JP6118719B2 - 基板処理装置及び基板処理方法並びに基板処理プログラムを記録したコンピュータ読み取り可能な記録媒体 - Google Patents
基板処理装置及び基板処理方法並びに基板処理プログラムを記録したコンピュータ読み取り可能な記録媒体 Download PDFInfo
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- 238000000034 method Methods 0.000 claims description 39
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- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
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- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
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- B05C3/00—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material
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- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
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- C—CHEMISTRY; METALLURGY
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
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- C23C18/1632—Features specific for the apparatus, e.g. layout of cells and of its equipment, multiple cells
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1664—Process features with additional means during the plating process
- C23C18/1669—Agitation, e.g. air introduction
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
- Y10T137/0324—With control of flow by a condition or characteristic of a fluid
- Y10T137/0329—Mixing of plural fluids of diverse characteristics or conditions
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Description
また、第1の循環流路37は、供給流路52に冷却用熱交換器62を流量調整器63を介して接続するとともに、冷却用熱交換器62と貯留タンク35とをバッファタンク64と循環ポンプ65を介して接続している。冷却用熱交換器62、流量調整器63、及び循環ポンプ65は、制御部21によって制御される。
11〜14 第1〜第4の基板処理部
19 第1の処理流体供給部
35 貯留タンク
36 第2の循環流路
37 第1の循環流路
38 回収流路
51 加熱用熱交換器
52 供給流路
62 冷却用熱交換器
65 循環ポンプ
71 バイパス流路
73 合流部
Claims (7)
- 基板を処理流体で処理する複数の基板処理部と、
基板処理部に加熱した処理流体を供給する処理流体供給部と、
処理流体供給部を制御する制御部とを有し、
処理流体供給部は、処理流体を貯留する貯留タンクと、処理流体を加熱するための加熱用熱交換器と、複数の基板処理部に処理流体を供給するための供給流路と、を備え、
供給流路は、加熱用熱交換器を迂回するバイパス流路を複数の基板処理部よりも上流側に設け、加熱用熱交換器で加熱された処理流体とバイパス流路から供給された処理流体とを混合して処理流体を基板処理部に供給し、
処理流体供給部は、前記加熱用熱交換器と前記供給流路とを前記貯留タンクに接続して前記貯留タンクに貯留された処理流体を循環させる第1の循環流路を有し、
前記制御部は、
複数の基板処理部に供給する処理流体の流量に応じて前記加熱用熱交換器で加熱する処理流体の流量とバイパス流路から供給する処理流体の流量を調整して、前記加熱用熱交換器で加熱された処理流体とバイパス流路から供給された処理流体とを混合して所定温度となった処理流体を基板処理部に供給し、
前記複数の基板処理部の全てに処理流体を供給するために第1の循環流路で循環させる処理流体の流量が最大となる場合に前記加熱用熱交換器で総流量の処理流体を前記所定温度に加熱できるように前記加熱用熱交換器を駆動させるとともに、そのまま処理流体を供給する基板処理部の数に応じて前記バイパス流路から供給する処理流体の流量を調整することを特徴とする基板処理装置。 - 前記制御部は、基板処理部への処理流体の供給を停止した場合に加熱用熱交換器による加熱を停止することを特徴とする請求項1に記載の基板処理装置。
- 前記貯留タンクに貯留された処理流体を加熱せずに循環させる第2の循環流路を設け、
前記制御部は、基板処理部への処理流体の供給を行う場合には、第1の循環流路で処理流体を循環させ、基板処理部への処理流体の供給を停止した場合には、第2の循環流路で処理流体を循環させることを特徴とする請求項1又は請求項2に記載の基板処理装置。 - 貯留タンクに貯留した処理流体を加熱用熱交換器で加熱して供給流路から複数の基板処理部に供給するとともに、貯留タンクに貯留した処理流体を加熱用熱交換器を迂回するバイパス流路から供給流路の基板処理部よりも上流側に供給し、加熱用熱交換器で加熱された処理流体とバイパス流路から供給された処理流体とを混合して基板処理部に供給し、
前記加熱用熱交換器と前記供給流路とを前記貯留タンクに接続した第1の循環流路を用いて前記貯留タンクに貯留された処理流体を循環させ、
前記複数の基板処理部に供給する処理流体の流量に応じて前記加熱用熱交換器で加熱する処理流体の流量とバイパス流路から供給する処理流体の流量を調整して、前記加熱用熱交換器で加熱された処理流体とバイパス流路から供給された処理流体とを混合して所定温度となった処理流体を基板処理部に供給し、
前記複数の基板処理部の全てに処理流体を供給するために第1の循環流路で循環させる処理流体の流量が最大となる場合に前記加熱用熱交換器で総流量の処理流体を前記所定温度に加熱できるように前記加熱用熱交換器を駆動させるとともに、そのまま処理流体を供給する基板処理部の数に応じて前記バイパス流路から供給する処理流体の流量を調整することを特徴とする基板処理方法。 - 前記基板処理部への処理流体の供給を停止した場合に、加熱用熱交換器による加熱を停止することを特徴とする請求項4に記載の基板処理方法。
- 前記貯留タンクに貯留された処理流体を加熱せずに第2の循環流路で循環させ、基板処理部への処理流体の供給を行う場合には、前記第1の循環流路で処理流体を循環させ、基板処理部への処理流体の供給を停止した場合には、前記第2の循環流路で処理流体を循環させることを特徴とする請求項4又は請求項5に記載の基板処理方法。
- 基板を処理流体で処理する複数の基板処理部と、基板処理部に加熱した処理流体を供給する処理流体供給部と、処理流体供給部を制御する制御部とを有する基板処理装置で基板を処理させるための基板処理プログラムを記録したコンピュータ読み取り可能な記録媒体において、
貯留タンクに貯留した処理流体を加熱用熱交換器で加熱して供給流路から複数の基板処理部に供給させるとともに、貯留タンクに貯留した処理流体を加熱用熱交換器を迂回するバイパス流路から供給流路の基板処理部よりも上流側に供給させ、加熱用熱交換器で加熱された処理流体とバイパス流路から供給された処理流体とを混合して基板処理部に供給させ、
前記加熱用熱交換器と前記供給流路とを前記貯留タンクに接続した第1の循環流路を用いて前記貯留タンクに貯留された処理流体を循環させ、
前記複数の基板処理部に供給する処理流体の流量に応じて前記加熱用熱交換器で加熱する処理流体の流量とバイパス流路から供給する処理流体の流量を調整して、前記加熱用熱交換器で加熱された処理流体とバイパス流路から供給された処理流体とを混合して所定温度となった処理流体を基板処理部に供給し、
前記複数の基板処理部の全てに処理流体を供給するために第1の循環流路で循環させる処理流体の流量が最大となる場合に前記加熱用熱交換器で総流量の処理流体を前記所定温度に加熱できるように前記加熱用熱交換器を駆動させるとともに、そのまま処理流体を供給する基板処理部の数に応じて前記バイパス流路から供給する処理流体の流量を調整することを特徴とする基板処理プログラムを記録したコンピュータ読み取り可能な記録媒体。
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JP2013259017A JP6118719B2 (ja) | 2013-12-16 | 2013-12-16 | 基板処理装置及び基板処理方法並びに基板処理プログラムを記録したコンピュータ読み取り可能な記録媒体 |
TW103143062A TWI599678B (zh) | 2013-12-16 | 2014-12-10 | Substrate processing apparatus and substrate processing method and computer readable recording medium for recording substrate processing program |
US14/570,266 US9675992B2 (en) | 2013-12-16 | 2014-12-15 | Substrate processing apparatus, substrate processing method, and computer-readable storage medium storing substrate processing program |
KR1020140180267A KR102328634B1 (ko) | 2013-12-16 | 2014-12-15 | 기판 처리 장치 및 기판 처리 방법 그리고 기판 처리 프로그램을 기록한 컴퓨터 판독 가능한 기록 매체 |
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US6500482B1 (en) * | 2001-08-31 | 2002-12-31 | Boules H. Morcos | Electroless nickel plating solution and process for its use |
US7597763B2 (en) * | 2004-01-22 | 2009-10-06 | Intel Corporation | Electroless plating systems and methods |
JP2006066727A (ja) * | 2004-08-27 | 2006-03-09 | Toshiba Corp | 半導体製造装置及び薬液交換方法 |
JP5634341B2 (ja) * | 2011-06-29 | 2014-12-03 | 東京エレクトロン株式会社 | めっき処理装置、めっき処理方法および記憶媒体 |
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