CN100392846C - 包合薄板状基材之集成电路配置 - Google Patents

包合薄板状基材之集成电路配置 Download PDF

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Publication number
CN100392846C
CN100392846C CNB028049780A CN02804978A CN100392846C CN 100392846 C CN100392846 C CN 100392846C CN B028049780 A CNB028049780 A CN B028049780A CN 02804978 A CN02804978 A CN 02804978A CN 100392846 C CN100392846 C CN 100392846C
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CN
China
Prior art keywords
substrate
integrated circuit
circuit arrangement
planar
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB028049780A
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English (en)
Chinese (zh)
Other versions
CN1541413A (zh
Inventor
M·贾科
P·拉克曼恩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
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Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of CN1541413A publication Critical patent/CN1541413A/zh
Application granted granted Critical
Publication of CN100392846C publication Critical patent/CN100392846C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/40—Arrangements for protection of devices protecting against tampering, e.g. unauthorised inspection or reverse engineering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Structure Of Printed Boards (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
CNB028049780A 2001-02-14 2002-01-22 包合薄板状基材之集成电路配置 Expired - Fee Related CN100392846C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10106836.0 2001-02-14
DE10106836A DE10106836B4 (de) 2001-02-14 2001-02-14 Integrierte Schaltungsanordnung aus einem flächigen Substrat

Publications (2)

Publication Number Publication Date
CN1541413A CN1541413A (zh) 2004-10-27
CN100392846C true CN100392846C (zh) 2008-06-04

Family

ID=7674011

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB028049780A Expired - Fee Related CN100392846C (zh) 2001-02-14 2002-01-22 包合薄板状基材之集成电路配置

Country Status (7)

Country Link
US (1) US7199448B2 (https=)
EP (1) EP1360718A2 (https=)
JP (1) JP3979942B2 (https=)
CN (1) CN100392846C (https=)
DE (1) DE10106836B4 (https=)
TW (1) TW519759B (https=)
WO (1) WO2002065548A2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004004289A1 (de) 2004-01-28 2005-08-25 Infineon Technologies Ag Integrierte Schaltungsanordnung
DE102004007690B3 (de) 2004-02-16 2005-10-13 Infineon Technologies Ag Integrierte Schaltungsanordnung
US8691663B2 (en) * 2009-11-06 2014-04-08 Alliance For Sustainable Energy, Llc Methods of manipulating stressed epistructures
JP5601384B2 (ja) * 2011-02-08 2014-10-08 富士電機株式会社 半導体モジュール用放熱板の製造方法、その放熱板およびその放熱板を用いた半導体モジュール

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01244625A (ja) * 1988-03-26 1989-09-29 Mitsubishi Electric Corp 半導体装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4021097A (en) * 1976-03-08 1977-05-03 Sperry Rand Corporation Distributive tee coupler
JPS58164231A (ja) 1982-03-25 1983-09-29 Toshiba Corp 半導体装置の製造方法
JP3360105B2 (ja) * 1994-03-04 2002-12-24 富士通株式会社 半導体装置の製造方法
JP3393233B2 (ja) * 1994-06-23 2003-04-07 ソニー株式会社 記録再生用カセットの基板取付構造
JPH08288424A (ja) * 1995-04-18 1996-11-01 Nec Corp 半導体装置
US6027958A (en) * 1996-07-11 2000-02-22 Kopin Corporation Transferred flexible integrated circuit
US5955776A (en) * 1996-12-04 1999-09-21 Ball Semiconductor, Inc. Spherical shaped semiconductor integrated circuit
JP2845232B2 (ja) 1997-01-13 1999-01-13 日本電気株式会社 半導体装置
JP3400329B2 (ja) * 1998-01-07 2003-04-28 日本電信電話株式会社 半導体装置
DE59813938D1 (de) 1998-08-19 2007-04-19 Infineon Technologies Ag Halbleiterchip mit Oberflächenabdeckung gegen optische Untersuchung der Schaltungsstruktur
US6500759B1 (en) * 1998-10-05 2002-12-31 Seiko Epson Corporation Protective layer having compression stress on titanium layer in method of making a semiconductor device
JP3720599B2 (ja) * 1998-10-07 2005-11-30 日本電信電話株式会社 半導体装置
TW460927B (en) * 1999-01-18 2001-10-21 Toshiba Corp Semiconductor device, mounting method for semiconductor device and manufacturing method for semiconductor device
JP3515012B2 (ja) 1999-04-23 2004-04-05 シャープ株式会社 半導体装置およびその製造方法
JP3553457B2 (ja) 2000-03-31 2004-08-11 シャープ株式会社 半導体装置およびその製造方法
JP3265301B2 (ja) * 2000-06-05 2002-03-11 株式会社東芝 半導体装置とその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01244625A (ja) * 1988-03-26 1989-09-29 Mitsubishi Electric Corp 半導体装置

Also Published As

Publication number Publication date
CN1541413A (zh) 2004-10-27
JP3979942B2 (ja) 2007-09-19
DE10106836B4 (de) 2009-01-22
DE10106836A1 (de) 2002-09-05
EP1360718A2 (de) 2003-11-12
US20040070052A1 (en) 2004-04-15
WO2002065548A3 (de) 2002-10-17
US7199448B2 (en) 2007-04-03
WO2002065548A2 (de) 2002-08-22
TW519759B (en) 2003-02-01
JP2004523904A (ja) 2004-08-05

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Granted publication date: 20080604

Termination date: 20180122

CF01 Termination of patent right due to non-payment of annual fee