metal material and cutting apparatus | |
JP5444158B2 (en) | Cleaving method of brittle material substrate |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20050506 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR |
|
AX | Request for extension of the european patent |
Extension state: AL LT LV MK |
|
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20060818 |
|
17Q | First examination report despatched |
Effective date: 20070511 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20100601 |