CN100500303C - 狭缝涂布机的预备排出装置 - Google Patents

狭缝涂布机的预备排出装置 Download PDF

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Publication number
CN100500303C
CN100500303C CNB2005100817899A CN200510081789A CN100500303C CN 100500303 C CN100500303 C CN 100500303C CN B2005100817899 A CNB2005100817899 A CN B2005100817899A CN 200510081789 A CN200510081789 A CN 200510081789A CN 100500303 C CN100500303 C CN 100500303C
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CN
China
Prior art keywords
nozzle
new liquid
filling roller
leaching
circulation fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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CNB2005100817899A
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English (en)
Chinese (zh)
Other versions
CN1701860A (zh
Inventor
山口和伸
高濑真治
谷本恒夫
福留主计
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ameco Technology Co ltd
Process Equipment Business Division Preparation Co ltd
Tazmo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Tazmo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd, Tazmo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of CN1701860A publication Critical patent/CN1701860A/zh
Application granted granted Critical
Publication of CN100500303C publication Critical patent/CN100500303C/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Coating Apparatus (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning In General (AREA)
CNB2005100817899A 2004-05-20 2005-05-20 狭缝涂布机的预备排出装置 Active CN100500303C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004150983A JP4429073B2 (ja) 2004-05-20 2004-05-20 スリットコータの予備吐出装置
JP150983/04 2004-05-20

Publications (2)

Publication Number Publication Date
CN1701860A CN1701860A (zh) 2005-11-30
CN100500303C true CN100500303C (zh) 2009-06-17

Family

ID=35484333

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005100817899A Active CN100500303C (zh) 2004-05-20 2005-05-20 狭缝涂布机的预备排出装置

Country Status (4)

Country Link
JP (1) JP4429073B2 (ja)
KR (1) KR101099007B1 (ja)
CN (1) CN100500303C (ja)
TW (1) TWI335840B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108144779A (zh) * 2018-03-01 2018-06-12 深圳市华星光电技术有限公司 喷嘴清理装置及涂布机

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4624915B2 (ja) * 2005-12-06 2011-02-02 東京エレクトロン株式会社 回転ロールの洗浄機構及び回転ロールの洗浄方法
JP4762872B2 (ja) * 2005-12-26 2011-08-31 東京エレクトロン株式会社 回転ロールの汚れ除去機構
KR101300361B1 (ko) * 2005-12-26 2013-08-28 도쿄엘렉트론가부시키가이샤 회전 롤의 오염 제거 기구
KR101206776B1 (ko) * 2006-06-09 2012-11-30 주식회사 케이씨텍 기판 코팅 장치의 프라이밍 롤러 세정 유닛 및 세정 방법과 상기 세정 유닛을 포함하는 기판 코팅 장치
JP2008049226A (ja) * 2006-08-22 2008-03-06 Tokyo Ohka Kogyo Co Ltd 予備吐出装置
WO2008081507A1 (ja) * 2006-12-27 2008-07-10 Hirata Corporation 塗布装置及び塗布方法
KR200456618Y1 (ko) 2007-05-07 2011-11-09 주식회사 케이씨텍 슬릿 코터용 예비토출장치
JP4857193B2 (ja) * 2007-05-28 2012-01-18 大日本スクリーン製造株式会社 ノズル洗浄装置
JP5301120B2 (ja) * 2007-07-03 2013-09-25 東京応化工業株式会社 洗浄装置、洗浄方法、予備吐出装置、及び塗布装置
JP5144976B2 (ja) * 2007-07-03 2013-02-13 東京応化工業株式会社 洗浄装置、洗浄方法、予備吐出装置、及び塗布装置
JP5337357B2 (ja) * 2007-07-06 2013-11-06 東京応化工業株式会社 塗布装置
KR100877798B1 (ko) * 2007-10-22 2009-01-12 주식회사 디엠에스 예비 약액처리수단을 구비한 슬릿코터
KR200460400Y1 (ko) * 2007-12-28 2012-05-24 주식회사 케이씨텍 슬릿코터의 예비토출장치
KR100989927B1 (ko) 2008-07-09 2010-10-26 (주)티에스티아이테크 롤의 세정장치
JP5383262B2 (ja) * 2009-03-11 2014-01-08 パナソニック株式会社 スリットコータ予備吐出装置
JP5154510B2 (ja) * 2009-06-05 2013-02-27 東京エレクトロン株式会社 プライミング処理方法及びプライミング処理装置
JP5121778B2 (ja) * 2009-06-26 2013-01-16 東京エレクトロン株式会社 プライミング処理方法及びプライミング処理装置
JP5197829B2 (ja) * 2011-11-01 2013-05-15 東京エレクトロン株式会社 プライミング処理方法及びプライミング処理装置
CN102962229A (zh) * 2012-08-03 2013-03-13 北京京东方光电科技有限公司 一种涂布喷嘴清洗装置
JP2014208329A (ja) * 2013-03-29 2014-11-06 株式会社リコー カーテン塗布装置及びカーテン塗布方法
JP6577290B2 (ja) * 2015-08-20 2019-09-18 トヨタ自動車九州株式会社 粘性材料回収装置
CN105170417A (zh) * 2015-08-26 2015-12-23 京东方科技集团股份有限公司 一种涂布机及涂布方法
CN107321538A (zh) * 2017-08-16 2017-11-07 深圳市泰达机器人有限公司 一种喷漆设备喷嘴自动清洗装置
CN109013217A (zh) * 2018-09-30 2018-12-18 中山市华盛家具制造有限公司 用于节约板料底漆使用的循环供漆系统
CN111804518B (zh) * 2020-07-24 2022-05-27 南京湶膜科技有限公司 一种膜元件涂胶装置
CN112108420B (zh) * 2020-09-14 2022-04-08 广西丹泉酒业有限公司 一种白酒生产线

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108144779A (zh) * 2018-03-01 2018-06-12 深圳市华星光电技术有限公司 喷嘴清理装置及涂布机
CN108144779B (zh) * 2018-03-01 2021-03-02 Tcl华星光电技术有限公司 喷嘴清理装置及涂布机

Also Published As

Publication number Publication date
TWI335840B (en) 2011-01-11
JP4429073B2 (ja) 2010-03-10
KR101099007B1 (ko) 2011-12-28
JP2005329340A (ja) 2005-12-02
CN1701860A (zh) 2005-11-30
TW200605964A (en) 2006-02-16
KR20060047990A (ko) 2006-05-18

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C06 Publication
PB01 Publication
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SE01 Entry into force of request for substantive examination
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GR01 Patent grant
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TR01 Transfer of patent right

Effective date of registration: 20230627

Address after: Kanagawa, Japan

Patentee after: Process Equipment Business Division Preparation Co.,Ltd.

Patentee after: TAZMO CO.,LTD.

Address before: Kawasaki, Japan

Patentee before: TOKYO OHKA KOGYO CO.,LTD.

Patentee before: TAZMO CO.,LTD.

Effective date of registration: 20230627

Address after: Ibaraki

Patentee after: Ameco Technology Co.,Ltd.

Patentee after: TAZMO CO.,LTD.

Address before: Kanagawa, Japan

Patentee before: Process Equipment Business Division Preparation Co.,Ltd.

Patentee before: TAZMO CO.,LTD.