AT351884B - Verfahren zum regenerieren von ohne aeussere stromquelle arbeitenden verkupferungs- baedern - Google Patents

Verfahren zum regenerieren von ohne aeussere stromquelle arbeitenden verkupferungs- baedern

Info

Publication number
AT351884B
AT351884B AT245477A AT245477A AT351884B AT 351884 B AT351884 B AT 351884B AT 245477 A AT245477 A AT 245477A AT 245477 A AT245477 A AT 245477A AT 351884 B AT351884 B AT 351884B
Authority
AT
Austria
Prior art keywords
regeneration
working
power source
external power
copper baths
Prior art date
Application number
AT245477A
Other languages
English (en)
Other versions
ATA245477A (de
Original Assignee
Kollmorgen Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp
Publication of ATA245477A publication Critical patent/ATA245477A/de
Application granted granted Critical
Publication of AT351884B publication Critical patent/AT351884B/de

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents
    • C23C18/405Formaldehyde
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1617Purification and regeneration of coating baths
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
AT245477A 1976-04-08 1977-04-07 Verfahren zum regenerieren von ohne aeussere stromquelle arbeitenden verkupferungs- baedern AT351884B (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US67476676A 1976-04-08 1976-04-08
US69113176A 1976-05-28 1976-05-28

Publications (2)

Publication Number Publication Date
ATA245477A ATA245477A (de) 1979-01-15
AT351884B true AT351884B (de) 1979-08-27

Family

ID=27101214

Family Applications (1)

Application Number Title Priority Date Filing Date
AT245477A AT351884B (de) 1976-04-08 1977-04-07 Verfahren zum regenerieren von ohne aeussere stromquelle arbeitenden verkupferungs- baedern

Country Status (13)

Country Link
JP (1) JPS5932542B2 (de)
AT (1) AT351884B (de)
AU (1) AU509685B2 (de)
CA (1) CA1093911A (de)
CH (1) CH633585A5 (de)
DE (1) DE2715850C2 (de)
DK (1) DK158977A (de)
FR (1) FR2347453A1 (de)
GB (1) GB1529151A (de)
IL (1) IL51772A (de)
IT (1) IT1115850B (de)
NL (1) NL7703878A (de)
SE (1) SE431351B (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6016517B2 (ja) * 1979-12-29 1985-04-25 上村工業株式会社 無電解めつき制御方法
NL8005024A (nl) * 1980-09-05 1982-04-01 Philips Nv Werkwijze voor de vervaardiging van koperlegeringslagen en -patronen op substraten en de aldus vervaardigde produkten.
JPS599159A (ja) * 1982-07-07 1984-01-18 Kanto Kasei Kogyo Kk 無電解めつき浴の濃度調整方法およびそれに使用する装置
JPS5993863A (ja) * 1982-11-17 1984-05-30 Hitachi Chem Co Ltd 無電解銅めつき液の銅イオン供給方法
GB2134931A (en) * 1982-12-27 1984-08-22 Ibiden Co Ltd Non-electrolytic copper plating for printed circuit board
JPS6118538A (ja) * 1984-07-05 1986-01-27 Kasai Kogyo Co Ltd 自動車用インシユレ−タダツシユ
JPS6116950U (ja) * 1984-07-05 1986-01-31 河西工業株式会社 自動車用インシユレ−タダツシユ
DE3430775C2 (de) * 1984-08-21 1993-01-28 Dr. Alois Stankiewicz GmbH, 3101 Adelheidsdorf Teppichteil, Verfahren zu seiner Herstellung und seine Verwendung
US4668532A (en) * 1984-09-04 1987-05-26 Kollmorgen Technologies Corporation System for selective metallization of electronic interconnection boards
US4770788A (en) * 1985-04-25 1988-09-13 Kollmorgen Technologies Corp. Process for removing metal complexes from waste solutions

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2955944A (en) * 1953-07-03 1960-10-11 Gen Motors Corp Electroless nickel plating bath control
US3046159A (en) * 1957-12-17 1962-07-24 Hughes Aircraft Co Method of copper plating by chemical reduction
US3403035A (en) * 1964-06-24 1968-09-24 Process Res Company Process for stabilizing autocatalytic metal plating solutions

Also Published As

Publication number Publication date
SE7703989L (sv) 1977-10-09
IT1115850B (it) 1986-02-10
DE2715850A1 (de) 1977-10-13
NL7703878A (nl) 1977-10-11
CH633585A5 (de) 1982-12-15
JPS52123335A (en) 1977-10-17
DK158977A (da) 1977-10-09
GB1529151A (en) 1978-10-18
AU2357377A (en) 1978-09-28
CA1093911A (en) 1981-01-20
JPS5932542B2 (ja) 1984-08-09
SE431351B (sv) 1984-01-30
IL51772A0 (en) 1977-05-31
DE2715850C2 (de) 1982-12-02
FR2347453A1 (fr) 1977-11-04
FR2347453B1 (de) 1981-01-09
IL51772A (en) 1979-09-30
AU509685B2 (en) 1980-05-22
ATA245477A (de) 1979-01-15

Similar Documents

Publication Publication Date Title
ATA579978A (de) Verfahren zum herstellen von elektrischer leiterplatten
IT1034213B (it) Processo per il trattamento di superfici sommerse
IT1075872B (it) Processo di dimerizzazione
AT353072B (de) Verfahren zum regenerieren von stromlos arbeitenden metallabscheidungsbaedern
DD132129A5 (de) Verfahren zum herstellen von cellulosealkylaethern
IT1038850B (it) Processo per il trattamento di acque
DD138967A5 (de) Verfahren zum stabilisieren von natriumpercarbonat
AT351884B (de) Verfahren zum regenerieren von ohne aeussere stromquelle arbeitenden verkupferungs- baedern
IT1060768B (it) Processo per il trattamento di superfici metalliche
ATA362177A (de) Vorrichtung zum stosspressen von werkstuecken von werkstuecken
AT329704B (de) Stromimpulsgenerator fur elektroerosionsmetallverarbeitung
ATA612278A (de) Verfahren zum herstellen von rollgebaeck
IT1058596B (it) Processo di nichelatura
IT1078575B (it) Processo e soluzione per la zincatura
AT357588B (de) Salzbad zum abkuehlen von badnitrierten bau- teilen
DD125995A5 (de) Elektrochemisches behandlungsverfahren
IT1021031B (it) Processo per il trattamento di sospensioni
AT345629B (de) Werkzeug zum entgraten von bohrungen
AT337475B (de) Verfahren zum herstellen von brillenrahmen
SE7609317L (sv) Bad for fornickling
IT1126706B (it) Metodo di fabbricazione di piastrine di semiconduttori
DD134758A5 (de) Verfahren zum kuehlen von aluminiumchloriddaempfen
DD131348A5 (de) Verfahren zum reinigen der innenwaende von reaktoren
IT1060248B (it) Apparecchiatura di ciclaggio per processo fotoelettroforetico con comitante
IT1068594B (it) Metodo di trattamento di un apparato elettrico

Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties