CN100390932C - 半导体制造装置以及化学试剂交换方法 - Google Patents
半导体制造装置以及化学试剂交换方法 Download PDFInfo
- Publication number
- CN100390932C CN100390932C CNB2005100930887A CN200510093088A CN100390932C CN 100390932 C CN100390932 C CN 100390932C CN B2005100930887 A CNB2005100930887 A CN B2005100930887A CN 200510093088 A CN200510093088 A CN 200510093088A CN 100390932 C CN100390932 C CN 100390932C
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- CN
- China
- Prior art keywords
- chemical reagent
- waste
- temperature
- groove
- new
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/14—Removing waste, e.g. labels, from cleaning liquid; Regenerating cleaning liquids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
Abstract
Description
Claims (11)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004248970A JP2006066727A (ja) | 2004-08-27 | 2004-08-27 | 半導体製造装置及び薬液交換方法 |
JP248970/2004 | 2004-08-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1741249A CN1741249A (zh) | 2006-03-01 |
CN100390932C true CN100390932C (zh) | 2008-05-28 |
Family
ID=35941389
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100930887A Expired - Fee Related CN100390932C (zh) | 2004-08-27 | 2005-08-25 | 半导体制造装置以及化学试剂交换方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20060042756A1 (zh) |
JP (1) | JP2006066727A (zh) |
KR (1) | KR100693238B1 (zh) |
CN (1) | CN100390932C (zh) |
TW (1) | TWI279833B (zh) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007146892A2 (en) | 2006-06-13 | 2007-12-21 | Advanced Technology Materials, Inc. | Liquid dispensing systems encompassing gas removal |
JP2008016620A (ja) * | 2006-07-05 | 2008-01-24 | Toshiba Corp | 半導体製造装置及び半導体製造方法 |
KR100794585B1 (ko) * | 2006-08-01 | 2008-01-17 | 세메스 주식회사 | 습식 세정 장치 및 방법 |
KR100812545B1 (ko) * | 2006-10-23 | 2008-03-13 | 주식회사 케이씨텍 | 반도체 웨이퍼 세정장치 및 그 세정장치의 세정 약액공급방법 |
JP4878986B2 (ja) * | 2006-11-07 | 2012-02-15 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法、プログラムおよび記録媒体 |
KR101388110B1 (ko) * | 2007-10-22 | 2014-04-22 | 주식회사 케이씨텍 | 습식세정장치 및 그 운용방법 |
JP2009189905A (ja) * | 2008-02-12 | 2009-08-27 | Kurita Water Ind Ltd | 熱回収型洗浄装置 |
JP5313647B2 (ja) * | 2008-03-25 | 2013-10-09 | 大日本スクリーン製造株式会社 | 基板処理装置及び基板処理方法 |
TWI358327B (en) * | 2008-11-19 | 2012-02-21 | Inotera Memories Inc | Chemical treatment apparatus |
CN102122608B (zh) * | 2010-12-31 | 2012-08-15 | 北京七星华创电子股份有限公司 | 化学制剂处理系统 |
JP5766453B2 (ja) * | 2011-01-31 | 2015-08-19 | 三菱重工業株式会社 | 温水洗浄システムおよび温水洗浄方法 |
JP2013141613A (ja) * | 2012-01-06 | 2013-07-22 | Toshiba Carrier Corp | 産業用加熱装置 |
CN103377972B (zh) * | 2012-04-30 | 2016-12-28 | 细美事有限公司 | 基板处理装置和供给处理溶液的方法 |
JP6118719B2 (ja) * | 2013-12-16 | 2017-04-19 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法並びに基板処理プログラムを記録したコンピュータ読み取り可能な記録媒体 |
US9498799B2 (en) | 2014-03-11 | 2016-11-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for removing non-bonding compound from polycrystalline materials on solar panel |
CN104391433A (zh) * | 2014-12-05 | 2015-03-04 | 合肥鑫晟光电科技有限公司 | 一种喷淋系统及其使用方法 |
JP6858036B2 (ja) * | 2017-02-28 | 2021-04-14 | 株式会社Screenホールディングス | 基板処理装置 |
JP6786429B2 (ja) * | 2017-03-22 | 2020-11-18 | 株式会社Screenホールディングス | 基板処理装置、基板処理システム、および基板処理方法 |
US11227780B2 (en) | 2018-09-20 | 2022-01-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | System and method for operating the same |
JP2022178121A (ja) * | 2021-05-19 | 2022-12-02 | 株式会社Screenホールディングス | 基板処理システム |
JP2023131679A (ja) | 2022-03-09 | 2023-09-22 | 芝浦メカトロニクス株式会社 | 基板処理装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6039055A (en) * | 1998-01-08 | 2000-03-21 | International Business Machines Corporation | Wafer cleaning with dissolved gas concentration control |
JP2000266496A (ja) * | 1999-03-15 | 2000-09-29 | Komatsu Electronics Kk | 流体加熱装置 |
CN1351523A (zh) * | 1999-05-25 | 2002-05-29 | 因芬尼昂技术北美公司 | 半导体晶片兆赫声波清洗用去离子水的控温充气 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3508371A1 (de) * | 1985-03-08 | 1986-09-11 | Wacker Chemie Gmbh | Verfahren zur nachreinigung von chlorwasserstoff aus einer 1,2-dichlorethan-pyrolyse |
US5273589A (en) * | 1992-07-10 | 1993-12-28 | Griswold Bradley L | Method for low pressure rinsing and drying in a process chamber |
US5820689A (en) * | 1996-12-04 | 1998-10-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wet chemical treatment system and method for cleaning such system |
KR100252221B1 (ko) * | 1997-06-25 | 2000-04-15 | 윤종용 | 반도체장치 제조용 습식 식각장치 및 습식 식각장치내의 식각액 순환방법 |
US6399517B2 (en) * | 1999-03-30 | 2002-06-04 | Tokyo Electron Limited | Etching method and etching apparatus |
JP4602540B2 (ja) * | 2000-12-12 | 2010-12-22 | オメガセミコン電子株式会社 | 基板処理装置 |
-
2004
- 2004-08-27 JP JP2004248970A patent/JP2006066727A/ja active Pending
-
2005
- 2005-08-16 TW TW094127946A patent/TWI279833B/zh not_active IP Right Cessation
- 2005-08-23 KR KR1020050077129A patent/KR100693238B1/ko active IP Right Grant
- 2005-08-25 CN CNB2005100930887A patent/CN100390932C/zh not_active Expired - Fee Related
- 2005-08-26 US US11/211,748 patent/US20060042756A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6039055A (en) * | 1998-01-08 | 2000-03-21 | International Business Machines Corporation | Wafer cleaning with dissolved gas concentration control |
JP2000266496A (ja) * | 1999-03-15 | 2000-09-29 | Komatsu Electronics Kk | 流体加熱装置 |
CN1351523A (zh) * | 1999-05-25 | 2002-05-29 | 因芬尼昂技术北美公司 | 半导体晶片兆赫声波清洗用去离子水的控温充气 |
Also Published As
Publication number | Publication date |
---|---|
TW200625390A (en) | 2006-07-16 |
JP2006066727A (ja) | 2006-03-09 |
KR100693238B1 (ko) | 2007-03-12 |
US20060042756A1 (en) | 2006-03-02 |
CN1741249A (zh) | 2006-03-01 |
KR20060050557A (ko) | 2006-05-19 |
TWI279833B (en) | 2007-04-21 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: SEIKO EPSON CORP. Free format text: FORMER OWNER: TOSHIBA CORPORATION; APPLICANT Effective date: 20070126 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20070126 Address after: Tokyo, Japan, Japan Applicant after: Seiko Epson Corp. Address before: Tokyo, Japan, Japan Applicant before: Toshiba Corp Co-applicant before: Seiko Epson Corp. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080528 Termination date: 20190825 |
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CF01 | Termination of patent right due to non-payment of annual fee |