ATE342608T1 - Herstellungsverfahren einer hybriden integrierten schaltung mit einem halbleiterbauelement und einem piezoelektrischen filter - Google Patents
Herstellungsverfahren einer hybriden integrierten schaltung mit einem halbleiterbauelement und einem piezoelektrischen filterInfo
- Publication number
- ATE342608T1 ATE342608T1 AT01915222T AT01915222T ATE342608T1 AT E342608 T1 ATE342608 T1 AT E342608T1 AT 01915222 T AT01915222 T AT 01915222T AT 01915222 T AT01915222 T AT 01915222T AT E342608 T1 ATE342608 T1 AT E342608T1
- Authority
- AT
- Austria
- Prior art keywords
- layer
- electrode
- piezoelectric
- situated
- acoustic reflector
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 5
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000010410 layer Substances 0.000 abstract 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 3
- 239000000463 material Substances 0.000 abstract 3
- 229910052710 silicon Inorganic materials 0.000 abstract 3
- 239000010703 silicon Substances 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 2
- 239000012790 adhesive layer Substances 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0542—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Networks Using Active Elements (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP00200614 | 2000-02-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE342608T1 true ATE342608T1 (de) | 2006-11-15 |
Family
ID=8171061
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT01915222T ATE342608T1 (de) | 2000-02-22 | 2001-02-09 | Herstellungsverfahren einer hybriden integrierten schaltung mit einem halbleiterbauelement und einem piezoelektrischen filter |
Country Status (8)
Country | Link |
---|---|
US (1) | US6379987B1 (de) |
EP (1) | EP1175727B1 (de) |
JP (1) | JP4843175B2 (de) |
KR (1) | KR100791657B1 (de) |
AT (1) | ATE342608T1 (de) |
DE (1) | DE60123709T2 (de) |
TW (1) | TW533609B (de) |
WO (1) | WO2001063758A1 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020029882A (ko) * | 2002-03-02 | 2002-04-20 | 주식회사 에이엔티 | 엘시엠피 공정법에 의한 탄성파소자의 제작방법 |
FR2890490A1 (fr) * | 2005-09-05 | 2007-03-09 | St Microelectronics Sa | Support de resonateur acoustique et circuit integre correspondant |
KR100934957B1 (ko) * | 2008-02-22 | 2010-01-06 | 한국과학기술연구원 | 압전 폴리머 기판을 이용한 하이브리드 전기소자와 그제조방법 |
US20120163131A1 (en) * | 2010-12-22 | 2012-06-28 | Sondex Limited | Mono-directional Ultrasound Transducer for Borehole Imaging |
DE102017130924B3 (de) * | 2017-12-21 | 2019-05-16 | RF360 Europe GmbH | Hybridfilter |
DE102017130926A1 (de) * | 2017-12-21 | 2019-06-27 | RF360 Europe GmbH | Waferanordnung, Verfahren zur Fertigung von derselben und Hybridfilter |
EA035222B1 (ru) * | 2018-10-09 | 2020-05-18 | Открытое акционерное общество "Межгосударственная Корпорация Развития" | Монолитный пьезоэлектрический фильтр |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3414832A (en) * | 1964-12-04 | 1968-12-03 | Westinghouse Electric Corp | Acoustically resonant device |
JPS58137317A (ja) * | 1982-02-09 | 1983-08-15 | Nec Corp | 圧電薄膜複合振動子 |
JPS6175614A (ja) * | 1984-09-21 | 1986-04-18 | Nec Corp | 薄膜圧電振動子の製造方法 |
JPH04184985A (ja) * | 1990-11-20 | 1992-07-01 | Canon Inc | 圧電体変位素子の製造方法 |
US5646583A (en) * | 1996-01-04 | 1997-07-08 | Rockwell International Corporation | Acoustic isolator having a high impedance layer of hafnium oxide |
JP3809712B2 (ja) * | 1996-08-27 | 2006-08-16 | セイコーエプソン株式会社 | 薄膜デバイスの転写方法 |
EP0890978B1 (de) * | 1997-07-10 | 2005-09-28 | STMicroelectronics S.r.l. | Verfahren zur Herstellung von hochempfindlichen, kapazitiven und resonierenden integrierten Sensoren, insbesondere Beschleunigungsmesser und Kreisel, und damit hergestellte Sensoren |
EP0895090B1 (de) * | 1997-07-31 | 2003-12-10 | STMicroelectronics S.r.l. | Verfahren zum Herstellen hochempfindlicher integrierter Beschleunigungs- und Gyroskopsensoren und Sensoren, die derartig hergestellt werden |
KR100316383B1 (ko) * | 1998-10-30 | 2002-02-19 | 윤덕용 | 모노리딕직접회로위에박막또는후막단결정압전소자를집적한단일칩라디오구조및그제조방법 |
EP1177623B1 (de) * | 2000-02-22 | 2009-08-05 | Nxp B.V. | Verfahren zur herstellung eines auf einem trägersubstrat geformten piezoelektrischen filters mit einem akustischen resonator auf einer akustischen reflektorschicht |
-
2001
- 2001-02-09 WO PCT/EP2001/001500 patent/WO2001063758A1/en active IP Right Grant
- 2001-02-09 JP JP2001562834A patent/JP4843175B2/ja not_active Expired - Fee Related
- 2001-02-09 AT AT01915222T patent/ATE342608T1/de not_active IP Right Cessation
- 2001-02-09 KR KR1020017013329A patent/KR100791657B1/ko not_active IP Right Cessation
- 2001-02-09 EP EP01915222A patent/EP1175727B1/de not_active Expired - Lifetime
- 2001-02-09 DE DE60123709T patent/DE60123709T2/de not_active Expired - Lifetime
- 2001-02-21 US US09/790,346 patent/US6379987B1/en not_active Expired - Lifetime
- 2001-04-06 TW TW090108313A patent/TW533609B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW533609B (en) | 2003-05-21 |
EP1175727B1 (de) | 2006-10-11 |
DE60123709T2 (de) | 2007-09-20 |
JP2003524902A (ja) | 2003-08-19 |
KR100791657B1 (ko) | 2008-01-03 |
JP4843175B2 (ja) | 2011-12-21 |
WO2001063758A1 (en) | 2001-08-30 |
DE60123709D1 (de) | 2006-11-23 |
EP1175727A1 (de) | 2002-01-30 |
US20020031855A1 (en) | 2002-03-14 |
KR20020000631A (ko) | 2002-01-05 |
US6379987B1 (en) | 2002-04-30 |
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Legal Events
Date | Code | Title | Description |
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RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |