CN100399560C - 集成电路结构及其形成方法 - Google Patents

集成电路结构及其形成方法 Download PDF

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Publication number
CN100399560C
CN100399560C CNB2005100684327A CN200510068432A CN100399560C CN 100399560 C CN100399560 C CN 100399560C CN B2005100684327 A CNB2005100684327 A CN B2005100684327A CN 200510068432 A CN200510068432 A CN 200510068432A CN 100399560 C CN100399560 C CN 100399560C
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carrier
compressible
connector
integrated circuit
lead
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Expired - Fee Related
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CNB2005100684327A
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Chinese (zh)
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CN1738042A (zh
Inventor
威廉·E·伯尼尔
郑天人
玛丽·S·科尔
戴维·E·艾什塔德
姆科塔·G·法卢克
约翰·A·菲茨西蒙斯
路易斯·S·古德曼
约翰·U·克尼克尔伯克
塔沙·E·洛佩斯
戴维·J·威尔士
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Ultratech Corp
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International Business Machines Corp
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
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    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
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    • H01L2224/812—Applying energy for connecting
    • H01L2224/8121—Applying energy for connecting using a reflow oven
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    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H01L2224/81815—Reflow soldering
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
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    • H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
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    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
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    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
CNB2005100684327A 2004-08-20 2005-04-29 集成电路结构及其形成方法 Expired - Fee Related CN100399560C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/711,076 US7332821B2 (en) 2004-08-20 2004-08-20 Compressible films surrounding solder connectors
US10/711,076 2004-08-20

Publications (2)

Publication Number Publication Date
CN1738042A CN1738042A (zh) 2006-02-22
CN100399560C true CN100399560C (zh) 2008-07-02

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US (2) US7332821B2 (enExample)
JP (1) JP4686300B2 (enExample)
CN (1) CN100399560C (enExample)
TW (1) TWI346518B (enExample)

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US9082780B2 (en) * 2012-03-23 2015-07-14 Stats Chippac, Ltd. Semiconductor device and method of forming a robust fan-out package including vertical interconnects and mechanical support layer
US20140291834A1 (en) * 2013-03-27 2014-10-02 Micron Technology, Inc. Semiconductor devices and packages including conductive underfill material and related methods
US9711474B2 (en) * 2014-09-24 2017-07-18 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor package structure with polymeric layer and manufacturing method thereof
WO2016064350A1 (en) * 2014-10-23 2016-04-28 Agency For Science, Technology And Research Method of bonding a first substrate and a second substrate
KR102458034B1 (ko) 2015-10-16 2022-10-25 삼성전자주식회사 반도체 패키지, 반도체 패키지의 제조방법, 및 반도체 모듈
US10597486B2 (en) 2016-11-02 2020-03-24 Seagate Technology Llc Encapsulant composition for use with electrical components in hard disk drives, and related electrical components and hard disk drives
US10163847B2 (en) * 2017-03-03 2018-12-25 Tdk Corporation Method for producing semiconductor package
CN108538726B (zh) * 2017-03-03 2022-08-26 Tdk株式会社 半导体芯片的制造方法
US11304303B2 (en) * 2020-04-30 2022-04-12 Dujud Llc Methods and processes for forming electrical circuitries on three-dimensional geometries

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US7566649B2 (en) 2009-07-28
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US20060040567A1 (en) 2006-02-23
US20080009101A1 (en) 2008-01-10

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