FR2348286A1 - Bains de depot electrolytique d'alliages argent-or, renfermant une polyalkyleneimine et une alkylenepolyamine - Google Patents

Bains de depot electrolytique d'alliages argent-or, renfermant une polyalkyleneimine et une alkylenepolyamine

Info

Publication number
FR2348286A1
FR2348286A1 FR7711142A FR7711142A FR2348286A1 FR 2348286 A1 FR2348286 A1 FR 2348286A1 FR 7711142 A FR7711142 A FR 7711142A FR 7711142 A FR7711142 A FR 7711142A FR 2348286 A1 FR2348286 A1 FR 2348286A1
Authority
FR
France
Prior art keywords
alkylenepolyamine
polyalkyleneimine
baths
silver
gold alloys
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7711142A
Other languages
English (en)
French (fr)
Other versions
FR2348286B1 (enExample
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oxy Metal Industries Corp
Original Assignee
Oxy Metal Industries Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oxy Metal Industries Corp filed Critical Oxy Metal Industries Corp
Publication of FR2348286A1 publication Critical patent/FR2348286A1/fr
Application granted granted Critical
Publication of FR2348286B1 publication Critical patent/FR2348286B1/fr
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/64—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of silver

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
FR7711142A 1976-04-13 1977-04-13 Bains de depot electrolytique d'alliages argent-or, renfermant une polyalkyleneimine et une alkylenepolyamine Granted FR2348286A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/676,439 US4088549A (en) 1976-04-13 1976-04-13 Bright low karat silver gold electroplating

Publications (2)

Publication Number Publication Date
FR2348286A1 true FR2348286A1 (fr) 1977-11-10
FR2348286B1 FR2348286B1 (enExample) 1981-03-06

Family

ID=24714518

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7711142A Granted FR2348286A1 (fr) 1976-04-13 1977-04-13 Bains de depot electrolytique d'alliages argent-or, renfermant une polyalkyleneimine et une alkylenepolyamine

Country Status (8)

Country Link
US (1) US4088549A (enExample)
CA (1) CA1079218A (enExample)
CH (1) CH629259A5 (enExample)
DE (1) DE2713507C2 (enExample)
FR (1) FR2348286A1 (enExample)
GB (1) GB1514451A (enExample)
HK (1) HK34279A (enExample)
IT (1) IT1115852B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2453226A1 (fr) * 1979-04-04 1980-10-31 Engelhard Min & Chem Bain et procede d'electrodeposition d'argent et d'alliage or/argent

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4478691A (en) * 1981-10-13 1984-10-23 At&T Bell Laboratories Silver plating procedure
DE4406419C1 (de) * 1994-02-28 1995-04-13 Heraeus Gmbh W C Bad zum galvanischen Abscheiden von Silber-Gold-Legierungen
GB9425031D0 (en) * 1994-12-09 1995-02-08 Alpha Metals Ltd Printed circuit board manufacture
GB9425030D0 (en) 1994-12-09 1995-02-08 Alpha Metals Ltd Silver plating
US6905587B2 (en) 1996-03-22 2005-06-14 Ronald Redline Method for enhancing the solderability of a surface
JP2008133533A (ja) * 2006-11-01 2008-06-12 Ne Chemcat Corp 金−銀合金めっき液
US20130023166A1 (en) * 2011-07-20 2013-01-24 Tyco Electronics Corporation Silver plated electrical contact
ITFI20120103A1 (it) * 2012-06-01 2013-12-02 Bluclad Srl Bagni galvanici per l'ottenimento di una lega di oro a bassa caratura e processo galvanico che utilizza detti bagni.
US8944838B2 (en) 2013-04-10 2015-02-03 Tyco Electronics Corporation Connector with locking ring
DE102019202899B3 (de) 2019-03-04 2019-11-14 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Wässrige Formulierung zum Herstellen einer Schicht aus Gold und Silber
CN117542818B (zh) * 2024-01-10 2024-04-05 深圳市联合蓝海应用材料科技股份有限公司 一种金银合金凸块及其制备方法和应用

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3642589A (en) * 1969-09-29 1972-02-15 Fred I Nobel Gold alloy electroplating baths
FR2303872A1 (fr) * 1975-03-12 1976-10-08 Technic Bain d'electrolyse ne contenant pas de cyanure d'argent
FR2343062A2 (fr) * 1976-03-01 1977-09-30 Technic Bain d'electrolyse ne contenant pas de cyanure pour le depot electrolytique de l'argent

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2660554A (en) * 1950-11-10 1953-11-24 Barnet D Ostrow Bright gold and gold alloy plating baths
US2967135A (en) * 1960-06-08 1961-01-03 Barnet D Ostrow Electroplating baths for hard bright gold deposits
US3864222A (en) * 1973-03-26 1975-02-04 Technic Baths for Electrodeposition of Gold and Gold Alloys and Method Therefore

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3642589A (en) * 1969-09-29 1972-02-15 Fred I Nobel Gold alloy electroplating baths
FR2303872A1 (fr) * 1975-03-12 1976-10-08 Technic Bain d'electrolyse ne contenant pas de cyanure d'argent
FR2343062A2 (fr) * 1976-03-01 1977-09-30 Technic Bain d'electrolyse ne contenant pas de cyanure pour le depot electrolytique de l'argent

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2453226A1 (fr) * 1979-04-04 1980-10-31 Engelhard Min & Chem Bain et procede d'electrodeposition d'argent et d'alliage or/argent

Also Published As

Publication number Publication date
DE2713507A1 (de) 1977-10-20
CH629259A5 (de) 1982-04-15
GB1514451A (en) 1978-06-14
FR2348286B1 (enExample) 1981-03-06
DE2713507C2 (de) 1982-06-24
CA1079218A (en) 1980-06-10
HK34279A (en) 1979-06-01
IT1115852B (it) 1986-02-10
US4088549A (en) 1978-05-09

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Legal Events

Date Code Title Description
CD Change of name or company name
TP Transmission of property
ST Notification of lapse