JP3979942B2 - 平坦な基板を備える集積回路装置及び集積回路装置を製作する方法 - Google Patents

平坦な基板を備える集積回路装置及び集積回路装置を製作する方法 Download PDF

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Publication number
JP3979942B2
JP3979942B2 JP2002564764A JP2002564764A JP3979942B2 JP 3979942 B2 JP3979942 B2 JP 3979942B2 JP 2002564764 A JP2002564764 A JP 2002564764A JP 2002564764 A JP2002564764 A JP 2002564764A JP 3979942 B2 JP3979942 B2 JP 3979942B2
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Japan
Prior art keywords
substrate
integrated circuit
carrier
circuit device
curved
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Expired - Fee Related
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JP2002564764A
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English (en)
Japanese (ja)
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JP2004523904A (ja
JP2004523904A5 (https=
Inventor
マルクス ヤンケ，
ペーター ラークマン，
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Infineon Technologies AG
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Infineon Technologies AG
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/40—Arrangements for protection of devices protecting against tampering, e.g. unauthorised inspection or reverse engineering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof

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  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Structure Of Printed Boards (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2002564764A 2001-02-14 2002-01-22 平坦な基板を備える集積回路装置及び集積回路装置を製作する方法 Expired - Fee Related JP3979942B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10106836A DE10106836B4 (de) 2001-02-14 2001-02-14 Integrierte Schaltungsanordnung aus einem flächigen Substrat
PCT/DE2002/000191 WO2002065548A2 (de) 2001-02-14 2002-01-22 Integrierte schaltungsanordnung aus einem flächigen substrat

Publications (3)

Publication Number Publication Date
JP2004523904A JP2004523904A (ja) 2004-08-05
JP2004523904A5 JP2004523904A5 (https=) 2007-06-28
JP3979942B2 true JP3979942B2 (ja) 2007-09-19

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JP2002564764A Expired - Fee Related JP3979942B2 (ja) 2001-02-14 2002-01-22 平坦な基板を備える集積回路装置及び集積回路装置を製作する方法

Country Status (7)

Country Link
US (1) US7199448B2 (https=)
EP (1) EP1360718A2 (https=)
JP (1) JP3979942B2 (https=)
CN (1) CN100392846C (https=)
DE (1) DE10106836B4 (https=)
TW (1) TW519759B (https=)
WO (1) WO2002065548A2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004004289A1 (de) 2004-01-28 2005-08-25 Infineon Technologies Ag Integrierte Schaltungsanordnung
DE102004007690B3 (de) 2004-02-16 2005-10-13 Infineon Technologies Ag Integrierte Schaltungsanordnung
US8691663B2 (en) * 2009-11-06 2014-04-08 Alliance For Sustainable Energy, Llc Methods of manipulating stressed epistructures
JP5601384B2 (ja) * 2011-02-08 2014-10-08 富士電機株式会社 半導体モジュール用放熱板の製造方法、その放熱板およびその放熱板を用いた半導体モジュール

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4021097A (en) * 1976-03-08 1977-05-03 Sperry Rand Corporation Distributive tee coupler
JPS58164231A (ja) 1982-03-25 1983-09-29 Toshiba Corp 半導体装置の製造方法
JPH01244625A (ja) * 1988-03-26 1989-09-29 Mitsubishi Electric Corp 半導体装置
JP3360105B2 (ja) * 1994-03-04 2002-12-24 富士通株式会社 半導体装置の製造方法
JP3393233B2 (ja) * 1994-06-23 2003-04-07 ソニー株式会社 記録再生用カセットの基板取付構造
JPH08288424A (ja) * 1995-04-18 1996-11-01 Nec Corp 半導体装置
US6027958A (en) * 1996-07-11 2000-02-22 Kopin Corporation Transferred flexible integrated circuit
US5955776A (en) * 1996-12-04 1999-09-21 Ball Semiconductor, Inc. Spherical shaped semiconductor integrated circuit
JP2845232B2 (ja) 1997-01-13 1999-01-13 日本電気株式会社 半導体装置
JP3400329B2 (ja) * 1998-01-07 2003-04-28 日本電信電話株式会社 半導体装置
DE59813938D1 (de) 1998-08-19 2007-04-19 Infineon Technologies Ag Halbleiterchip mit Oberflächenabdeckung gegen optische Untersuchung der Schaltungsstruktur
US6500759B1 (en) * 1998-10-05 2002-12-31 Seiko Epson Corporation Protective layer having compression stress on titanium layer in method of making a semiconductor device
JP3720599B2 (ja) * 1998-10-07 2005-11-30 日本電信電話株式会社 半導体装置
TW460927B (en) * 1999-01-18 2001-10-21 Toshiba Corp Semiconductor device, mounting method for semiconductor device and manufacturing method for semiconductor device
JP3515012B2 (ja) 1999-04-23 2004-04-05 シャープ株式会社 半導体装置およびその製造方法
JP3553457B2 (ja) 2000-03-31 2004-08-11 シャープ株式会社 半導体装置およびその製造方法
JP3265301B2 (ja) * 2000-06-05 2002-03-11 株式会社東芝 半導体装置とその製造方法

Also Published As

Publication number Publication date
CN1541413A (zh) 2004-10-27
DE10106836B4 (de) 2009-01-22
DE10106836A1 (de) 2002-09-05
EP1360718A2 (de) 2003-11-12
US20040070052A1 (en) 2004-04-15
CN100392846C (zh) 2008-06-04
WO2002065548A3 (de) 2002-10-17
US7199448B2 (en) 2007-04-03
WO2002065548A2 (de) 2002-08-22
TW519759B (en) 2003-02-01
JP2004523904A (ja) 2004-08-05

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