CH629259A5 - Waessriges elektroplattierungsbad fuer die ablagerung von silber/gold-legierungen. - Google Patents
Waessriges elektroplattierungsbad fuer die ablagerung von silber/gold-legierungen. Download PDFInfo
- Publication number
- CH629259A5 CH629259A5 CH458877A CH458877A CH629259A5 CH 629259 A5 CH629259 A5 CH 629259A5 CH 458877 A CH458877 A CH 458877A CH 458877 A CH458877 A CH 458877A CH 629259 A5 CH629259 A5 CH 629259A5
- Authority
- CH
- Switzerland
- Prior art keywords
- bath according
- bath
- silver
- concentration
- gold
- Prior art date
Links
- 238000009713 electroplating Methods 0.000 title claims description 10
- 239000004332 silver Substances 0.000 title claims description 10
- 229910001020 Au alloy Inorganic materials 0.000 title claims description 6
- 230000008021 deposition Effects 0.000 title claims description 6
- 229910001316 Ag alloy Inorganic materials 0.000 title claims description 4
- 239000003353 gold alloy Substances 0.000 title description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 10
- 239000010931 gold Substances 0.000 claims description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 9
- 229910052737 gold Inorganic materials 0.000 claims description 9
- 229920000768 polyamine Polymers 0.000 claims description 9
- 125000002947 alkylene group Chemical group 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 229920002873 Polyethylenimine Polymers 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 5
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims description 4
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 150000003839 salts Chemical class 0.000 claims description 3
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 239000002738 chelating agent Substances 0.000 claims description 2
- 229910052729 chemical element Inorganic materials 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- 230000000737 periodic effect Effects 0.000 claims description 2
- 229960001124 trientine Drugs 0.000 claims description 2
- 239000000080 wetting agent Substances 0.000 claims description 2
- 238000005275 alloying Methods 0.000 claims 1
- 238000005868 electrolysis reaction Methods 0.000 claims 1
- 229910001092 metal group alloy Inorganic materials 0.000 claims 1
- LSHROXHEILXKHM-UHFFFAOYSA-N n'-[2-[2-[2-(2-aminoethylamino)ethylamino]ethylamino]ethyl]ethane-1,2-diamine Chemical compound NCCNCCNCCNCCNCCN LSHROXHEILXKHM-UHFFFAOYSA-N 0.000 claims 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims 1
- -1 Amine compounds Chemical class 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 3
- 229910017052 cobalt Inorganic materials 0.000 description 3
- 239000010941 cobalt Substances 0.000 description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical class N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002466 imines Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 2
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- UCFIGPFUCRUDII-UHFFFAOYSA-N [Co](C#N)C#N.[K] Chemical compound [Co](C#N)C#N.[K] UCFIGPFUCRUDII-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- IZLAVFWQHMDDGK-UHFFFAOYSA-N gold(1+);cyanide Chemical compound [Au+].N#[C-] IZLAVFWQHMDDGK-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 150000003009 phosphonic acids Chemical class 0.000 description 1
- 229920001281 polyalkylene Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- HKSGQTYSSZOJOA-UHFFFAOYSA-N potassium argentocyanide Chemical compound [K+].[Ag+].N#[C-].N#[C-] HKSGQTYSSZOJOA-UHFFFAOYSA-N 0.000 description 1
- XTFKWYDMKGAZKK-UHFFFAOYSA-N potassium;gold(1+);dicyanide Chemical compound [K+].[Au+].N#[C-].N#[C-] XTFKWYDMKGAZKK-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/64—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of silver
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electrolytic Production Of Metals (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/676,439 US4088549A (en) | 1976-04-13 | 1976-04-13 | Bright low karat silver gold electroplating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH629259A5 true CH629259A5 (de) | 1982-04-15 |
Family
ID=24714518
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH458877A CH629259A5 (de) | 1976-04-13 | 1977-04-13 | Waessriges elektroplattierungsbad fuer die ablagerung von silber/gold-legierungen. |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US4088549A (enExample) |
| CA (1) | CA1079218A (enExample) |
| CH (1) | CH629259A5 (enExample) |
| DE (1) | DE2713507C2 (enExample) |
| FR (1) | FR2348286A1 (enExample) |
| GB (1) | GB1514451A (enExample) |
| HK (1) | HK34279A (enExample) |
| IT (1) | IT1115852B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102019202899B3 (de) * | 2019-03-04 | 2019-11-14 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Wässrige Formulierung zum Herstellen einer Schicht aus Gold und Silber |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BR8001854A (pt) * | 1979-04-04 | 1980-11-18 | Engelhard Min & Chem | Banho de revestimento de prata ou liga da mesma e respectivo processo de estabilizacao |
| US4478691A (en) * | 1981-10-13 | 1984-10-23 | At&T Bell Laboratories | Silver plating procedure |
| DE4406419C1 (de) * | 1994-02-28 | 1995-04-13 | Heraeus Gmbh W C | Bad zum galvanischen Abscheiden von Silber-Gold-Legierungen |
| GB9425031D0 (en) * | 1994-12-09 | 1995-02-08 | Alpha Metals Ltd | Printed circuit board manufacture |
| GB9425030D0 (en) | 1994-12-09 | 1995-02-08 | Alpha Metals Ltd | Silver plating |
| US6905587B2 (en) | 1996-03-22 | 2005-06-14 | Ronald Redline | Method for enhancing the solderability of a surface |
| JP2008133533A (ja) * | 2006-11-01 | 2008-06-12 | Ne Chemcat Corp | 金−銀合金めっき液 |
| US20130023166A1 (en) * | 2011-07-20 | 2013-01-24 | Tyco Electronics Corporation | Silver plated electrical contact |
| ITFI20120103A1 (it) * | 2012-06-01 | 2013-12-02 | Bluclad Srl | Bagni galvanici per l'ottenimento di una lega di oro a bassa caratura e processo galvanico che utilizza detti bagni. |
| US8944838B2 (en) | 2013-04-10 | 2015-02-03 | Tyco Electronics Corporation | Connector with locking ring |
| CN117542818B (zh) * | 2024-01-10 | 2024-04-05 | 深圳市联合蓝海应用材料科技股份有限公司 | 一种金银合金凸块及其制备方法和应用 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2660554A (en) * | 1950-11-10 | 1953-11-24 | Barnet D Ostrow | Bright gold and gold alloy plating baths |
| US2967135A (en) * | 1960-06-08 | 1961-01-03 | Barnet D Ostrow | Electroplating baths for hard bright gold deposits |
| US3642589A (en) * | 1969-09-29 | 1972-02-15 | Fred I Nobel | Gold alloy electroplating baths |
| US3864222A (en) * | 1973-03-26 | 1975-02-04 | Technic | Baths for Electrodeposition of Gold and Gold Alloys and Method Therefore |
| US4126524A (en) * | 1975-03-12 | 1978-11-21 | Technic, Inc. | Silver complex, method of making said complex and method and electrolyte containing said complex for electroplating silver and silver alloys |
| JPS52105540A (en) * | 1976-03-01 | 1977-09-05 | Tech Inc | Silver bath for lusterous plating of nonncyanide |
-
1976
- 1976-04-13 US US05/676,439 patent/US4088549A/en not_active Expired - Lifetime
-
1977
- 1977-02-28 CA CA272,805A patent/CA1079218A/en not_active Expired
- 1977-03-26 DE DE2713507A patent/DE2713507C2/de not_active Expired
- 1977-04-06 GB GB14580/77A patent/GB1514451A/en not_active Expired
- 1977-04-08 IT IT48896/77A patent/IT1115852B/it active
- 1977-04-13 CH CH458877A patent/CH629259A5/de not_active IP Right Cessation
- 1977-04-13 FR FR7711142A patent/FR2348286A1/fr active Granted
-
1979
- 1979-05-24 HK HK342/79A patent/HK34279A/xx unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102019202899B3 (de) * | 2019-03-04 | 2019-11-14 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Wässrige Formulierung zum Herstellen einer Schicht aus Gold und Silber |
| US11255021B2 (en) | 2019-03-04 | 2022-02-22 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Aqueous formulation for creating a layer of gold and silver |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2713507A1 (de) | 1977-10-20 |
| GB1514451A (en) | 1978-06-14 |
| FR2348286B1 (enExample) | 1981-03-06 |
| DE2713507C2 (de) | 1982-06-24 |
| CA1079218A (en) | 1980-06-10 |
| HK34279A (en) | 1979-06-01 |
| FR2348286A1 (fr) | 1977-11-10 |
| IT1115852B (it) | 1986-02-10 |
| US4088549A (en) | 1978-05-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4126524A (en) | Silver complex, method of making said complex and method and electrolyte containing said complex for electroplating silver and silver alloys | |
| DE4105272C2 (enExample) | ||
| CH629259A5 (de) | Waessriges elektroplattierungsbad fuer die ablagerung von silber/gold-legierungen. | |
| DE60120322T2 (de) | Plattierungsbad und Verfahren zur Plattierung von Zinn-Zink Legierungen | |
| DE60023190T2 (de) | Zink-nickel-elektroplattierung | |
| DE2413736A1 (de) | Elektrolytbad und verfahren zur galvanischen abscheidung von gold und goldlegierungen | |
| US2818374A (en) | Method for electrodepositing cadmiumindium alloys | |
| DE2506467C2 (de) | Bad und Verfahren zur galvanischen Abscheidung von Palladium-Nickel-Legierungen | |
| DE2612227A1 (de) | Galvanisches verfahren zur zink- abscheidung, sowie entsprechendes elektrolysebad | |
| DE3012999A1 (de) | Galvanisches bad zur abscheidung von gold- und goldlegierungsueberzuegen | |
| DE2039157C3 (de) | Wäßriges Bad zur elektrolytischen Abscheidung von Gold oder einer Goldlegierung und Verfahren zur Herstellung des bei diesem eingesetzten Goldaminkomplexes | |
| CH652150A5 (de) | Gold-plattierungsbad und -verfahren unter verwendung eines polymerchelates. | |
| DE3712511C3 (de) | Alkalisches cyanidfreies Elektroplattierungsbad und Verwendung dieses Bades | |
| DE2930035C2 (de) | Galvanisches Bad und Verfahren zur Abscheidung einer Gold-Cadmium-Kohlenstoff-Legierung und elektrisches Verbindungselement mit einem nach diesem Verfahren hergestellten Kontaktmaterial | |
| DE2249037A1 (de) | Verfahren zum plattieren von kupfer auf aluminium | |
| DE3147823A1 (de) | "bad zur galvanischen abscheidung von palladium oder palladiumlegierungen und ein verfahren zur abscheidung von palladium oder palladiumlegierungen mit diesem bad" | |
| DE3347384A1 (de) | Palladiumbad | |
| JP2769614B2 (ja) | 亜鉛−ニツケル合金用めつき浴 | |
| EP0619386B1 (de) | Elektrolytische Abscheidung von Palladium oder Palladiumlegierungen | |
| DE2704691A1 (de) | Cyanidfreies bad zur galvanischen abscheidung glaenzender silber- und silberlegierungsueberzuege und wasserloeslicher silberkomplex zur herstellung desselben | |
| DE2740592C2 (de) | Galvanisches Zinkbad | |
| US4062736A (en) | Gold and gold alloy deposition | |
| DE2819161C2 (de) | Wäßriges alkalisches Zinkbad zur Elektroplattierung und Verfahren zur Abscheidung von Glanzzink aus diesem Bad | |
| AT353071B (de) | Cyanidfreies, basisches sulfitbad zur elektrolytischen faellung von gold-zink- legierungen | |
| DE2800817C2 (de) | Aldehydfreies wässriges Bad für die galvanische Abscheidung von Gold und dessen Legierungen sowie ein Verfahren zur Herstellung von Gold- und Goldlegierungsabscheidungen unter Verwendung dieses Bades |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PL | Patent ceased | ||
| PL | Patent ceased |