CA2546106A1 - Vicinal gallium nitride substrate for high quality homoepitaxy - Google Patents
Vicinal gallium nitride substrate for high quality homoepitaxy Download PDFInfo
- Publication number
- CA2546106A1 CA2546106A1 CA 2546106 CA2546106A CA2546106A1 CA 2546106 A1 CA2546106 A1 CA 2546106A1 CA 2546106 CA2546106 CA 2546106 CA 2546106 A CA2546106 A CA 2546106A CA 2546106 A1 CA2546106 A1 CA 2546106A1
- Authority
- CA
- Canada
- Prior art keywords
- gan
- offcut
- substrate
- range
- angle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/18—Epitaxial-layer growth characterised by the substrate
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
- C30B29/406—Gallium nitride
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/40—Crystalline structures
- H10D62/405—Orientations of crystalline planes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
- H10D62/8503—Nitride Group III-V materials, e.g. AlN or GaN
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31—Surface property or characteristic of web, sheet or block
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/04—Processes
- Y10T83/0524—Plural cutting steps
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Chemical Vapour Deposition (AREA)
- Led Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Junction Field-Effect Transistors (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/714,307 US7118813B2 (en) | 2003-11-14 | 2003-11-14 | Vicinal gallium nitride substrate for high quality homoepitaxy |
| US10/714,307 | 2003-11-14 | ||
| PCT/US2004/038107 WO2005050707A2 (en) | 2003-11-14 | 2004-11-12 | Vicinal gallium nitride substrate for high quality homoepitaxy |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2546106A1 true CA2546106A1 (en) | 2005-06-02 |
Family
ID=34573953
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA 2546106 Abandoned CA2546106A1 (en) | 2003-11-14 | 2004-11-12 | Vicinal gallium nitride substrate for high quality homoepitaxy |
Country Status (7)
| Country | Link |
|---|---|
| US (4) | US7118813B2 (cg-RX-API-DMAC7.html) |
| EP (2) | EP1684973B1 (cg-RX-API-DMAC7.html) |
| JP (4) | JP5248777B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR101083840B1 (cg-RX-API-DMAC7.html) |
| CN (2) | CN1894093B (cg-RX-API-DMAC7.html) |
| CA (1) | CA2546106A1 (cg-RX-API-DMAC7.html) |
| WO (1) | WO2005050707A2 (cg-RX-API-DMAC7.html) |
Families Citing this family (64)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7118813B2 (en) * | 2003-11-14 | 2006-10-10 | Cree, Inc. | Vicinal gallium nitride substrate for high quality homoepitaxy |
| JP4201725B2 (ja) * | 2004-02-20 | 2008-12-24 | シャープ株式会社 | 窒化物半導体発光素子の製造方法 |
| JP2006306722A (ja) * | 2004-03-17 | 2006-11-09 | Sumitomo Electric Ind Ltd | GaN単結晶基板の製造方法及びGaN単結晶基板 |
| JP2010168277A (ja) * | 2004-03-17 | 2010-08-05 | Sumitomo Electric Ind Ltd | 半導体発光装置 |
| JP3888374B2 (ja) * | 2004-03-17 | 2007-02-28 | 住友電気工業株式会社 | GaN単結晶基板の製造方法 |
| JP4581490B2 (ja) * | 2004-05-31 | 2010-11-17 | 日立電線株式会社 | Iii−v族窒化物系半導体自立基板の製造方法、及びiii−v族窒化物系半導体の製造方法 |
| JP4525353B2 (ja) * | 2005-01-07 | 2010-08-18 | 住友電気工業株式会社 | Iii族窒化物基板の製造方法 |
| JP2006193348A (ja) | 2005-01-11 | 2006-07-27 | Sumitomo Electric Ind Ltd | Iii族窒化物半導体基板およびその製造方法 |
| EP1681712A1 (en) * | 2005-01-13 | 2006-07-19 | S.O.I. Tec Silicon on Insulator Technologies S.A. | Method of producing substrates for optoelectronic applications |
| JP4563230B2 (ja) * | 2005-03-28 | 2010-10-13 | 昭和電工株式会社 | AlGaN基板の製造方法 |
| KR20070119019A (ko) * | 2005-03-31 | 2007-12-18 | 산요덴키가부시키가이샤 | 질화 갈륨계 화합물 반도체 레이저 소자의 제조 방법 및질화 갈륨계 화합물 반도체 레이저 소자 |
| JP4792802B2 (ja) * | 2005-04-26 | 2011-10-12 | 住友電気工業株式会社 | Iii族窒化物結晶の表面処理方法 |
| DE102005021099A1 (de) * | 2005-05-06 | 2006-12-07 | Universität Ulm | GaN-Schichten |
| US7884447B2 (en) * | 2005-07-11 | 2011-02-08 | Cree, Inc. | Laser diode orientation on mis-cut substrates |
| JP2007119325A (ja) * | 2005-10-31 | 2007-05-17 | Sumitomo Electric Ind Ltd | Iii族窒化物結晶およびその成長方法 |
| KR101220826B1 (ko) * | 2005-11-22 | 2013-01-10 | 삼성코닝정밀소재 주식회사 | 질화갈륨 단결정 후막의 제조방법 |
| JP2009519202A (ja) * | 2005-12-12 | 2009-05-14 | キーマ テクノロジーズ, インク. | Iii族窒化物製品及び同製品の作製方法 |
| JP5191650B2 (ja) * | 2005-12-16 | 2013-05-08 | シャープ株式会社 | 窒化物半導体発光素子および窒化物半導体発光素子の製造方法 |
| KR100853241B1 (ko) * | 2005-12-16 | 2008-08-20 | 샤프 가부시키가이샤 | 질화물 반도체 발광소자 및 질화물 반도체 레이저 소자의제조방법 |
| JP5004597B2 (ja) * | 2006-03-06 | 2012-08-22 | シャープ株式会社 | 窒化物半導体発光素子および窒化物半導体発光素子の製造方法 |
| JP5430826B2 (ja) * | 2006-03-08 | 2014-03-05 | シャープ株式会社 | 窒化物半導体レーザ素子 |
| JP4444304B2 (ja) * | 2006-04-24 | 2010-03-31 | シャープ株式会社 | 窒化物半導体発光素子および窒化物半導体発光素子の製造方法 |
| CN100451632C (zh) * | 2006-05-31 | 2009-01-14 | 西安电子科技大学 | GaN单晶缺陷种类和密度的检测方法 |
| US7879697B2 (en) * | 2006-06-05 | 2011-02-01 | Regents Of The University Of Minnesota | Growth of low dislocation density Group-III nitrides and related thin-film structures |
| JP5003033B2 (ja) * | 2006-06-30 | 2012-08-15 | 住友電気工業株式会社 | GaN薄膜貼り合わせ基板およびその製造方法、ならびにGaN系半導体デバイスおよびその製造方法 |
| JP2008066355A (ja) * | 2006-09-05 | 2008-03-21 | Sumitomo Electric Ind Ltd | 3族窒化物基板の製造方法、3族窒化物基板、エピタキシャル層付き3族窒化物基板、3族窒化物デバイス、エピタキシャル層付き3族窒化物基板の製造方法、および3族窒化物デバイスの製造方法。 |
| JP4821007B2 (ja) * | 2007-03-14 | 2011-11-24 | 国立大学法人大阪大学 | Iii族元素窒化物結晶の製造方法およびiii族元素窒化物結晶 |
| JP2008285364A (ja) * | 2007-05-17 | 2008-11-27 | Sumitomo Electric Ind Ltd | GaN基板、それを用いたエピタキシャル基板及び半導体発光素子 |
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| WO2009039408A1 (en) * | 2007-09-19 | 2009-03-26 | The Regents Of The University Of California | Method for increasing the area of non-polar and semi-polar nitride substrates |
| PL385048A1 (pl) * | 2008-04-28 | 2009-11-09 | Topgan Spółka Z Ograniczoną Odpowiedzialnością | Sposób wytwarzania domieszkowanej magnezem warstwy epitaksjalnej InxAlyGa1-x-yN o przewodnictwie typu p, dla której )0 x 0,2 a 0 y 0,3 oraz półprzewodnikowych struktur wielowarstwowych zawierających taką warstwę epitaksjalną |
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| JP5170030B2 (ja) * | 2009-08-11 | 2013-03-27 | 日立電線株式会社 | 窒化物半導体自立基板、窒化物半導体自立基板の製造方法、及び窒化物半導体デバイス |
| KR101173072B1 (ko) * | 2009-08-27 | 2012-08-13 | 한국산업기술대학교산학협력단 | 경사진 기판 상의 고품질 비극성/반극성 반도체 소자 및 그 제조 방법 |
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| JP5313976B2 (ja) * | 2010-08-12 | 2013-10-09 | 日本電信電話株式会社 | 窒化物半導体薄膜およびその成長方法 |
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| JP5628956B2 (ja) * | 2013-04-02 | 2014-11-19 | フライベルガー・コンパウンド・マテリアルズ・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツングFreiberger Compound Materials Gmbh | Iii−n基板及びiii−nテンプレート |
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| CN103996606B (zh) * | 2014-05-30 | 2017-01-25 | 广州市众拓光电科技有限公司 | 生长在蓝宝石衬底上的高均匀性AlN薄膜及其制备方法和应用 |
| CN103996614B (zh) * | 2014-05-30 | 2016-09-07 | 广州市众拓光电科技有限公司 | 生长在蓝宝石衬底上的高均匀性GaN薄膜及其制备方法和应用 |
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-
2003
- 2003-11-14 US US10/714,307 patent/US7118813B2/en not_active Expired - Lifetime
-
2004
- 2004-11-12 CA CA 2546106 patent/CA2546106A1/en not_active Abandoned
- 2004-11-12 WO PCT/US2004/038107 patent/WO2005050707A2/en not_active Ceased
- 2004-11-12 EP EP20040811011 patent/EP1684973B1/en not_active Expired - Lifetime
- 2004-11-12 CN CN2004800371364A patent/CN1894093B/zh not_active Expired - Lifetime
- 2004-11-12 JP JP2006539971A patent/JP5248777B2/ja not_active Expired - Lifetime
- 2004-11-12 CN CN2011100601122A patent/CN102174712B/zh not_active Expired - Lifetime
- 2004-11-12 EP EP10010998.2A patent/EP2277696B1/en not_active Expired - Lifetime
-
2006
- 2006-05-11 US US11/431,990 patent/US7390581B2/en not_active Expired - Lifetime
- 2006-06-09 KR KR1020067011417A patent/KR101083840B1/ko not_active Expired - Lifetime
-
2008
- 2008-04-14 US US12/102,275 patent/US7700203B2/en not_active Expired - Lifetime
-
2010
- 2010-02-26 US US12/713,514 patent/US8043731B2/en not_active Expired - Lifetime
- 2010-08-06 JP JP2010177527A patent/JP5496007B2/ja not_active Expired - Lifetime
-
2013
- 2013-12-24 JP JP2013265880A patent/JP5827674B2/ja not_active Expired - Lifetime
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2015
- 2015-08-13 JP JP2015159969A patent/JP6067801B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US8043731B2 (en) | 2011-10-25 |
| JP5827674B2 (ja) | 2015-12-02 |
| CN102174712B (zh) | 2013-09-11 |
| EP2277696A2 (en) | 2011-01-26 |
| US20050104162A1 (en) | 2005-05-19 |
| US7700203B2 (en) | 2010-04-20 |
| EP1684973B1 (en) | 2013-12-25 |
| JP6067801B2 (ja) | 2017-01-25 |
| JP2016029008A (ja) | 2016-03-03 |
| JP2014129225A (ja) | 2014-07-10 |
| JP2011006319A (ja) | 2011-01-13 |
| US20100148320A1 (en) | 2010-06-17 |
| US7118813B2 (en) | 2006-10-10 |
| JP2007534159A (ja) | 2007-11-22 |
| EP2277696A3 (en) | 2011-02-16 |
| WO2005050707A2 (en) | 2005-06-02 |
| CN102174712A (zh) | 2011-09-07 |
| US20060228584A1 (en) | 2006-10-12 |
| US20080199649A1 (en) | 2008-08-21 |
| KR20060123297A (ko) | 2006-12-01 |
| EP2277696B1 (en) | 2017-03-08 |
| WO2005050707A3 (en) | 2005-10-20 |
| CN1894093A (zh) | 2007-01-10 |
| JP5248777B2 (ja) | 2013-07-31 |
| EP1684973A2 (en) | 2006-08-02 |
| KR101083840B1 (ko) | 2011-11-15 |
| EP1684973A4 (en) | 2008-03-12 |
| US7390581B2 (en) | 2008-06-24 |
| CN1894093B (zh) | 2011-04-20 |
| JP5496007B2 (ja) | 2014-05-21 |
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| EP1682701B1 (en) | LARGE AREA, UNIFORMLY LOW DISLOCATION DENSITY GaN SUBSTRATE AND PROCESS FOR MAKING THE SAME |
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