TW200625390A - Semiconductor manufacturing apparatus and chemical exchanging method - Google Patents

Semiconductor manufacturing apparatus and chemical exchanging method

Info

Publication number
TW200625390A
TW200625390A TW094127946A TW94127946A TW200625390A TW 200625390 A TW200625390 A TW 200625390A TW 094127946 A TW094127946 A TW 094127946A TW 94127946 A TW94127946 A TW 94127946A TW 200625390 A TW200625390 A TW 200625390A
Authority
TW
Taiwan
Prior art keywords
liquid
chemical
waste liquid
temperature
raised
Prior art date
Application number
TW094127946A
Other languages
Chinese (zh)
Other versions
TWI279833B (en
Inventor
Kunihiro Miyazaki
Takashi Higuchi
Toshiki Nakajima
Original Assignee
Toshiba Kk
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Kk, Seiko Epson Corp filed Critical Toshiba Kk
Publication of TW200625390A publication Critical patent/TW200625390A/en
Application granted granted Critical
Publication of TWI279833B publication Critical patent/TWI279833B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/14—Removing waste, e.g. labels, from cleaning liquid; Regenerating cleaning liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)

Abstract

A semiconductor manufacturing device for cleaning a semiconductor substrate is provided with a high temperature circulation-type chemical tank 11 which is filled with a chemical supplied for cleaning the semiconductor substrate in a state that a temperature is raised to a processing temperature, in which the chemical after cleaning is circulated and reused, a bulb 21 discharging the chemical 12 in the chemical tank 11, an auxiliary liquid addition mechanism 32 heating waste liquid by adding auxiliary liquid generating heat by mixing with waste liquid to waste liquid being discharged liquid, a heat exchanger 31 in which heated waste liquid is temporarily stored and new liquid is circulated, waste liquid is cooled and the temperature of new liquid is raised by the heat exchange of waste liquid and new liquid, and piping supplying new liquid whose temperature is raised through the heat exchanger 31 into the chemical tank 11.
TW094127946A 2004-08-27 2005-08-16 Semiconductor manufacturing apparatus and chemical exchanging method TWI279833B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004248970A JP2006066727A (en) 2004-08-27 2004-08-27 Semiconductor manufacturing device and chemical exchanging method

Publications (2)

Publication Number Publication Date
TW200625390A true TW200625390A (en) 2006-07-16
TWI279833B TWI279833B (en) 2007-04-21

Family

ID=35941389

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094127946A TWI279833B (en) 2004-08-27 2005-08-16 Semiconductor manufacturing apparatus and chemical exchanging method

Country Status (5)

Country Link
US (1) US20060042756A1 (en)
JP (1) JP2006066727A (en)
KR (1) KR100693238B1 (en)
CN (1) CN100390932C (en)
TW (1) TWI279833B (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007146892A2 (en) 2006-06-13 2007-12-21 Advanced Technology Materials, Inc. Liquid dispensing systems encompassing gas removal
JP2008016620A (en) * 2006-07-05 2008-01-24 Toshiba Corp Device and method for manufacturing semiconductor
KR100794585B1 (en) * 2006-08-01 2008-01-17 세메스 주식회사 Apparatus and method for wet cleaning
KR100812545B1 (en) * 2006-10-23 2008-03-13 주식회사 케이씨텍 Cleaning apparatus for semiconductor wafer and supply method for chemical of the cleaning apparatus
JP4878986B2 (en) * 2006-11-07 2012-02-15 東京エレクトロン株式会社 Substrate processing apparatus, substrate processing method, program, and recording medium
KR101388110B1 (en) * 2007-10-22 2014-04-22 주식회사 케이씨텍 Wet station and operating method thereof
JP2009189905A (en) * 2008-02-12 2009-08-27 Kurita Water Ind Ltd Heat recovery type cleaning equipment
JP5313647B2 (en) * 2008-03-25 2013-10-09 大日本スクリーン製造株式会社 Substrate processing apparatus and substrate processing method
TWI358327B (en) * 2008-11-19 2012-02-21 Inotera Memories Inc Chemical treatment apparatus
CN102122608B (en) * 2010-12-31 2012-08-15 北京七星华创电子股份有限公司 Chemical preparation treating system
JP5766453B2 (en) * 2011-01-31 2015-08-19 三菱重工業株式会社 Hot water cleaning system and hot water cleaning method
JP2013141613A (en) * 2012-01-06 2013-07-22 Toshiba Carrier Corp Industrial heating device
CN103377972B (en) * 2012-04-30 2016-12-28 细美事有限公司 The method that substrate board treatment and supply process solution
JP6118719B2 (en) * 2013-12-16 2017-04-19 東京エレクトロン株式会社 Substrate processing apparatus, substrate processing method, and computer-readable recording medium recording substrate processing program
US9498799B2 (en) 2014-03-11 2016-11-22 Taiwan Semiconductor Manufacturing Co., Ltd. Method for removing non-bonding compound from polycrystalline materials on solar panel
CN104391433A (en) * 2014-12-05 2015-03-04 合肥鑫晟光电科技有限公司 Spraying system and using method thereof
JP6858036B2 (en) * 2017-02-28 2021-04-14 株式会社Ｓｃｒｅｅｎホールディングス Board processing equipment
JP6786429B2 (en) * 2017-03-22 2020-11-18 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing equipment, substrate processing system, and substrate processing method
US11227780B2 (en) 2018-09-20 2022-01-18 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for operating the same
JP2022178121A (en) * 2021-05-19 2022-12-02 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing system
JP2023131679A (en) 2022-03-09 2023-09-22 芝浦メカトロニクス株式会社 Substrate processing apparatus

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3508371A1 (en) * 1985-03-08 1986-09-11 Wacker Chemie Gmbh METHOD FOR PURIFYING CHLORINE HYDROGEN FROM A 1,2-DICHLORETHANE PYROLYSIS
US5273589A (en) * 1992-07-10 1993-12-28 Griswold Bradley L Method for low pressure rinsing and drying in a process chamber
US5820689A (en) * 1996-12-04 1998-10-13 Taiwan Semiconductor Manufacturing Co., Ltd. Wet chemical treatment system and method for cleaning such system
KR100252221B1 (en) * 1997-06-25 2000-04-15 윤종용 Wet etching apparatus for semiconductor manufacturing and method of etchant circulation therein
US6039055A (en) * 1998-01-08 2000-03-21 International Business Machines Corporation Wafer cleaning with dissolved gas concentration control
JP2000266496A (en) * 1999-03-15 2000-09-29 Komatsu Electronics Kk Fluid heating device
US6399517B2 (en) * 1999-03-30 2002-06-04 Tokyo Electron Limited Etching method and etching apparatus
US6295998B1 (en) * 1999-05-25 2001-10-02 Infineon Technologies North America Corp. Temperature controlled gassification of deionized water for megasonic cleaning of semiconductor wafers
JP4602540B2 (en) * 2000-12-12 2010-12-22 オメガセミコン電子株式会社 Substrate processing equipment

Also Published As

Publication number Publication date
JP2006066727A (en) 2006-03-09
KR100693238B1 (en) 2007-03-12
US20060042756A1 (en) 2006-03-02
CN1741249A (en) 2006-03-01
KR20060050557A (en) 2006-05-19
CN100390932C (en) 2008-05-28
TWI279833B (en) 2007-04-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees