CN100426451C - 剥离装置和剥离方法 - Google Patents

剥离装置和剥离方法 Download PDF

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Publication number
CN100426451C
CN100426451C CNB2005100056046A CN200510005604A CN100426451C CN 100426451 C CN100426451 C CN 100426451C CN B2005100056046 A CNB2005100056046 A CN B2005100056046A CN 200510005604 A CN200510005604 A CN 200510005604A CN 100426451 C CN100426451 C CN 100426451C
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CN
China
Prior art keywords
peeling
sheet material
wafer
chip
absorber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2005100056046A
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English (en)
Chinese (zh)
Other versions
CN1645564A (zh
Inventor
黑泽哲也
大塚昌久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japanese Businessman Panjaya Co ltd
Lintec Corp
Kioxia Corp
Original Assignee
Toshiba Corp
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Lintec Corp filed Critical Toshiba Corp
Publication of CN1645564A publication Critical patent/CN1645564A/zh
Application granted granted Critical
Publication of CN100426451C publication Critical patent/CN100426451C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/934—Apparatus having delaminating means adapted for delaminating a specified article
    • Y10S156/941—Means for delaminating semiconductive product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/976—Temporary protective layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1126—Using direct fluid current against work during delaminating
    • Y10T156/1137—Using air blast directly against work during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y10T156/1179—Gripping and pulling work apart during delaminating with poking during delaminating [e.g., jabbing, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
CNB2005100056046A 2004-01-23 2005-01-21 剥离装置和剥离方法 Expired - Fee Related CN100426451C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004015912A JP4538242B2 (ja) 2004-01-23 2004-01-23 剥離装置及び剥離方法
JP2004015912 2004-01-23
JP2004-015912 2004-01-23

Publications (2)

Publication Number Publication Date
CN1645564A CN1645564A (zh) 2005-07-27
CN100426451C true CN100426451C (zh) 2008-10-15

Family

ID=34879024

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005100056046A Expired - Fee Related CN100426451C (zh) 2004-01-23 2005-01-21 剥离装置和剥离方法

Country Status (3)

Country Link
US (1) US7172673B2 (enExample)
JP (1) JP4538242B2 (enExample)
CN (1) CN100426451C (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI782203B (zh) * 2018-04-26 2022-11-01 日商迪思科股份有限公司 膠膜剝離裝置

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SG116533A1 (en) * 2003-03-26 2005-11-28 Toshiba Kk Semiconductor manufacturing apparatus and method of manufacturing semiconductor device.
JP4494753B2 (ja) * 2003-10-27 2010-06-30 リンテック株式会社 シート剥離装置及び剥離方法
JP2006100728A (ja) * 2004-09-30 2006-04-13 Nitto Denko Corp 保護テープ剥離方法およびこれを用いた装置
JP4326519B2 (ja) * 2005-03-31 2009-09-09 日東電工株式会社 保護テープ剥離方法およびこれを用いた装置
JP4953764B2 (ja) * 2005-11-29 2012-06-13 株式会社東京精密 剥離テープ貼付方法および剥離テープ貼付装置
US7828926B1 (en) * 2006-04-04 2010-11-09 Radiation Monitoring Devices, Inc. Selective removal of resin coatings and related methods
JP4666514B2 (ja) * 2006-07-20 2011-04-06 リンテック株式会社 シート剥離装置及び剥離方法
JP5117709B2 (ja) * 2006-12-04 2013-01-16 リンテック株式会社 紫外線照射装置及び紫外線照射方法
US20080305580A1 (en) * 2007-06-07 2008-12-11 Berger Alexander J Bonding of structures together including, but not limited to, bonding a semiconductor wafer to a carrier
US20080302480A1 (en) * 2007-06-07 2008-12-11 Berger Michael A Method and apparatus for using tapes to remove materials from substrate surfaces
SG148884A1 (en) * 2007-06-15 2009-01-29 Micron Technology Inc Method and system for removing tape from substrates
JP4964107B2 (ja) * 2007-12-03 2012-06-27 東京応化工業株式会社 剥離装置
DE102008000461B3 (de) 2008-02-29 2009-07-30 Foliotec Gmbh Verfahren und Vorrichtung zum Abziehen einer Folie von einem plattenartigen Trägern oder einer Folie
JP5113621B2 (ja) * 2008-05-14 2013-01-09 リンテック株式会社 シート剥離装置及び剥離方法
JP5113646B2 (ja) * 2008-07-04 2013-01-09 リンテック株式会社 シート貼付装置及び貼付方法
JP4933495B2 (ja) * 2008-07-04 2012-05-16 リンテック株式会社 シート剥離装置及び剥離方法
JP5038263B2 (ja) * 2008-08-28 2012-10-03 リンテック株式会社 シート剥離装置及び剥離方法
JP4740298B2 (ja) * 2008-09-04 2011-08-03 リンテック株式会社 シート剥離装置及び剥離方法
JP4397429B1 (ja) * 2009-03-05 2010-01-13 株式会社新川 半導体ダイのピックアップ装置及びピックアップ方法
JP5368226B2 (ja) * 2009-09-16 2013-12-18 リンテック株式会社 シート剥離装置及び剥離方法
JP5449937B2 (ja) * 2009-09-16 2014-03-19 リンテック株式会社 シート剥離装置及び剥離方法
JP2011116486A (ja) * 2009-12-02 2011-06-16 Sharp Corp フィルム剥離装置
RU2554191C2 (ru) * 2010-02-22 2015-06-27 Пирелли Тайр С.П.А. Способ и устройство для разматывания удлиненного элемента, снабженного двумя техническими тканями, для сборки шин для колес транспортных средств
JP5381821B2 (ja) * 2010-03-10 2014-01-08 三菱電機株式会社 保護テープ剥離方法および保護テープ剥離装置
JP5477645B2 (ja) * 2010-04-20 2014-04-23 三菱電機株式会社 半導体基板の製造方法および半導体製造装置
JP2013168488A (ja) * 2012-02-15 2013-08-29 Disco Abrasive Syst Ltd 保護テープ剥離装置
JP5687647B2 (ja) * 2012-03-14 2015-03-18 株式会社東芝 半導体装置の製造方法、半導体製造装置
JP5937404B2 (ja) * 2012-04-04 2016-06-22 日東電工株式会社 保護テープ剥離方法および保護テープ剥離装置
US12065347B2 (en) 2012-05-03 2024-08-20 Vanrx Pharmasystems Inc. Cover removal system for use in controlled environment enclosures
ES2643052T3 (es) 2012-05-03 2017-11-21 Vanrx Pharmasystems Inc. Sistema de retirada de cubierta para uso en recintos de entorno controlado
US12157595B2 (en) 2012-05-03 2024-12-03 Vanrx Pharmasystems Inc. Cover removal system for use in controlled environment enclosures
KR102069851B1 (ko) * 2013-03-26 2020-01-28 삼성디스플레이 주식회사 디라미네이션 장치 및 이를 포함하는 인라인 열전사 시스템
TWI545019B (zh) * 2013-10-28 2016-08-11 鴻海精密工業股份有限公司 撕膜機構
JP6349195B2 (ja) * 2014-08-07 2018-06-27 リンテック株式会社 シート剥離装置および剥離方法
EP3026697B1 (de) * 2014-11-28 2020-10-14 Mechatronic Systemtechnik GmbH Schweißvorrichtung zum Anschweißen einer Folie an einem Substrat
JP6216750B2 (ja) * 2015-08-31 2017-10-18 リンテック株式会社 シート剥離装置および剥離方法
TWI685905B (zh) * 2017-07-12 2020-02-21 日商新川股份有限公司 接合裝置和接合方法
CN109592147B (zh) * 2017-09-30 2024-02-20 深圳市宇道机电技术有限公司 一种矩阵式剥料机构
JP7320932B2 (ja) * 2017-11-10 2023-08-04 芝浦メカトロニクス株式会社 成膜装置及び部品剥離装置
WO2019177337A1 (ko) * 2018-03-12 2019-09-19 (주)큐엠씨 발광다이오드 칩을 전사하는 전사 장치 및 방법
CN110962436A (zh) * 2018-09-30 2020-04-07 东宸精密有限公司 晶圆撕膜机
US11981473B2 (en) * 2020-09-27 2024-05-14 V Anrx Pharmasystems Inc. Cover removal system for use in controlled environment enclosures
US11889742B2 (en) * 2020-11-04 2024-01-30 Samsung Display Co., Ltd. Apparatus of manufacturing display device and method of manufacturing display device
US11505457B2 (en) * 2021-04-16 2022-11-22 Xintec Inc. Semiconductor removing apparatus and operation method thereof
JP2023059151A (ja) * 2021-10-14 2023-04-26 株式会社東京精密 ワーク加工装置
KR102608719B1 (ko) * 2021-12-31 2023-12-04 세메스 주식회사 패키지 처리 시스템 및 방법
CN117283279B (zh) * 2023-11-27 2024-01-23 中电科风华信息装备股份有限公司 灯光片膜片预剥离机械手
CN119786411B (zh) * 2024-12-31 2025-11-21 广东博测达科技股份有限公司 一种晶圆芯片的全自动剥离设备

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US4732642A (en) * 1984-04-10 1988-03-22 Nitto Electric Industrial Co., Ltd. Apparatus for peeling protective film off a thin article
CN1224238A (zh) * 1998-01-21 1999-07-28 琳得科株式会社 粘合片材
JP2000315697A (ja) * 1999-03-03 2000-11-14 Hitachi Ltd 半導体素子の分離方法およびその装置並びに半導体素子の搭載方法
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI782203B (zh) * 2018-04-26 2022-11-01 日商迪思科股份有限公司 膠膜剝離裝置

Also Published As

Publication number Publication date
US20050205204A1 (en) 2005-09-22
US7172673B2 (en) 2007-02-06
CN1645564A (zh) 2005-07-27
JP2005209942A (ja) 2005-08-04
JP4538242B2 (ja) 2010-09-08

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Granted publication date: 20081015