CA2310765C - Stress relaxation type electronic component, a stress relaxation type circuit board, and a stress relaxation type electronic component mounted member - Google Patents
Stress relaxation type electronic component, a stress relaxation type circuit board, and a stress relaxation type electronic component mounted member Download PDFInfo
- Publication number
- CA2310765C CA2310765C CA 2310765 CA2310765A CA2310765C CA 2310765 C CA2310765 C CA 2310765C CA 2310765 CA2310765 CA 2310765 CA 2310765 A CA2310765 A CA 2310765A CA 2310765 C CA2310765 C CA 2310765C
- Authority
- CA
- Canada
- Prior art keywords
- stress relaxation
- electronic component
- circuit board
- electrically conductive
- mechanism member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000007246 mechanism Effects 0.000 claims abstract description 96
- 239000000853 adhesive Substances 0.000 claims description 51
- 229910000679 solder Inorganic materials 0.000 claims description 19
- 239000011342 resin composition Substances 0.000 claims description 16
- 239000011231 conductive filler Substances 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229920003002 synthetic resin Polymers 0.000 claims description 10
- 239000000057 synthetic resin Substances 0.000 claims description 10
- 239000002245 particle Substances 0.000 claims description 7
- 229920001187 thermosetting polymer Polymers 0.000 claims description 7
- 239000011889 copper foil Substances 0.000 claims description 6
- 125000002524 organometallic group Chemical group 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 description 23
- 239000000919 ceramic Substances 0.000 description 11
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 5
- 230000006378 damage Effects 0.000 description 4
- 230000035939 shock Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 150000004696 coordination complex Chemical class 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 239000013543 active substance Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- -1 for example Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000008439 repair process Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0212—Resin particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0379—Stacked conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10257—Hollow pieces of metal, e.g. used in connection between component and PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10992—Using different connection materials, e.g. different solders, for the same connection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/121—Metallo-organic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/254—Polymeric or resinous material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31862997 | 1997-11-19 | ||
JP9/318629 | 1997-11-19 | ||
PCT/JP1998/005135 WO1999026283A1 (en) | 1997-11-19 | 1998-11-13 | Stress relaxation electronic part, stress relaxation wiring board, and stress relaxation electronic part mounted body |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2310765A1 CA2310765A1 (en) | 1999-05-27 |
CA2310765C true CA2310765C (en) | 2005-07-12 |
Family
ID=18101279
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA 2310765 Expired - Fee Related CA2310765C (en) | 1997-11-19 | 1998-11-13 | Stress relaxation type electronic component, a stress relaxation type circuit board, and a stress relaxation type electronic component mounted member |
Country Status (8)
Country | Link |
---|---|
US (1) | US6465082B1 (zh) |
EP (1) | EP1041616A4 (zh) |
JP (1) | JP3262532B2 (zh) |
KR (1) | KR100432800B1 (zh) |
CN (2) | CN1279821A (zh) |
AU (1) | AU738424B2 (zh) |
CA (1) | CA2310765C (zh) |
WO (1) | WO1999026283A1 (zh) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6512183B2 (en) | 2000-10-10 | 2003-01-28 | Matsushita Electric Industrial Co., Ltd. | Electronic component mounted member and repair method thereof |
JP3770104B2 (ja) * | 2001-05-10 | 2006-04-26 | 三菱電機株式会社 | 電子装置と接合部材 |
JP4019254B2 (ja) * | 2002-04-24 | 2007-12-12 | 信越化学工業株式会社 | 導電性樹脂組成物 |
JP4470504B2 (ja) * | 2004-02-03 | 2010-06-02 | 株式会社デンソー | 積層型圧電素子及びその製造方法 |
US7361399B2 (en) | 2004-05-24 | 2008-04-22 | International Paper Company | Gloss coated multifunctional printing paper |
JP2005340687A (ja) * | 2004-05-31 | 2005-12-08 | Fujitsu Ltd | 積層基板及びその製造方法、かかる積層基板を有する電子機器 |
JP3955302B2 (ja) * | 2004-09-15 | 2007-08-08 | 松下電器産業株式会社 | フリップチップ実装体の製造方法 |
JP4899406B2 (ja) * | 2005-10-12 | 2012-03-21 | 日本電気株式会社 | フリップチップ型半導体装置 |
JP2007149577A (ja) * | 2005-11-30 | 2007-06-14 | Alps Electric Co Ltd | 発光装置 |
CN101452901B (zh) * | 2006-04-06 | 2010-12-15 | 财团法人工业技术研究院 | 具应力缓冲的微连凸块结构及制造方法 |
JP4821424B2 (ja) * | 2006-04-10 | 2011-11-24 | 株式会社村田製作所 | セラミック多層基板及びその製造方法 |
JP5035133B2 (ja) * | 2008-06-19 | 2012-09-26 | セイコーエプソン株式会社 | 接合膜付き回路基板、接合膜付き回路基板の接合方法、電子デバイスおよび電子機器 |
WO2010036521A1 (en) | 2008-09-26 | 2010-04-01 | International Paper Company | Composition suitable for multifunctional printing and recording sheet containing same |
JP5115578B2 (ja) * | 2010-03-26 | 2013-01-09 | Tdk株式会社 | 多層配線板及び多層配線板の製造方法 |
US8896986B2 (en) | 2010-05-26 | 2014-11-25 | Kemet Electronics Corporation | Method of improving electromechanical integrity of cathode coating to cathode termination interfaces in solid electrolytic capacitors |
WO2013015329A1 (ja) * | 2011-07-25 | 2013-01-31 | 日立化成工業株式会社 | 配線部材及びその製造方法、並びに配線部材接着体の製造方法 |
US9991550B2 (en) * | 2015-02-27 | 2018-06-05 | Verily Life Sciences Llc | Methods and devices associated with bonding of solid-state lithium batteries |
JP7424868B2 (ja) * | 2020-03-06 | 2024-01-30 | 日本航空電子工業株式会社 | 電気接続部材を生産する方法及び配線構造 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55160072A (en) | 1979-05-31 | 1980-12-12 | Matsushita Electric Ind Co Ltd | Electrically conductive adhesive |
JPS57113505A (en) | 1981-01-07 | 1982-07-15 | Matsushita Electric Ind Co Ltd | Conductive composition |
JPH0752762B2 (ja) | 1985-01-07 | 1995-06-05 | 株式会社日立製作所 | 半導体樹脂パッケージ |
JPH02185050A (ja) | 1989-01-12 | 1990-07-19 | Matsushita Electric Ind Co Ltd | 半導体装置の実装方法 |
JPH0574857A (ja) | 1991-09-11 | 1993-03-26 | Hitachi Ltd | 半導体装置 |
JPH05275489A (ja) * | 1992-03-26 | 1993-10-22 | Hitachi Ltd | 電極間の接続構造 |
JPH08111473A (ja) | 1994-10-07 | 1996-04-30 | Hitachi Ltd | ボールグリッドアレイ型パッケージ及びそれを用いた実装構造 |
JPH08195466A (ja) | 1995-01-17 | 1996-07-30 | Hitachi Ltd | 半導体装置 |
US5714803A (en) * | 1995-07-28 | 1998-02-03 | Sgs-Thomson Microelectronics, Inc. | Low-profile removable ball-grid-array integrated circuit package |
JPH09148720A (ja) | 1995-11-27 | 1997-06-06 | Toshiba Corp | マルチチップモジュールの製造方法 |
JPH09260533A (ja) | 1996-03-19 | 1997-10-03 | Hitachi Ltd | 半導体装置及びその実装構造 |
US5761048A (en) * | 1996-04-16 | 1998-06-02 | Lsi Logic Corp. | Conductive polymer ball attachment for grid array semiconductor packages |
JPH1145954A (ja) * | 1997-07-28 | 1999-02-16 | Hitachi Ltd | フリップチップ接続方法、フリップチップ接続構造体およびそれを用いた電子機器 |
-
1998
- 1998-11-13 US US09/554,502 patent/US6465082B1/en not_active Expired - Lifetime
- 1998-11-13 CA CA 2310765 patent/CA2310765C/en not_active Expired - Fee Related
- 1998-11-13 AU AU10534/99A patent/AU738424B2/en not_active Ceased
- 1998-11-13 WO PCT/JP1998/005135 patent/WO1999026283A1/ja not_active Application Discontinuation
- 1998-11-13 CN CN98811285A patent/CN1279821A/zh active Pending
- 1998-11-13 JP JP32421298A patent/JP3262532B2/ja not_active Expired - Lifetime
- 1998-11-13 CN CNA2004100055778A patent/CN1638072A/zh active Pending
- 1998-11-13 KR KR10-2000-7005460A patent/KR100432800B1/ko not_active IP Right Cessation
- 1998-11-13 EP EP98953052A patent/EP1041616A4/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
CN1638072A (zh) | 2005-07-13 |
JPH11224891A (ja) | 1999-08-17 |
EP1041616A4 (en) | 2005-05-11 |
EP1041616A1 (en) | 2000-10-04 |
KR100432800B1 (ko) | 2004-05-24 |
WO1999026283A1 (en) | 1999-05-27 |
CA2310765A1 (en) | 1999-05-27 |
KR20010032256A (ko) | 2001-04-16 |
CN1279821A (zh) | 2001-01-10 |
AU1053499A (en) | 1999-06-07 |
US6465082B1 (en) | 2002-10-15 |
JP3262532B2 (ja) | 2002-03-04 |
AU738424B2 (en) | 2001-09-20 |
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