CA1093911A - Procede de cuivrage non electrolytique - Google Patents

Procede de cuivrage non electrolytique

Info

Publication number
CA1093911A
CA1093911A CA272,215A CA272215A CA1093911A CA 1093911 A CA1093911 A CA 1093911A CA 272215 A CA272215 A CA 272215A CA 1093911 A CA1093911 A CA 1093911A
Authority
CA
Canada
Prior art keywords
copper
bath
deposition
salt
content
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA272,215A
Other languages
English (en)
Inventor
George A. Butter
John F. Mccormack
John D. Williamson
Rudolph J. Zeblisky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Technologies Corp
Original Assignee
Kollmorgen Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp
Application granted granted Critical
Publication of CA1093911A publication Critical patent/CA1093911A/fr
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents
    • C23C18/405Formaldehyde
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1617Purification and regeneration of coating baths
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
CA272,215A 1976-04-08 1977-02-21 Procede de cuivrage non electrolytique Expired CA1093911A (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US67476676A 1976-04-08 1976-04-08
US674,766 1976-04-08
US69113176A 1976-05-28 1976-05-28
US691,131 1976-05-28

Publications (1)

Publication Number Publication Date
CA1093911A true CA1093911A (fr) 1981-01-20

Family

ID=27101214

Family Applications (1)

Application Number Title Priority Date Filing Date
CA272,215A Expired CA1093911A (fr) 1976-04-08 1977-02-21 Procede de cuivrage non electrolytique

Country Status (13)

Country Link
JP (1) JPS5932542B2 (fr)
AT (1) AT351884B (fr)
AU (1) AU509685B2 (fr)
CA (1) CA1093911A (fr)
CH (1) CH633585A5 (fr)
DE (1) DE2715850C2 (fr)
DK (1) DK158977A (fr)
FR (1) FR2347453A1 (fr)
GB (1) GB1529151A (fr)
IL (1) IL51772A (fr)
IT (1) IT1115850B (fr)
NL (1) NL7703878A (fr)
SE (1) SE431351B (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6016517B2 (ja) * 1979-12-29 1985-04-25 上村工業株式会社 無電解めつき制御方法
NL8005024A (nl) * 1980-09-05 1982-04-01 Philips Nv Werkwijze voor de vervaardiging van koperlegeringslagen en -patronen op substraten en de aldus vervaardigde produkten.
JPS599159A (ja) * 1982-07-07 1984-01-18 Kanto Kasei Kogyo Kk 無電解めつき浴の濃度調整方法およびそれに使用する装置
JPS5993863A (ja) * 1982-11-17 1984-05-30 Hitachi Chem Co Ltd 無電解銅めつき液の銅イオン供給方法
GB2134931A (en) * 1982-12-27 1984-08-22 Ibiden Co Ltd Non-electrolytic copper plating for printed circuit board
JPS6118538A (ja) * 1984-07-05 1986-01-27 Kasai Kogyo Co Ltd 自動車用インシユレ−タダツシユ
JPS6116950U (ja) * 1984-07-05 1986-01-31 河西工業株式会社 自動車用インシユレ−タダツシユ
DE3430775C2 (de) * 1984-08-21 1993-01-28 Dr. Alois Stankiewicz GmbH, 3101 Adelheidsdorf Teppichteil, Verfahren zu seiner Herstellung und seine Verwendung
US4668532A (en) * 1984-09-04 1987-05-26 Kollmorgen Technologies Corporation System for selective metallization of electronic interconnection boards
US4770788A (en) * 1985-04-25 1988-09-13 Kollmorgen Technologies Corp. Process for removing metal complexes from waste solutions

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2955944A (en) * 1953-07-03 1960-10-11 Gen Motors Corp Electroless nickel plating bath control
US3046159A (en) * 1957-12-17 1962-07-24 Hughes Aircraft Co Method of copper plating by chemical reduction
US3403035A (en) * 1964-06-24 1968-09-24 Process Res Company Process for stabilizing autocatalytic metal plating solutions

Also Published As

Publication number Publication date
SE7703989L (sv) 1977-10-09
IT1115850B (it) 1986-02-10
DE2715850A1 (de) 1977-10-13
NL7703878A (nl) 1977-10-11
CH633585A5 (de) 1982-12-15
JPS52123335A (en) 1977-10-17
DK158977A (da) 1977-10-09
GB1529151A (en) 1978-10-18
AU2357377A (en) 1978-09-28
JPS5932542B2 (ja) 1984-08-09
SE431351B (sv) 1984-01-30
IL51772A0 (en) 1977-05-31
DE2715850C2 (de) 1982-12-02
FR2347453A1 (fr) 1977-11-04
FR2347453B1 (fr) 1981-01-09
IL51772A (en) 1979-09-30
AU509685B2 (en) 1980-05-22
ATA245477A (de) 1979-01-15
AT351884B (de) 1979-08-27

Similar Documents

Publication Publication Date Title
US3338726A (en) Chemical reduction plating process and bath
US4076618A (en) Treatment of liquids containing complexed heavy metals and complexing agents
JP3455709B2 (ja) めっき方法とそれに用いるめっき液前駆体
WO1994012684A1 (fr) Bains de depot de nickel chimique
CA1093911A (fr) Procede de cuivrage non electrolytique
US4764284A (en) Process for removing of heavy metal from water in particular from waste water
CA1081406A (fr) Placage chimique de metaux
EP0132594A1 (fr) Solution de cuivre pour le placage sans courant
Peters et al. Batch precipitation studies for heavy metal removal by sulfide precipitation
JPS6070183A (ja) 化学銅めっき方法
US4664810A (en) Method of separating heavy metals from complex-forming substances of aminocarboxylic acid type, or salts thereof in aqueous solutions
US4956097A (en) Waste treatment of metal containing solutions
EP1057902A2 (fr) Procédé amélioré de synthèse d'un régénerateur de palladium pour des bains d'électrodéposition
EP0199335B1 (fr) Procédé pour enlever des complexes de métaux de solutions usées
JPS6115979A (ja) 無電解めつき浴からめつきする方法
US4450191A (en) Ammonium ions used as electroless copper plating rate controller
US3770464A (en) Dry replenishment of electroless copper solutions
WO1994012685A1 (fr) Bains de cuivrage sans courant electrique et sans sulfate
US2871142A (en) Chemical nickel and cobalt plating process
JPH06272096A (ja) シアン化物を有していない銅メッキ浴の精製
JP3842063B2 (ja) 金めっき液の再生処理方法
JPH0219473A (ja) 無電解金沈積
US3340073A (en) Regeneration of chemical plating baths
JP3468650B2 (ja) 無電解ニッケルめっき方法
US4038085A (en) Method of treating electroless nickel plating bath

Legal Events

Date Code Title Description
MKEX Expiry