IT1115852B - Bagno per elettrodepositare una lega di argento-oro e procedimento per applicarlo - Google Patents
Bagno per elettrodepositare una lega di argento-oro e procedimento per applicarloInfo
- Publication number
- IT1115852B IT1115852B IT48896/77A IT4889677A IT1115852B IT 1115852 B IT1115852 B IT 1115852B IT 48896/77 A IT48896/77 A IT 48896/77A IT 4889677 A IT4889677 A IT 4889677A IT 1115852 B IT1115852 B IT 1115852B
- Authority
- IT
- Italy
- Prior art keywords
- electroplacing
- bathroom
- silver
- procedure
- applying
- Prior art date
Links
- 229910001020 Au alloy Inorganic materials 0.000 title 1
- 239000003353 gold alloy Substances 0.000 title 1
- PQTCMBYFWMFIGM-UHFFFAOYSA-N gold silver Chemical compound [Ag].[Au] PQTCMBYFWMFIGM-UHFFFAOYSA-N 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/64—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of silver
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electrolytic Production Of Metals (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/676,439 US4088549A (en) | 1976-04-13 | 1976-04-13 | Bright low karat silver gold electroplating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IT1115852B true IT1115852B (it) | 1986-02-10 |
Family
ID=24714518
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT48896/77A IT1115852B (it) | 1976-04-13 | 1977-04-08 | Bagno per elettrodepositare una lega di argento-oro e procedimento per applicarlo |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US4088549A (enExample) |
| CA (1) | CA1079218A (enExample) |
| CH (1) | CH629259A5 (enExample) |
| DE (1) | DE2713507C2 (enExample) |
| FR (1) | FR2348286A1 (enExample) |
| GB (1) | GB1514451A (enExample) |
| HK (1) | HK34279A (enExample) |
| IT (1) | IT1115852B (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BR8001854A (pt) * | 1979-04-04 | 1980-11-18 | Engelhard Min & Chem | Banho de revestimento de prata ou liga da mesma e respectivo processo de estabilizacao |
| US4478691A (en) * | 1981-10-13 | 1984-10-23 | At&T Bell Laboratories | Silver plating procedure |
| DE4406419C1 (de) * | 1994-02-28 | 1995-04-13 | Heraeus Gmbh W C | Bad zum galvanischen Abscheiden von Silber-Gold-Legierungen |
| GB9425031D0 (en) * | 1994-12-09 | 1995-02-08 | Alpha Metals Ltd | Printed circuit board manufacture |
| GB9425030D0 (en) | 1994-12-09 | 1995-02-08 | Alpha Metals Ltd | Silver plating |
| US6905587B2 (en) | 1996-03-22 | 2005-06-14 | Ronald Redline | Method for enhancing the solderability of a surface |
| JP2008133533A (ja) * | 2006-11-01 | 2008-06-12 | Ne Chemcat Corp | 金−銀合金めっき液 |
| US20130023166A1 (en) * | 2011-07-20 | 2013-01-24 | Tyco Electronics Corporation | Silver plated electrical contact |
| ITFI20120103A1 (it) * | 2012-06-01 | 2013-12-02 | Bluclad Srl | Bagni galvanici per l'ottenimento di una lega di oro a bassa caratura e processo galvanico che utilizza detti bagni. |
| US8944838B2 (en) | 2013-04-10 | 2015-02-03 | Tyco Electronics Corporation | Connector with locking ring |
| DE102019202899B3 (de) | 2019-03-04 | 2019-11-14 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Wässrige Formulierung zum Herstellen einer Schicht aus Gold und Silber |
| CN117542818B (zh) * | 2024-01-10 | 2024-04-05 | 深圳市联合蓝海应用材料科技股份有限公司 | 一种金银合金凸块及其制备方法和应用 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2660554A (en) * | 1950-11-10 | 1953-11-24 | Barnet D Ostrow | Bright gold and gold alloy plating baths |
| US2967135A (en) * | 1960-06-08 | 1961-01-03 | Barnet D Ostrow | Electroplating baths for hard bright gold deposits |
| US3642589A (en) * | 1969-09-29 | 1972-02-15 | Fred I Nobel | Gold alloy electroplating baths |
| US3864222A (en) * | 1973-03-26 | 1975-02-04 | Technic | Baths for Electrodeposition of Gold and Gold Alloys and Method Therefore |
| US4126524A (en) * | 1975-03-12 | 1978-11-21 | Technic, Inc. | Silver complex, method of making said complex and method and electrolyte containing said complex for electroplating silver and silver alloys |
| JPS52105540A (en) * | 1976-03-01 | 1977-09-05 | Tech Inc | Silver bath for lusterous plating of nonncyanide |
-
1976
- 1976-04-13 US US05/676,439 patent/US4088549A/en not_active Expired - Lifetime
-
1977
- 1977-02-28 CA CA272,805A patent/CA1079218A/en not_active Expired
- 1977-03-26 DE DE2713507A patent/DE2713507C2/de not_active Expired
- 1977-04-06 GB GB14580/77A patent/GB1514451A/en not_active Expired
- 1977-04-08 IT IT48896/77A patent/IT1115852B/it active
- 1977-04-13 CH CH458877A patent/CH629259A5/de not_active IP Right Cessation
- 1977-04-13 FR FR7711142A patent/FR2348286A1/fr active Granted
-
1979
- 1979-05-24 HK HK342/79A patent/HK34279A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| DE2713507A1 (de) | 1977-10-20 |
| CH629259A5 (de) | 1982-04-15 |
| GB1514451A (en) | 1978-06-14 |
| FR2348286B1 (enExample) | 1981-03-06 |
| DE2713507C2 (de) | 1982-06-24 |
| CA1079218A (en) | 1980-06-10 |
| HK34279A (en) | 1979-06-01 |
| FR2348286A1 (fr) | 1977-11-10 |
| US4088549A (en) | 1978-05-09 |
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