BRPI0914554A2 - substrativo flexível e estrutura de circuito elétrico - Google Patents

substrativo flexível e estrutura de circuito elétrico

Info

Publication number
BRPI0914554A2
BRPI0914554A2 BRPI0914554A BRPI0914554A BRPI0914554A2 BR PI0914554 A2 BRPI0914554 A2 BR PI0914554A2 BR PI0914554 A BRPI0914554 A BR PI0914554A BR PI0914554 A BRPI0914554 A BR PI0914554A BR PI0914554 A2 BRPI0914554 A2 BR PI0914554A2
Authority
BR
Brazil
Prior art keywords
flexible substrate
electrical circuit
circuit structure
electrical
flexible
Prior art date
Application number
BRPI0914554A
Other languages
English (en)
Inventor
Takeshi Muraoka
Yukihiro Sumida
Original Assignee
Sharp Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kk filed Critical Sharp Kk
Publication of BRPI0914554A2 publication Critical patent/BRPI0914554A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
BRPI0914554A 2008-08-11 2009-08-03 substrativo flexível e estrutura de circuito elétrico BRPI0914554A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008207186 2008-08-11
PCT/JP2009/063726 WO2010018759A1 (ja) 2008-08-11 2009-08-03 フレキシブル基板および電気回路構造体

Publications (1)

Publication Number Publication Date
BRPI0914554A2 true BRPI0914554A2 (pt) 2015-12-15

Family

ID=41668904

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0914554A BRPI0914554A2 (pt) 2008-08-11 2009-08-03 substrativo flexível e estrutura de circuito elétrico

Country Status (8)

Country Link
US (1) US8754332B2 (pt)
EP (1) EP2323466A1 (pt)
JP (1) JP5274564B2 (pt)
KR (1) KR101195688B1 (pt)
CN (1) CN102113421B (pt)
BR (1) BRPI0914554A2 (pt)
RU (1) RU2458491C1 (pt)
WO (1) WO2010018759A1 (pt)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5452290B2 (ja) * 2010-03-05 2014-03-26 ラピスセミコンダクタ株式会社 表示パネル
CN103930035B (zh) * 2011-08-05 2016-06-29 柯尼卡美能达株式会社 超声波探头及使用于超声波探头的可挠性基板
CN106406594B (zh) * 2011-11-27 2019-07-16 宸鸿科技(厦门)有限公司 触控感测装置及其制造方法
WO2013095080A1 (ko) * 2011-12-23 2013-06-27 주식회사 엘지화학 터치패널 및 이를 포함하는 디스플레이 장치
US9282633B2 (en) * 2012-05-30 2016-03-08 Shenzhen China Star Optoelectronics Technology Co., Ltd Routing structure and display panel
KR101904730B1 (ko) 2012-07-31 2018-10-08 삼성디스플레이 주식회사 테이프 패키지 및 이를 포함하는 표시 장치
CN103269563B (zh) * 2013-04-27 2016-03-16 合肥京东方光电科技有限公司 覆晶薄膜柔性电路板及显示装置
US9723725B2 (en) * 2013-05-29 2017-08-01 Finisar Corporation Rigid-flexible circuit interconnects
KR102257119B1 (ko) * 2013-06-17 2021-05-31 삼성디스플레이 주식회사 어레이 기판 및 이를 포함하는 유기 발광 표시 장치
US9472507B2 (en) 2013-06-17 2016-10-18 Samsung Display Co., Ltd. Array substrate and organic light-emitting display including the same
JP6286911B2 (ja) * 2013-07-26 2018-03-07 セイコーエプソン株式会社 実装構造、電気光学装置及び電子機器
KR20150037198A (ko) 2013-09-30 2015-04-08 삼성디스플레이 주식회사 표시패널 및 이를 갖는 표시장치
JP2015075559A (ja) * 2013-10-08 2015-04-20 株式会社ジャパンディスプレイ 電子装置
KR102260060B1 (ko) * 2013-11-22 2021-06-04 삼성디스플레이 주식회사 표시 기판 및 이를 포함하는 표시 장치
KR102107456B1 (ko) * 2013-12-10 2020-05-08 삼성디스플레이 주식회사 플렉시블 표시 장치 및 이의 제조 방법
KR102330882B1 (ko) 2014-10-13 2021-11-25 삼성디스플레이 주식회사 표시 장치
KR102357489B1 (ko) * 2015-08-26 2022-02-03 삼성전자주식회사 전자 방해 잡음을 감소하기 위한 칩 온 필름 회로 기판과 이를 포함하는 디스플레이 장치
CN105578754B (zh) * 2016-02-25 2018-07-06 广东欧珀移动通信有限公司 软硬结合板及终端
CN107515497B (zh) * 2016-06-16 2020-07-17 群创光电股份有限公司 显示装置
JP2018170398A (ja) * 2017-03-30 2018-11-01 Smk株式会社 複合ケーブル
EP3422827B1 (en) * 2017-06-30 2024-04-24 LG Display Co., Ltd. Display device and method for fabricating the same
JP7039995B2 (ja) * 2017-12-25 2022-03-23 株式会社デンソー 監視装置
JP6958396B2 (ja) * 2018-01-31 2021-11-02 住友大阪セメント株式会社 フレキシブル基板及び光デバイス
GB2576524B (en) * 2018-08-22 2022-08-03 Pragmatic Printing Ltd Profiled Thermode
JP7145707B2 (ja) * 2018-09-19 2022-10-03 株式会社東芝 電子機器
KR102711136B1 (ko) * 2019-01-21 2024-09-27 삼성디스플레이 주식회사 표시 장치
KR20210018724A (ko) * 2019-08-09 2021-02-18 삼성디스플레이 주식회사 표시 패널 및 이를 포함하는 표시 장치

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3040834B2 (ja) * 1991-01-23 2000-05-15 ローム株式会社 サーマルプリントヘッド
JPH0685341B2 (ja) * 1991-09-27 1994-10-26 帝国通信工業株式会社 フレキシブル基板の端子構造
US5343616B1 (en) * 1992-02-14 1998-12-29 Rock Ltd Method of making high density self-aligning conductive networks and contact clusters
US5592199A (en) * 1993-01-27 1997-01-07 Sharp Kabushiki Kaisha Assembly structure of a flat type device including a panel having electrode terminals disposed on a peripheral portion thereof and method for assembling the same
TW293093B (pt) * 1994-09-08 1996-12-11 Hitachi Ltd
JP3013801B2 (ja) 1997-02-06 2000-02-28 セイコーエプソン株式会社 液晶表示装置の組立方法
JP3102392B2 (ja) * 1997-10-28 2000-10-23 日本電気株式会社 半導体デバイスおよびその製造方法
JPH11305254A (ja) * 1998-04-24 1999-11-05 Hitachi Ltd 液晶表示装置
JP3462135B2 (ja) * 1999-01-14 2003-11-05 シャープ株式会社 二次元画像検出器およびアクティブマトリクス基板並びに表示装置
TW508877B (en) * 1999-03-31 2002-11-01 Seiko Epson Corp Method of connecting electrode, narrow pitch connector, pitch changing device, micro-machine, piezoelectric actuator, electrostatic actuator, ink-injecting head, ink-injecting printer, LCD device, and electronic machine
JP2002032031A (ja) * 2000-05-12 2002-01-31 Seiko Epson Corp 電気光学装置の製造方法、端子の接続方法、電気光学装置および電子機器
JP3630116B2 (ja) * 2000-08-10 2005-03-16 セイコーエプソン株式会社 電気光学ユニットおよび電子機器
JP3721999B2 (ja) * 2001-03-14 2005-11-30 セイコーエプソン株式会社 液晶装置及び電子機器
JP3608614B2 (ja) * 2001-03-28 2005-01-12 株式会社日立製作所 表示装置
JP2002344097A (ja) 2001-05-14 2002-11-29 Matsushita Electric Ind Co Ltd 実装用基板及びこの基板を有する表示装置
JP2003031916A (ja) * 2001-07-19 2003-01-31 Alps Electric Co Ltd 印刷配線基板
JP2003107513A (ja) * 2001-09-27 2003-04-09 Citizen Watch Co Ltd 液晶表示装置
JP2004095756A (ja) * 2002-08-30 2004-03-25 Seiko Instruments Inc 半導体パッケージおよびその製造方法、並びに電子装置
JP2005062582A (ja) * 2003-08-18 2005-03-10 Hitachi Displays Ltd 表示装置
JP4060806B2 (ja) * 2004-01-09 2008-03-12 日本オプネクスト株式会社 硬質回路基板とフレキシブル基板との接続構造、接続方法及びそれを用いた回路モジュール
US7176889B2 (en) * 2004-05-21 2007-02-13 Interlink Electronics, Inc. Force sensing pointing device with click function
JP2006030630A (ja) 2004-07-16 2006-02-02 Optrex Corp 表示装置
JP4277777B2 (ja) * 2004-09-28 2009-06-10 セイコーエプソン株式会社 実装構造体、実装用基板、電気光学装置及び電子機器
JP2006119321A (ja) 2004-10-21 2006-05-11 Kofu Casio Co Ltd 電気回路間の導通接続構造
JP4607612B2 (ja) * 2005-02-09 2011-01-05 日東電工株式会社 配線回路基板およびその製造方法
US7710739B2 (en) * 2005-04-28 2010-05-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display device
US20090039495A1 (en) * 2005-10-05 2009-02-12 Sharp Kabushiki Kaisha Wiring substrate and display device including the same
WO2007039959A1 (ja) * 2005-10-05 2007-04-12 Sharp Kabushiki Kaisha 配線基板及びそれを備えた表示装置
JP4600263B2 (ja) * 2005-12-06 2010-12-15 エプソンイメージングデバイス株式会社 電気光学装置および電子機器
US7964800B2 (en) * 2006-05-25 2011-06-21 Fujikura Ltd. Printed wiring board, method for forming the printed wiring board, and board interconnection structure
JP2008078628A (ja) * 2006-08-25 2008-04-03 Canon Inc 電子モジュールおよびその製造方法
JP4560026B2 (ja) * 2006-10-04 2010-10-13 セイコーエプソン株式会社 フレキシブル基板及びこれを備えた電気光学装置、並びに電子機器
JP4934394B2 (ja) * 2006-10-12 2012-05-16 株式会社 日立ディスプレイズ 表示装置
JP5068067B2 (ja) * 2006-11-22 2012-11-07 株式会社ジャパンディスプレイイースト 表示装置および平面型表示装置
KR20080070420A (ko) 2007-01-26 2008-07-30 삼성전자주식회사 인쇄회로기판 및 이를 갖는 표시 패널 어셈블리
US7952548B2 (en) * 2007-03-09 2011-05-31 Samsung Mobile Display Co., Ltd. Electronic display device
CN101287329B (zh) * 2007-04-13 2011-04-20 群康科技(深圳)有限公司 显示装置
JP5260912B2 (ja) * 2007-07-31 2013-08-14 パナソニック液晶ディスプレイ株式会社 表示装置
US20100182530A1 (en) * 2007-09-28 2010-07-22 Sharp Kabushiki Kaisha Display cell
JP4980960B2 (ja) * 2008-03-14 2012-07-18 ラピスセミコンダクタ株式会社 テープ配線基板及び半導体チップパッケージ

Also Published As

Publication number Publication date
US8754332B2 (en) 2014-06-17
EP2323466A1 (en) 2011-05-18
KR101195688B1 (ko) 2012-10-30
JPWO2010018759A1 (ja) 2012-01-26
WO2010018759A1 (ja) 2010-02-18
CN102113421B (zh) 2013-12-25
US20110139493A1 (en) 2011-06-16
CN102113421A (zh) 2011-06-29
RU2458491C1 (ru) 2012-08-10
JP5274564B2 (ja) 2013-08-28
KR20110030685A (ko) 2011-03-23

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