BR9912722A - Sistema e processo para fundir e evaporar continuamente um material sólido, sistema de revestimento por deposição de vapor, eletrodo continuamente alimentado, aparelho de descarga de arco elétrico , processos para produzir uma descarga de arco elétrico, para revestir por deposição de vapor, para ionizar um vapor de revestimento, para medir o grau de ionização e a taxa de evaporação a partir de um evaporador em um sistema de revestimento por deposição de vapor e para remover material depositado em uma célula de vácuo por um vapor de revestimento - Google Patents

Sistema e processo para fundir e evaporar continuamente um material sólido, sistema de revestimento por deposição de vapor, eletrodo continuamente alimentado, aparelho de descarga de arco elétrico , processos para produzir uma descarga de arco elétrico, para revestir por deposição de vapor, para ionizar um vapor de revestimento, para medir o grau de ionização e a taxa de evaporação a partir de um evaporador em um sistema de revestimento por deposição de vapor e para remover material depositado em uma célula de vácuo por um vapor de revestimento

Info

Publication number
BR9912722A
BR9912722A BR9912722-9A BR9912722A BR9912722A BR 9912722 A BR9912722 A BR 9912722A BR 9912722 A BR9912722 A BR 9912722A BR 9912722 A BR9912722 A BR 9912722A
Authority
BR
Brazil
Prior art keywords
coating
vapor deposition
arc discharge
vapor
electric arc
Prior art date
Application number
BR9912722-9A
Other languages
English (en)
Inventor
George Plester
Horst Ehrich
Original Assignee
Coca Cola Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Coca Cola Co filed Critical Coca Cola Co
Publication of BR9912722A publication Critical patent/BR9912722A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/246—Replenishment of source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325—Electric arc evaporation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Plasma Technology (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

"SISTEMA E PROCESSO PARA FUNDIR E EVAPORAR CONTINUAMENTE UM MATERIAL SóLIDO, SISTEMA DE REVESTIMENTO POR DEPOSIçãO DE VAPOR, ELETRODO CONTINUAMENTE ALIMENTADO, APARELHO DE DESCARGA DE ARCO ELéTRICO, PROCESSOS PARA PRODUZIR UMA DESCARGA DE ARCO ELéTRICO, PARA REVESTIR POR DEPOSIçãO DE VAPOR, PARA IONIZAR UM VAPOR DE REVESTIMENTO, PARA MEDIR O GRAU DE IONIZAçãO E A TAXA DE EVAPORAçãO A PARTIR DE UM EVAPORADOR EM UM SISTEMA DE REVESTIMENTO POR DEPOSIçãO DE VAPOR E PARA REMOVER MATERIAL DE POSITADO EM UMA CéLULA DE VáCUO POR UM VAPOR DE REVESTIMENTO". Aparelhos e processo para uso em revestimento por deposição de vapor a vácuo asseguram operação mais simples, económica e contínua. Um sistema e processo para continuamente efetuar a fusão e evaporação de um material sólido para formar um vapor de revestimento inclui o uso de um cadinho de fusão em separado e cadinho de evaporação. Um sistema e processo para energizar os sólidos evaporáveis para formar um plasma que compreende primeiro e segundo eletrodos e um dispositivo para seletivamente comutar a polaridade entre os primeiro e segundo eletrodos para evitar a deposição de vapor de revestimento sobre os eletrodos. Outro sistema e processo para energizar os sólidos evaporáveis para formar um plasma que incluem um aparelho de descarga de arco elétrico com uma parte catódica e uma parte anódica. Um eletrodo continuamente alimentado é apresentado para contínua vaporização de membros de eletrodo em uma descarga de arco elétrico. Um aparelho e processo asseguram a medição da taxa de evaporação de um evaporador e o grau de ionização em um sistema de revestimento por deposição de vapor. Finalmente, um sistema é apresentado para limpeza in situ de depósitos vaporizáveis para limpeza do recinto do sistema de deposição de vapor a vácuo.
BR9912722-9A 1998-08-03 1999-07-14 Sistema e processo para fundir e evaporar continuamente um material sólido, sistema de revestimento por deposição de vapor, eletrodo continuamente alimentado, aparelho de descarga de arco elétrico , processos para produzir uma descarga de arco elétrico, para revestir por deposição de vapor, para ionizar um vapor de revestimento, para medir o grau de ionização e a taxa de evaporação a partir de um evaporador em um sistema de revestimento por deposição de vapor e para remover material depositado em uma célula de vácuo por um vapor de revestimento BR9912722A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/128,456 US6251233B1 (en) 1998-08-03 1998-08-03 Plasma-enhanced vacuum vapor deposition system including systems for evaporation of a solid, producing an electric arc discharge and measuring ionization and evaporation
PCT/US1999/015828 WO2000008226A2 (en) 1998-08-03 1999-07-14 Vapor deposition system

Publications (1)

Publication Number Publication Date
BR9912722A true BR9912722A (pt) 2001-05-02

Family

ID=22435473

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9912722-9A BR9912722A (pt) 1998-08-03 1999-07-14 Sistema e processo para fundir e evaporar continuamente um material sólido, sistema de revestimento por deposição de vapor, eletrodo continuamente alimentado, aparelho de descarga de arco elétrico , processos para produzir uma descarga de arco elétrico, para revestir por deposição de vapor, para ionizar um vapor de revestimento, para medir o grau de ionização e a taxa de evaporação a partir de um evaporador em um sistema de revestimento por deposição de vapor e para remover material depositado em uma célula de vácuo por um vapor de revestimento

Country Status (12)

Country Link
US (3) US6251233B1 (pt)
EP (1) EP1109944A2 (pt)
JP (1) JP2002522637A (pt)
KR (1) KR20010083127A (pt)
CN (1) CN1348509A (pt)
AR (5) AR016735A1 (pt)
AU (1) AU4990699A (pt)
BR (1) BR9912722A (pt)
CA (1) CA2338352A1 (pt)
CO (2) CO5111049A1 (pt)
IL (1) IL140811A0 (pt)
WO (1) WO2000008226A2 (pt)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6223683B1 (en) * 1997-03-14 2001-05-01 The Coca-Cola Company Hollow plastic containers with an external very thin coating of low permeability to gases and vapors through plasma-assisted deposition of inorganic substances and method and system for making the coating
DE10024827B4 (de) * 1999-11-17 2008-03-27 Applied Materials Gmbh & Co. Kg Elektrodenanordnung und ihre Verwendung
TW490714B (en) * 1999-12-27 2002-06-11 Semiconductor Energy Lab Film formation apparatus and method for forming a film
US20020011205A1 (en) 2000-05-02 2002-01-31 Shunpei Yamazaki Film-forming apparatus, method of cleaning the same, and method of manufacturing a light-emitting device
US7517551B2 (en) * 2000-05-12 2009-04-14 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a light-emitting device
US6599584B2 (en) 2001-04-27 2003-07-29 The Coca-Cola Company Barrier coated plastic containers and coating methods therefor
DE10130666A1 (de) * 2001-06-28 2003-01-23 Applied Films Gmbh & Co Kg Softcoat
SG113448A1 (en) * 2002-02-25 2005-08-29 Semiconductor Energy Lab Fabrication system and a fabrication method of a light emitting device
US7309269B2 (en) * 2002-04-15 2007-12-18 Semiconductor Energy Laboratory Co., Ltd. Method of fabricating light-emitting device and apparatus for manufacturing light-emitting device
AU2003226307A1 (en) * 2002-04-15 2003-11-03 Colormatrix Corporation Coating composition containing an epoxide additive and structures coated therewith
US20040035360A1 (en) * 2002-05-17 2004-02-26 Semiconductor Energy Laboratory Co., Ltd. Manufacturing apparatus
TWI336905B (en) * 2002-05-17 2011-02-01 Semiconductor Energy Lab Evaporation method, evaporation device and method of fabricating light emitting device
KR100838065B1 (ko) 2002-05-31 2008-06-16 삼성에스디아이 주식회사 박막증착기용 고정장치와 이를 이용한 고정방법
US20030221620A1 (en) * 2002-06-03 2003-12-04 Semiconductor Energy Laboratory Co., Ltd. Vapor deposition device
US7601225B2 (en) * 2002-06-17 2009-10-13 Asm International N.V. System for controlling the sublimation of reactants
EP1560467B1 (en) * 2002-07-19 2014-02-26 LG Display Co., Ltd. Source for thermal physical vapor deposition of organic electroluminescent layers
US20040123804A1 (en) 2002-09-20 2004-07-01 Semiconductor Energy Laboratory Co., Ltd. Fabrication system and manufacturing method of light emitting device
DE10354625A1 (de) * 2003-11-22 2005-06-30 Sig Technology Ltd. Verfahren zur Bestimmung der Gasdurchlässigkeit von Behälterwandungen, Behälter mit Oberflächenbeschichtung sowie Beschichtungseinrichtung mit Messvorrichtung
US7513953B1 (en) 2003-11-25 2009-04-07 Nano Scale Surface Systems, Inc. Continuous system for depositing films onto plastic bottles and method
US7232588B2 (en) * 2004-02-23 2007-06-19 Eastman Kodak Company Device and method for vaporizing temperature sensitive materials
US20050244580A1 (en) * 2004-04-30 2005-11-03 Eastman Kodak Company Deposition apparatus for temperature sensitive materials
JP4668561B2 (ja) * 2004-07-30 2011-04-13 株式会社アルバック 成膜材料供給装置
DE102005049906B4 (de) * 2005-10-17 2009-12-03 Von Ardenne Anlagentechnik Gmbh Verfahren und Vorrichtung zur Verdampfung von Verdampfungsmaterial
US8261690B2 (en) * 2006-07-14 2012-09-11 Georgia Tech Research Corporation In-situ flux measurement devices, methods, and systems
US8133367B1 (en) * 2006-08-11 2012-03-13 Raytheon Company Sputtering system and method using a loose granular sputtering target
AT503646B1 (de) * 2006-09-15 2007-12-15 Fronius Int Gmbh Wasserdampfplasmabrenner und verfahren zur verschleisserkennung und prozessregelung bei einem solchen wasserdampfplasmabrenner
EP1967606A1 (en) * 2007-03-08 2008-09-10 Applied Materials, Inc. Evaporation crucible and evaporation apparatus with adapted evaporation characteristic
US8061353B2 (en) 2007-03-09 2011-11-22 Global Medical Holdings LLC Method and apparatus for delivering a dose of a gaseous drug to a patient
EP1972699A1 (fr) * 2007-03-20 2008-09-24 ArcelorMittal France Procede de revetement d'un substrat et installation de depot sous vide d'alliage metallique
KR101167547B1 (ko) * 2007-03-26 2012-07-20 가부시키가이샤 알박 증착원, 증착 장치, 성막 방법
EP2025773A1 (en) * 2007-07-19 2009-02-18 Applied Materials, Inc. Vacuum evaporation apparatus for solid materials
US7883745B2 (en) * 2007-07-30 2011-02-08 Micron Technology, Inc. Chemical vaporizer for material deposition systems and associated methods
DE102008026001B4 (de) * 2007-09-04 2012-02-16 Von Ardenne Anlagentechnik Gmbh Verfahren und Vorrichtung zur Erzeugung und Bearbeitung von Schichten auf Substraten unter definierter Prozessatmosphäre und Heizelement
JP5228437B2 (ja) * 2007-10-19 2013-07-03 東京エレクトロン株式会社 処理装置及びその使用方法
US20090317547A1 (en) * 2008-06-18 2009-12-24 Honeywell International Inc. Chemical vapor deposition systems and methods for coating a substrate
US8343583B2 (en) * 2008-07-10 2013-01-01 Asm International N.V. Method for vaporizing non-gaseous precursor in a fluidized bed
JP2010144221A (ja) * 2008-12-18 2010-07-01 Tokyo Electron Ltd 原料ガス発生装置及び成膜装置
EP2398933B1 (en) 2009-02-18 2013-08-07 Council of Scientific & Industrial Research Process to deposit diamond like carbon as protective coating on inner surface of a shaped object
KR100936378B1 (ko) * 2009-04-27 2010-01-13 에스엔유 프리시젼 주식회사 원료 공급 유닛과 박막 증착 장치 및 박막 증착 방법
EP2369033A1 (de) * 2010-03-26 2011-09-28 Saint-Gobain Glass France Verfahren zum Nachfüllen einer Verdampferkammer
US9443703B2 (en) 2011-12-19 2016-09-13 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Apparatus for generating a hollow cathode arc discharge plasma
TWI477625B (zh) * 2012-12-26 2015-03-21 Au Optronics Corp 蒸鍍裝置
US9527107B2 (en) * 2013-01-11 2016-12-27 International Business Machines Corporation Method and apparatus to apply material to a surface
JP2014136827A (ja) * 2013-01-18 2014-07-28 Hitachi High-Technologies Corp 蒸着装置およびこれに用いる蒸発源
KR101432514B1 (ko) * 2013-01-29 2014-08-21 한국기초과학지원연구원 플라즈마 보조 물리 기상 증착원
EP3085808B1 (en) * 2013-12-19 2019-03-20 Posco Heating apparatus and coating machine having same
RU2703751C2 (ru) * 2014-09-18 2019-10-22 ТюссенКрупп Стил Еуроп АГ Устройство для формирования покрытий на поверхностях элемента, ленточного материала или инструмента
TWI595110B (zh) * 2016-06-30 2017-08-11 Jung Tsai Weng Preparation of Multivariate Alloy Reactive Coating by Vacuum Ion Evaporation
CN106119781B (zh) * 2016-07-27 2018-10-30 京东方科技集团股份有限公司 蒸发装置、蒸镀设备和蒸镀方法
WO2018020296A1 (en) 2016-07-27 2018-02-01 Arcelormittal Apparatus and method for vacuum deposition
US10801101B2 (en) * 2017-08-17 2020-10-13 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Vapor evaporation source
TWI634221B (zh) * 2017-09-01 2018-09-01 行政院原子能委員會核能硏究所 電化學元件之製造方法
CN107881485B (zh) * 2017-11-01 2019-10-01 深圳市华星光电半导体显示技术有限公司 等离子体增强化学气相沉积设备及oled面板的封装方法
GB2574400B (en) * 2018-06-04 2022-11-23 Dyson Technology Ltd A Device

Family Cites Families (79)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2665226A (en) 1950-04-27 1954-01-05 Nat Res Corp Method and apparatus for vapor coating
US2664852A (en) 1950-04-27 1954-01-05 Nat Res Corp Vapor coating apparatus
US3016873A (en) 1959-01-26 1962-01-16 Nat Res Corp Coating
US2996037A (en) 1959-01-26 1961-08-15 Nat Res Corp Vacuum coating apparatus
US3511703A (en) 1963-09-20 1970-05-12 Motorola Inc Method for depositing mixed oxide films containing aluminum oxide
GB1103211A (en) 1965-01-08 1968-02-14 Mullard Ltd Improvements in and relating to vapour deposition and evaporation sources
US3625848A (en) * 1968-12-26 1971-12-07 Alvin A Snaper Arc deposition process and apparatus
US4024399A (en) * 1975-01-06 1977-05-17 Jersey Nuclear-Avco Isotopes, Inc. Method and apparatus for measuring vapor flow in isotope separation
JPS543853A (en) 1977-06-13 1979-01-12 Onoda Cement Co Ltd Removing device of excess powder for electrostatidc powder coating
JPS5779621A (en) 1980-11-05 1982-05-18 Mitsubishi Electric Corp Plasma processing device
CH645137A5 (de) 1981-03-13 1984-09-14 Balzers Hochvakuum Verfahren und vorrichtung zum verdampfen von material unter vakuum.
JPS57169088A (en) 1981-04-09 1982-10-18 Olympus Optical Co Ltd Crucible
US4532196A (en) 1982-01-25 1985-07-30 Stanley Electric Co., Ltd. Amorphous silicon photoreceptor with nitrogen and boron
DE3239131A1 (de) 1982-10-22 1984-04-26 Ulrich 8950 Kaufbeuren Goetz Verfahren zur thermischen verdampfung von metallen im vakuum
JPS59128281A (ja) 1982-12-29 1984-07-24 信越化学工業株式会社 炭化けい素被覆物の製造方法
GB2139647B (en) 1983-02-24 1986-11-19 Boc Group Plc Bottle coated ion-plating or magnetron sputtering
US4573429A (en) 1983-06-03 1986-03-04 Nordson Corporation Process for coating substrates with aqueous polymer dispersions
US4552791A (en) 1983-12-09 1985-11-12 Cosden Technology, Inc. Plastic container with decreased gas permeability
US5096558A (en) 1984-04-12 1992-03-17 Plasco Dr. Ehrich Plasma - Coating Gmbh Method and apparatus for evaporating material in vacuum
DE3413891A1 (de) 1984-04-12 1985-10-17 Horst Dipl.-Phys. Dr. 4270 Dorsten Ehrich Verfahren und vorrichtung zum verdampfen von material in vakuum
US4634605A (en) 1984-05-23 1987-01-06 Wiesmann Harold J Method for the indirect deposition of amorphous silicon and polycrystalline silicone and alloys thereof
US4615916A (en) 1984-06-25 1986-10-07 Owens-Illinois, Inc. Surface treatment of glass containers
JPS61104075A (ja) 1984-10-23 1986-05-22 Hironobu Sato イオン化蒸発速度制御装置
US4752426A (en) 1985-06-27 1988-06-21 Yoshito Ikada Process for manufacture of plastic resinous tubes
US4697974A (en) 1986-01-24 1987-10-06 Trimedia Corporation Pallet-loading system
DE3623970A1 (de) 1986-07-16 1988-01-28 Leybold Heraeus Gmbh & Co Kg Transporteinrichtung mit rollensystemen fuer vakuum-beschichtungsanlagen
US4902531A (en) 1986-10-30 1990-02-20 Nihon Shinku Gijutsu Kabushiki Kaisha Vacuum processing method and apparatus
US5215640A (en) 1987-02-03 1993-06-01 Balzers Ag Method and arrangement for stabilizing an arc between an anode and a cathode particularly for vacuum coating devices
DE3881256D1 (de) 1987-03-06 1993-07-01 Balzers Hochvakuum Verfahren und vorrichtungen zum vakuumbeschichten mittels einer elektrischen bogenentladung.
NL8700620A (nl) 1987-03-16 1988-10-17 Hauzer Holding Kathode boogverdampingsinrichting alsmede werkwijze voor het bedrijven daarvan.
JPS63243264A (ja) 1987-03-31 1988-10-11 Matsushita Electric Ind Co Ltd 薄膜製造装置
JPS63312968A (ja) 1987-06-15 1988-12-21 Hitachi Ltd 溶解蒸発装置
US4888199A (en) 1987-07-15 1989-12-19 The Boc Group, Inc. Plasma thin film deposition process
DE3731444A1 (de) 1987-09-18 1989-03-30 Leybold Ag Vorrichtung zum beschichten von substraten
JPH01268859A (ja) 1988-04-20 1989-10-26 Casio Comput Co Ltd 透明導電膜の形成方法および形成装置
JPH02118064A (ja) 1988-10-27 1990-05-02 Mitsubishi Heavy Ind Ltd 真空蒸着装置
JPH02305963A (ja) * 1989-05-19 1990-12-19 Osaka Shinku Kiki Seisakusho:Kk イオンプレーティング装置に於ける材料蒸発速度検出装置及び材料蒸発速度制御装置
DD286375A5 (de) 1989-08-04 1991-01-24 ��@���������@�������k�� Bogenentladungsverdampfer mit mehreren verdampfertiegeln
JP2726118B2 (ja) 1989-09-26 1998-03-11 キヤノン株式会社 堆積膜形成法
JPH07110991B2 (ja) 1989-10-02 1995-11-29 株式会社日立製作所 プラズマ処理装置およびプラズマ処理方法
JPH0733576B2 (ja) * 1989-11-29 1995-04-12 株式会社日立製作所 スパツタ装置、及びターゲツト交換装置、並びにその交換方法
DE4006457C2 (de) 1990-03-01 1993-09-30 Balzers Hochvakuum Verfahren zum Verdampfen von Material in einer Vakuumaufdampfanlage sowie Anlage derselben
US5112644A (en) 1990-03-08 1992-05-12 Optical Coating Laboratory, Inc. Horizontal precession tooling and method for tube rotation
US5084356A (en) 1990-04-20 1992-01-28 E. I. Du Pont De Nemours And Company Film coated with glass barrier layer with metal dopant
CA2040638A1 (en) 1990-04-20 1991-10-21 Gedeon I. Deak Barrier materials useful for packaging
US5085904A (en) 1990-04-20 1992-02-04 E. I. Du Pont De Nemours And Company Barrier materials useful for packaging
DE4114108C1 (pt) 1991-04-30 1991-12-19 Schott Glaswerke, 6500 Mainz, De
DE4026494A1 (de) 1990-08-22 1992-02-27 Ehrich Plasma Coating Vorrichtung zur materialverdampfung mittels vakuumlichtbogenentladung und verfahren
DE4100541C1 (pt) 1991-01-10 1992-01-16 Plasco Dr. Ehrich Plasma-Coating Gmbh, 6501 Heidesheim, De
DE59202116D1 (de) 1991-04-23 1995-06-14 Balzers Hochvakuum Verfahren zur Abtragung von Material von einer Oberfläche in einer Vakuumkammer.
DE69208793T2 (de) 1991-10-03 1996-09-19 Becton Dickinson Co Blutentnahmeröhrchen
EP0812779B1 (en) 1991-12-26 2000-08-09 Toyo Boseki Kabushiki Kaisha A gas barrier film
DE4200429A1 (de) 1992-01-10 1993-07-15 Ehrich Plasma Coating Verfahren zur ionisation thermisch erzeugter materialdaempfe und vorrichtung zur durchfuehrung des verfahrens
GB2263472B (en) 1992-01-14 1995-09-06 Stalplex Limited Handling and processing plastics bottles
DE4203371C1 (pt) 1992-02-06 1993-02-25 Multi-Arc Oberflaechentechnik Gmbh, 5060 Bergisch Gladbach, De
CH689767A5 (de) * 1992-03-24 1999-10-15 Balzers Hochvakuum Verfahren zur Werkstueckbehandlung in einer Vakuumatmosphaere und Vakuumbehandlungsanlage.
MX9303141A (es) 1992-05-28 1994-04-29 Polar Materials Inc Metodos y aparatos para depositar recubrimientos de barrera.
US5308649A (en) 1992-06-26 1994-05-03 Polar Materials, Inc. Methods for externally treating a container with application of internal bias gas
US5462779A (en) 1992-10-02 1995-10-31 Consorzio Ce.Te.V. Centro Tecnologie Del Vuoto Thin film multilayer structure as permeation barrier on plastic film
US5670224A (en) 1992-11-13 1997-09-23 Energy Conversion Devices, Inc. Modified silicon oxide barrier coatings produced by microwave CVD deposition on polymeric substrates
DE4305721C1 (de) * 1993-02-25 1994-07-21 Dresden Vakuumtech Gmbh Niedervoltbogenverdampfer mit Nachfütterungseinrichtung und Verfahren zu dessen Verwendung
ES2117789T3 (es) 1993-06-01 1998-08-16 Kautex Textron Gmbh & Co Kg Procedimiento para producir un recubrimiento polimero en cuerpos huecos de materia plastica.
JPH0794421A (ja) 1993-09-21 1995-04-07 Anelva Corp アモルファスシリコン薄膜の製造方法
US5364666A (en) 1993-09-23 1994-11-15 Becton, Dickinson And Company Process for barrier coating of plastic objects
DE4343042C1 (de) * 1993-12-16 1995-03-09 Fraunhofer Ges Forschung Verfahren und Einrichtung zum plasmaaktivierten Bedampfen
CH687601A5 (de) 1994-02-04 1997-01-15 Tetra Pak Suisse Sa Verfahren zur Herstellung von im Innern sterilen Verpackungen mit hervorragenden Sperreigenschaften.
US5565248A (en) 1994-02-09 1996-10-15 The Coca-Cola Company Method and apparatus for coating hollow containers through plasma-assisted deposition of an inorganic substance
DE4412906C1 (de) * 1994-04-14 1995-07-13 Fraunhofer Ges Forschung Verfahren und Einrichtung für die ionengestützte Vakuumbeschichtung
US5521351A (en) 1994-08-30 1996-05-28 Wisconsin Alumni Research Foundation Method and apparatus for plasma surface treatment of the interior of hollow forms
US5510155A (en) 1994-09-06 1996-04-23 Becton, Dickinson And Company Method to reduce gas transmission
JPH0892764A (ja) 1994-09-22 1996-04-09 Nec Kyushu Ltd スパッタ装置
DE4444763C2 (de) 1994-12-19 1996-11-21 Apvv Angewandte Plasma Vakuum Elektrode zur Materialverdampfung für die Beschichtung von Substraten
DE19600993A1 (de) 1995-01-13 1996-08-08 Technics Plasma Gmbh Vorrichtung und Verfahren zur anodischen Verdampfung eines Materials mittels einer Vakuumlichtbogenentladung
DE19546827C2 (de) 1995-12-15 1999-03-25 Fraunhofer Ges Forschung Einrichtung zur Erzeugung dichter Plasmen in Vakuumprozessen
US5558720A (en) 1996-01-11 1996-09-24 Thermacore, Inc. Rapid response vapor source
EP0785291A1 (en) 1996-01-19 1997-07-23 The Boc Group, Inc. Electron beam evaporation system
US5691007A (en) 1996-09-30 1997-11-25 Becton Dickinson And Company Process for depositing barrier film on three-dimensional articles
US6223683B1 (en) 1997-03-14 2001-05-01 The Coca-Cola Company Hollow plastic containers with an external very thin coating of low permeability to gases and vapors through plasma-assisted deposition of inorganic substances and method and system for making the coating
DE19807032A1 (de) 1998-02-19 1999-08-26 Leybold Systems Gmbh Verfahren und Vorrichtung zum Transportieren zu beschichtender zylindrischer Substrate

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US20010022272A1 (en) 2001-09-20
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US6251233B1 (en) 2001-06-26
AR025066A2 (es) 2002-11-06
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CN1348509A (zh) 2002-05-08
AR025065A2 (es) 2002-11-06
US20030007786A1 (en) 2003-01-09
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