BR112012004172A2 - estrutura de conexão de substrato e equipamento eletrônico - Google Patents

estrutura de conexão de substrato e equipamento eletrônico

Info

Publication number
BR112012004172A2
BR112012004172A2 BR112012004172A BR112012004172A BR112012004172A2 BR 112012004172 A2 BR112012004172 A2 BR 112012004172A2 BR 112012004172 A BR112012004172 A BR 112012004172A BR 112012004172 A BR112012004172 A BR 112012004172A BR 112012004172 A2 BR112012004172 A2 BR 112012004172A2
Authority
BR
Brazil
Prior art keywords
electronic equipment
connection structure
substrate connection
substrate
electronic
Prior art date
Application number
BR112012004172A
Other languages
English (en)
Inventor
Masahito Kawabata
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Publication of BR112012004172A2 publication Critical patent/BR112012004172A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
BR112012004172A 2009-08-27 2010-02-22 estrutura de conexão de substrato e equipamento eletrônico BR112012004172A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009196827A JP2011049375A (ja) 2009-08-27 2009-08-27 基板接続構造および電子機器
PCT/JP2010/001155 WO2011024332A1 (ja) 2009-08-27 2010-02-22 基板接続構造および電子機器

Publications (1)

Publication Number Publication Date
BR112012004172A2 true BR112012004172A2 (pt) 2016-03-29

Family

ID=43627456

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112012004172A BR112012004172A2 (pt) 2009-08-27 2010-02-22 estrutura de conexão de substrato e equipamento eletrônico

Country Status (4)

Country Link
US (1) US20120156948A1 (pt)
JP (1) JP2011049375A (pt)
BR (1) BR112012004172A2 (pt)
WO (1) WO2011024332A1 (pt)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103973943A (zh) * 2013-01-31 2014-08-06 鸿富锦精密工业（深圳）有限公司 双摄像头模组
US9651986B2 (en) * 2013-10-10 2017-05-16 Kabushiki Kaisha Toshiba Electronic apparatus
JP6296947B2 (ja) * 2014-09-02 2018-03-20 日立オートモティブシステムズ株式会社 電子制御装置及びその放熱方法
CN105578730B (zh) * 2016-02-25 2018-07-06 广东欧珀移动通信有限公司 软硬结合板及移动终端
JP6513134B2 (ja) * 2017-05-26 2019-05-15 レノボ・シンガポール・プライベート・リミテッド ケーブル接続構造及びケーブル接続方法
CN108449864B (zh) * 2018-05-18 2024-04-30 湖南粤港模科实业有限公司 一种十字型fpc导电软板

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5418691A (en) * 1990-02-07 1995-05-23 Canon Kabushiki Kaisha Two printed circuit boards superiposed on one another both having position registry marks
JPH0499574U (pt) * 1991-01-28 1992-08-27
US6040624A (en) * 1997-10-02 2000-03-21 Motorola, Inc. Semiconductor device package and method
CN1166265C (zh) * 1998-04-09 2004-09-08 精工爱普生株式会社 压接连接衬底、液晶装置及电子设备
EP1085788A3 (en) * 1999-09-14 2003-01-02 Seiko Epson Corporation Composite flexible wiring board, method of manufacturing the same, electro-optical device, and electronic equipment
DE10111389A1 (de) * 2001-03-09 2002-09-12 Heidenhain Gmbh Dr Johannes Verbund aus flächigen Leiterelementen
JP4742441B2 (ja) * 2001-04-16 2011-08-10 日本電気株式会社 フレキシブルプリント回路と配線基板との接続構造、その接続方法、液晶表示装置及びその製造方法
JP2003249734A (ja) * 2002-02-25 2003-09-05 Nec Saitama Ltd 積層配線基板及びその製造方法
JP2004235580A (ja) * 2003-01-31 2004-08-19 Optrex Corp ハンダ付け用ランドを有する基板
JP2005166780A (ja) * 2003-12-01 2005-06-23 Nissan Motor Co Ltd フレキシブル回路基板および複合回路基板
JP3853822B2 (ja) * 2005-02-25 2006-12-06 株式会社アドバンスト・ディスプレイ 実装部品およびこれを使用した液晶表示パネル、並びにこの液晶表示パネルの製造方法
JP2006253569A (ja) * 2005-03-14 2006-09-21 Mitsubishi Electric Corp フレキシブル配線基板およびこれを用いた半導体装置
JP2007266070A (ja) * 2006-03-27 2007-10-11 Fujikura Ltd プリント回路基板及びプリント回路基板接続構造
JP2007294619A (ja) * 2006-04-24 2007-11-08 Nec Saitama Ltd 放熱構造
JP2008098613A (ja) * 2006-09-12 2008-04-24 Sumitomo Bakelite Co Ltd フレキシブルプリント回路板
JP5194584B2 (ja) * 2006-11-27 2013-05-08 日産自動車株式会社 配線基板、及び積層型蓄電デバイス

Also Published As

Publication number Publication date
WO2011024332A1 (ja) 2011-03-03
US20120156948A1 (en) 2012-06-21
JP2011049375A (ja) 2011-03-10

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Legal Events

Date Code Title Description
B11A Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
B11Y Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette]