BR0005434A - Combinação de eletrodos - Google Patents

Combinação de eletrodos

Info

Publication number
BR0005434A
BR0005434A BR0005434-8A BR0005434A BR0005434A BR 0005434 A BR0005434 A BR 0005434A BR 0005434 A BR0005434 A BR 0005434A BR 0005434 A BR0005434 A BR 0005434A
Authority
BR
Brazil
Prior art keywords
combination
material surface
evaporation
electrodes
cathodic
Prior art date
Application number
BR0005434-8A
Other languages
English (en)
Inventor
Thomas Gebele
Stefan Bangert
Dra Elisabeth Budke
Helmut Dr Grimm
Juergen Henrich
Juergen Honekamp
Juergen Ulrich
Original Assignee
Leybold Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10024827A external-priority patent/DE10024827B4/de
Application filed by Leybold Ag filed Critical Leybold Ag
Publication of BR0005434A publication Critical patent/BR0005434A/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32055—Arc discharge
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325—Electric arc evaporation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32422—Arrangement for selecting ions or species in the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Plasma Technology (AREA)
  • Wrappers (AREA)
  • Laminated Bodies (AREA)

Abstract

Patente de Invenção para <B>"COMBINAçãO DE ELETRODOS"<D> Uma combinação de eletrodos para revestimento de apoio ao plasma de um substrato (3) com uma camada de material compreendendo, pelo menos, um primeiro e um segundo componente de material, e para a produção de uma descarga de plasma, mais especialmente uma descarga em arco (35), possuindo uma combinação de anodo (5), a qual provê um primeiro componente de material em uma superfície de material anódico (13) para evaporação, e uma combinação de catodo (7), a qual provê o segundo componente de material na superfície de material catódico (25). A combinação de eletrodo é caracterizada pelo fato da superfície de material catódico (25) ser constituída por uma parte de evaporação ativa (27), suportando a descarga do plasma (35), e uma parte de evaporação inativa (41), não suportando a descarga do plasma. Preferivelmente, um meio de produção de movimento (49) é provido para mover a parte da evaporação inativa (41) sobre a superfície de material catódico (25) de maneira a reduzir depósitos de material devido ao primeiro componente de material na superfície de material catódico (25).
BR0005434-8A 1999-11-17 2000-11-17 Combinação de eletrodos BR0005434A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19955373 1999-11-17
DE10024827A DE10024827B4 (de) 1999-11-17 2000-05-19 Elektrodenanordnung und ihre Verwendung

Publications (1)

Publication Number Publication Date
BR0005434A true BR0005434A (pt) 2001-07-03

Family

ID=26005752

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0005434-8A BR0005434A (pt) 1999-11-17 2000-11-17 Combinação de eletrodos

Country Status (10)

Country Link
US (1) US6881270B1 (pt)
EP (1) EP1103630B1 (pt)
JP (1) JP2001192815A (pt)
AR (1) AR026514A1 (pt)
AT (1) ATE256762T1 (pt)
AU (1) AU774818B2 (pt)
BR (1) BR0005434A (pt)
CA (1) CA2325901A1 (pt)
ES (1) ES2208203T3 (pt)
MX (1) MXPA00011145A (pt)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050136100A1 (en) * 1999-05-27 2005-06-23 Foss Manufacturing Co., Inc. Hollow anti-microbial fibers and fibrous products
ES2208203T3 (es) * 1999-11-17 2004-06-16 APPLIED FILMS GMBH &amp; CO. KG Disposicion de electrodos.
GB0404436D0 (en) * 2004-02-27 2004-03-31 Nanofilm Technologies Int Continuous arc deposition apparatus and method with multiple available targets
JP4373252B2 (ja) 2004-03-16 2009-11-25 浩史 滝川 プラズマ生成装置
KR100852114B1 (ko) * 2007-02-22 2008-08-13 삼성에스디아이 주식회사 플라즈마 건

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4868003A (en) * 1986-11-26 1989-09-19 Optical Coating Laboratory, Inc. System and method for vacuum deposition of thin films
DE3700633C2 (de) * 1987-01-12 1997-02-20 Reinar Dr Gruen Verfahren und Vorrichtung zum schonenden Beschichten elektrisch leitender Gegenstände mittels Plasma
US5009922A (en) * 1989-03-02 1991-04-23 Ashahi Glass Company, Ltd. Method of forming a transparent conductive film
DE4042337C1 (en) 1990-08-22 1991-09-12 Plasco Dr. Ehrich Plasma-Coating Gmbh, 6501 Heidesheim, De Controlling degree of ionisation of vapour for surface coating - by preventing straight line current flow between hot anode target surface and cold cathode by using movable wall between them
DE19724996C1 (de) * 1997-06-13 1998-09-03 Fraunhofer Ges Forschung Verfahren zum plasmaaktivierten Elektronenstrahlverdampfen und Einrichtung zur Durchführung des Verfahrens
JP3839930B2 (ja) * 1997-09-29 2006-11-01 スタンレー電気株式会社 薄膜作製装置及び薄膜作製方法
WO2000046418A1 (de) 1999-02-05 2000-08-10 Applied Films Gmbh & Co. Kg Vorrichtung zum beschichten von substraten mit einem materialdampf im unterdruck oder vakuum mit einer materialdampfquelle
ES2208203T3 (es) * 1999-11-17 2004-06-16 APPLIED FILMS GMBH &amp; CO. KG Disposicion de electrodos.

Also Published As

Publication number Publication date
AU774818B2 (en) 2004-07-08
ES2208203T3 (es) 2004-06-16
EP1103630B1 (de) 2003-12-17
MXPA00011145A (es) 2004-05-05
JP2001192815A (ja) 2001-07-17
EP1103630A1 (de) 2001-05-30
AU7164900A (en) 2001-05-24
ATE256762T1 (de) 2004-01-15
AR026514A1 (es) 2003-02-12
US6881270B1 (en) 2005-04-19
CA2325901A1 (en) 2001-05-17

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Legal Events

Date Code Title Description
PCP Transfer pending
PCR Transfer refused
PC Transfer

Owner name: BALZERS PROCESS SYSTEMS GMBH (DE)

PC Transfer

Owner name: LEYBOLD COATING GMBH & CO KG (DE)

PC Transfer

Owner name: LEYBOLD COATING GMBH & CO KG (DE)

HKT Transfer or change (deleted)
B25D Requested change of name of applicant approved
B25F Entry of change of name and/or headquarter and transfer of application, patent and certif. of addition of invention: change of name on requirement

Owner name: APPLIED FILMS GMBH AND CO. KG (DE)

Free format text: A FIM DE ATENDER O SOLICITADO NA PETICAO DE ALTERACAO DE NOME NO 020070023563/RJ DE 26/02/2007, QUEIRA APRESENTAR DOCUMENTO ONDE CONSTE QUE A REQUERENTE ALTEROU SUA DENOMINACAO SOCIAL.

B25L Entry of change of name and/or headquarter and transfer of application, patent and certificate of addition of invention: publication cancelled

Owner name: APPLIED FILMS GMBH AND CO. KG (DE)

Free format text: ANULADA A EXIGENCIA PUBLICADA NA RPI 1896 DE 08/05/2007, POR TER SIDO INDEVIDA.

B25D Requested change of name of applicant approved

Owner name: APPLIED MATERIALS GMBH AND CO. KG (DE)

Free format text: ALTERADO DE: APPLIED FILMS GMBH AND CO. KG

B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 14A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2280 DE 16/09/2014.