DK158977A - Fremgangsmade ved elektrodefri kobberaflejring - Google Patents

Fremgangsmade ved elektrodefri kobberaflejring

Info

Publication number
DK158977A
DK158977A DK158977A DK158977A DK158977A DK 158977 A DK158977 A DK 158977A DK 158977 A DK158977 A DK 158977A DK 158977 A DK158977 A DK 158977A DK 158977 A DK158977 A DK 158977A
Authority
DK
Denmark
Prior art keywords
procedure
power deposit
power
deposit
deposit procedure
Prior art date
Application number
DK158977A
Other languages
English (en)
Inventor
G A Butter
Cormack J F Mc
J D Williamson
R J Zeblisky
Original Assignee
Kollmorgen Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp
Publication of DK158977A publication Critical patent/DK158977A/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
DK158977A 1976-04-08 1977-04-06 Fremgangsmade ved elektrodefri kobberaflejring DK158977A (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US67476676A 1976-04-08 1976-04-08
US69113176A 1976-05-28 1976-05-28

Publications (1)

Publication Number Publication Date
DK158977A true DK158977A (da) 1977-10-09

Family

ID=27101214

Family Applications (1)

Application Number Title Priority Date Filing Date
DK158977A DK158977A (da) 1976-04-08 1977-04-06 Fremgangsmade ved elektrodefri kobberaflejring

Country Status (13)

Country Link
JP (1) JPS5932542B2 (da)
AT (1) AT351884B (da)
AU (1) AU509685B2 (da)
CA (1) CA1093911A (da)
CH (1) CH633585A5 (da)
DE (1) DE2715850C2 (da)
DK (1) DK158977A (da)
FR (1) FR2347453A1 (da)
GB (1) GB1529151A (da)
IL (1) IL51772A (da)
IT (1) IT1115850B (da)
NL (1) NL7703878A (da)
SE (1) SE431351B (da)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6016517B2 (ja) * 1979-12-29 1985-04-25 上村工業株式会社 無電解めつき制御方法
NL8005024A (nl) * 1980-09-05 1982-04-01 Philips Nv Werkwijze voor de vervaardiging van koperlegeringslagen en -patronen op substraten en de aldus vervaardigde produkten.
JPS599159A (ja) * 1982-07-07 1984-01-18 Kanto Kasei Kogyo Kk 無電解めつき浴の濃度調整方法およびそれに使用する装置
JPS5993863A (ja) * 1982-11-17 1984-05-30 Hitachi Chem Co Ltd 無電解銅めつき液の銅イオン供給方法
GB2134931A (en) * 1982-12-27 1984-08-22 Ibiden Co Ltd Non-electrolytic copper plating for printed circuit board
JPS6118538A (ja) * 1984-07-05 1986-01-27 Kasai Kogyo Co Ltd 自動車用インシユレ−タダツシユ
JPS6116950U (ja) * 1984-07-05 1986-01-31 河西工業株式会社 自動車用インシユレ−タダツシユ
DE3430775C2 (de) * 1984-08-21 1993-01-28 Dr. Alois Stankiewicz GmbH, 3101 Adelheidsdorf Teppichteil, Verfahren zu seiner Herstellung und seine Verwendung
US4668532A (en) * 1984-09-04 1987-05-26 Kollmorgen Technologies Corporation System for selective metallization of electronic interconnection boards
US4770788A (en) * 1985-04-25 1988-09-13 Kollmorgen Technologies Corp. Process for removing metal complexes from waste solutions

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2955944A (en) * 1953-07-03 1960-10-11 Gen Motors Corp Electroless nickel plating bath control
US3046159A (en) * 1957-12-17 1962-07-24 Hughes Aircraft Co Method of copper plating by chemical reduction
US3403035A (en) * 1964-06-24 1968-09-24 Process Res Company Process for stabilizing autocatalytic metal plating solutions

Also Published As

Publication number Publication date
SE7703989L (sv) 1977-10-09
IT1115850B (it) 1986-02-10
DE2715850A1 (de) 1977-10-13
NL7703878A (nl) 1977-10-11
CH633585A5 (de) 1982-12-15
JPS52123335A (en) 1977-10-17
GB1529151A (en) 1978-10-18
AU2357377A (en) 1978-09-28
CA1093911A (en) 1981-01-20
JPS5932542B2 (ja) 1984-08-09
SE431351B (sv) 1984-01-30
IL51772A0 (en) 1977-05-31
DE2715850C2 (de) 1982-12-02
FR2347453A1 (fr) 1977-11-04
FR2347453B1 (da) 1981-01-09
IL51772A (en) 1979-09-30
AU509685B2 (en) 1980-05-22
ATA245477A (de) 1979-01-15
AT351884B (de) 1979-08-27

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Legal Events

Date Code Title Description
AHS Application shelved for other reasons than non-payment
PBP Patent lapsed