JP4201725B2 - 窒化物半導体発光素子の製造方法 - Google Patents
窒化物半導体発光素子の製造方法 Download PDFInfo
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Description
その上面にストライプ状に延在する溝及び丘が形成された窒化物半導体基板と、該窒化物半導体基板上に積層される複数の窒化物半導体層から成る窒化物半導体成長部と、を備えた窒化物半導体発光素子の製造方法において、
前記丘の幅を70μm以上1200μm以下とし、
前記溝上に積層した前記窒化物半導体成長部の高さが前記丘上に積層した前記窒化物半導体成長部の高さより低くなるように、前記窒化物半導体成長部を前記窒化物半導体基板上に積層する第1ステップと、
前記丘の端付近の前記窒化物半導体成長部の表面に盛り上がったエッジグロースを避けて、前記丘上及び前記溝上の少なくとも一方の前記窒化物半導体成長部の表面に凸状のリッジストライプ部を形成する第2ステップと、
を備えることを特徴とする。
更に、前記丘の端には、幅20〜30μmで0.3〜0.5μmの盛り上がりとなるエッジグロースが発生する場合がある。このため、前記丘の端から前記エッジグロースが発生する領域の幅20〜30μmの部分を避けて前記リッジストライプ部を形成するために、前記丘の幅は、70μm以上であるのが好ましい。逆に前記丘17の幅が広くなるとクラックが発生しやすくなるため、幅は1200μm以下であることが望ましい。
又、このような窒化物半導体発光素子の製造方法において、前記リッジストライプ部と平行な方向に延在する分割ラインに沿って、前記溝上及び前記丘上の少なくとも一方で分割を実施する第3ステップを備えるものとしても構わない。
本発明の第1の実施形態について図面を参照して説明する。窒化物半導体発光素子の一例として窒化物半導体レーザ素子について説明する。図1は本実施形態における窒化物半導体レーザ素子が設けられたウエーハの一部の概略断面図である。図2は、本実施形態の、窒化物半導体成長層11を積層する前のn型GaN基板10の上面図である。面方位も併せて表示する。図2に示したn型GaN基板10上に、窒化物半導体成長層11を積層させるなどして、図1の窒化物半導体レーザ素子を得る。
本発明の第2の実施形態について図面を参照して説明する。図7は本実施形態における窒化物半導体レーザ素子が設けられたウエーハの一部の概略断面図である。本実施形態において、n型GaN基板10上に積層される窒化物半導体成長層11は、その構成はn型GaN層21の層厚の値以外は図3のような構成となるので、同一の符号を付し、その詳細な説明は第1の実施形態を参照するものとして、省略する。また、図7には示されていないが、本実施形態のn型GaN基板10のオフ角は、主面方位のC面(0001)に対して0.2°とする。
本発明の第3の実施形態について図面を参照して説明する。図8は本実施形態における窒化物半導体レーザ素子が設けられたウエーハの一部の概略断面図である。n型GaN基板10上に積層される窒化物半導体成長層11は、その構成はn型GaN層21の層厚の値以外は図3のような構成となるので、同一の符号を付し、その詳細な説明は第1の実施形態を参照するものとして、省略する。また、図8には示されていないが、本実施形態のn型GaN基板10のオフ角は、主面方位のC面(0001)に対して0°(ジャスト)であるとする。
11 窒化物半導体成長層
12 リッジストライプ部
13 SiO2層
14 p電極
15 n電極
17 丘
17a 丘の上面部
17b 丘の側面部
18 溝
18a 溝の底面部
21 n型GaN層
22 n型Al0.1Ga0.9Nクラッド層
23 n型GaN光ガイド層
24 多重量子井戸構造活性層
25 p型Al0.3Ga0.7Nキャリアブロック層
26 p型GaN光ガイド層
27 p型Al0.1Ga0.9Nクラッド層
28 p型GaNコンタクト層
31a 上面成長部
31b 側面成長部
31c 底面成長部
31d 成長部
31e 這い上がり成長部
32 溝の中心部
33 這い上がり成長領域
34 盛り上がり部
51 分割ライン
61 分割ライン
71 分割ライン
81 分割ライン
Claims (12)
- その上面にストライプ状に延在する溝及び丘が形成された窒化物半導体基板と、該窒化物半導体基板上に積層される複数の窒化物半導体層から成る窒化物半導体成長部と、を備えた窒化物半導体発光素子の製造方法において、
前記丘の幅を70μm以上1200μm以下とし、
前記溝上に積層した前記窒化物半導体成長部の高さが前記丘上に積層した前記窒化物半導体成長部の高さより低くなるように、前記窒化物半導体成長部を前記窒化物半導体基板上に積層する第1ステップと、
前記丘の端付近の前記窒化物半導体成長部の表面に盛り上がったエッジグロースを避けて、前記丘上及び前記溝上の少なくとも一方の前記窒化物半導体成長部の表面に凸状のリッジストライプ部を形成する第2ステップと、
を備えることを特徴とする窒化物半導体発光素子の製造方法。 - 前記溝の断面形状が、矩形、又は、前記溝の開口部の幅が前記溝の底面部の幅より小さい逆テーパ形状、又は、前記溝の開口部の幅が前記溝の底面部の幅より大きい順テーパ形状であることを特徴とする請求項1に記載の窒化物半導体発光素子の製造方法。
- 前記窒化物半導体基板に形成された前記溝の幅が50μm以上1200μm以下であることを特徴とする請求項1または請求項2に記載の窒化物半導体発光素子の製造方法。
- 前記窒化物半導体基板に作製された前記溝の深さが3μm以上20μm以下であること特徴とする請求項1〜請求項3のいずれかに記載の窒化物半導体発光素子の製造方法。
- 前記窒化物半導体基板表面に積層されるn型GaN層の層厚が0.1μm以上2μm以下であることを特徴とする請求項1〜請求項4のいずれかに記載の窒化物半導体発光素子の製造方法。
- 前記窒化物半導体基板上面のオフ角が0.2°以下であることを特徴とする請求項1〜請求項5のいずれかに記載の窒化物半導体発光素子の製造方法。
- 前記リッジストライプ部を前記エッジグロースの端から5μm以上離れた位置に形成することを特徴とする請求項1〜請求項6のいずれかに記載の窒化物半導体発光素子の製造方法。
- 前記リッジストライプ部と平行な方向に延在する分割ラインに沿って、前記溝上及び前記丘上の少なくとも一方で分割を実施する第3ステップを備えることを特徴とする請求項1〜7のいずれかに記載の窒化物半導体発光素子の製造方法。
- 前記第3ステップにおいて、前記分割ラインの位置が、前記リッジストライプ部から少なくとも20μm以上離れていることを特徴とする請求項8に記載の窒化物半導体発光素子の製造方法。
- 前記第3ステップにおいて、前記溝上又は前記丘上に形成された前記窒化物半導体発光素子を、前記分割ラインによって分割する際、分割された前記窒化物半導体発光素子が、前記溝と前記丘により形成される段差部を含まないことを特徴とする請求項8又は請求項9に記載の窒化物半導体発光素子の製造方法。
- 前記第3ステップにおいて、前記溝上又は前記丘上に形成された前記窒化物半導体発光素子を、前記分割ラインによって分割する際、分割された前記窒化物半導体発光素子が前記溝と前記丘により形成される段差部を含むことを特徴とする請求項8又は請求項9に記載の窒化物半導体発光素子の製造方法。
- 前記溝上と前記丘上の両方に前記窒化物半導体発光素子が形成されたとき、前記第3ステップにおいて、前記溝上及び前記丘上に形成された前記窒化物半導体発光素子を分割する際、分割されて得た前記溝上及び前記丘上の前記窒化物半導体発光素子のいずれか一方に、前記溝と前記丘により形成される段差部を含むことを特徴とする請求項8又は請求項9に記載の窒化物半導体発光素子の製造方法。
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