CN100355038C - 等离子体处理装置和可变阻抗装置的校正方法 - Google Patents
等离子体处理装置和可变阻抗装置的校正方法 Download PDFInfo
- Publication number
- CN100355038C CN100355038C CNB031466818A CN03146681A CN100355038C CN 100355038 C CN100355038 C CN 100355038C CN B031466818 A CNB031466818 A CN B031466818A CN 03146681 A CN03146681 A CN 03146681A CN 100355038 C CN100355038 C CN 100355038C
- Authority
- CN
- China
- Prior art keywords
- impedance
- power
- plasma
- setting unit
- impedance setting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Plasma Technology (AREA)
- Drying Of Semiconductors (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002204928 | 2002-07-12 | ||
| JP2002204928 | 2002-07-12 | ||
| JP2003060670 | 2003-03-06 | ||
| JP2003060670A JP4370789B2 (ja) | 2002-07-12 | 2003-03-06 | プラズマ処理装置及び可変インピーダンス手段の校正方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101823491A Division CN101160014B (zh) | 2002-07-12 | 2003-07-11 | 等离子体处理装置和可变阻抗装置的校正方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1476057A CN1476057A (zh) | 2004-02-18 |
| CN100355038C true CN100355038C (zh) | 2007-12-12 |
Family
ID=31497586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031466818A Expired - Fee Related CN100355038C (zh) | 2002-07-12 | 2003-07-11 | 等离子体处理装置和可变阻抗装置的校正方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US7527016B2 (enExample) |
| JP (1) | JP4370789B2 (enExample) |
| CN (1) | CN100355038C (enExample) |
| TW (1) | TW200402759A (enExample) |
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| US20060021580A1 (en) * | 2004-06-02 | 2006-02-02 | Tokyo Electron Limited | Plasma processing apparatus and impedance adjustment method |
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| JP4676189B2 (ja) * | 2004-11-02 | 2011-04-27 | 東京エレクトロン株式会社 | 高周波給電装置及びプラズマ処理装置 |
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2003
- 2003-03-06 JP JP2003060670A patent/JP4370789B2/ja not_active Expired - Fee Related
- 2003-07-10 US US10/615,915 patent/US7527016B2/en not_active Expired - Fee Related
- 2003-07-11 CN CNB031466818A patent/CN100355038C/zh not_active Expired - Fee Related
- 2003-07-11 TW TW092119056A patent/TW200402759A/zh not_active IP Right Cessation
-
2007
- 2007-05-31 US US11/756,097 patent/US8251011B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| EP1179834A2 (en) * | 2000-08-11 | 2002-02-13 | Alps Electric Co., Ltd. | Plasma processing apparatus and performance validation system therefor |
| JP2002056999A (ja) * | 2000-08-11 | 2002-02-22 | Alps Electric Co Ltd | プラズマ処理装置およびプラズマ処理装置の性能確認システム |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004096066A (ja) | 2004-03-25 |
| US20070236148A1 (en) | 2007-10-11 |
| CN1476057A (zh) | 2004-02-18 |
| TW200402759A (en) | 2004-02-16 |
| US20040035365A1 (en) | 2004-02-26 |
| JP4370789B2 (ja) | 2009-11-25 |
| US8251011B2 (en) | 2012-08-28 |
| TWI320945B (enExample) | 2010-02-21 |
| US7527016B2 (en) | 2009-05-05 |
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