BR8501541A - Capacitor eletrico como componente-chip,bem como processo para sua fabricacao - Google Patents

Capacitor eletrico como componente-chip,bem como processo para sua fabricacao

Info

Publication number
BR8501541A
BR8501541A BR8501541A BR8501541A BR8501541A BR 8501541 A BR8501541 A BR 8501541A BR 8501541 A BR8501541 A BR 8501541A BR 8501541 A BR8501541 A BR 8501541A BR 8501541 A BR8501541 A BR 8501541A
Authority
BR
Brazil
Prior art keywords
capacitor
bands
metal
encapsulation
band
Prior art date
Application number
BR8501541A
Other languages
English (en)
Inventor
Ferdinand Utner
Herbert Bolz
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=6232544&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=BR8501541(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of BR8501541A publication Critical patent/BR8501541A/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H01F2027/295—Surface mounted devices with flexible terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10916—Terminals having auxiliary metallic piece, e.g. for soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type
BR8501541A 1984-04-03 1985-04-02 Capacitor eletrico como componente-chip,bem como processo para sua fabricacao BR8501541A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19843412492 DE3412492A1 (de) 1984-04-03 1984-04-03 Elektrischer kondensator als chip-bauelement

Publications (1)

Publication Number Publication Date
BR8501541A true BR8501541A (pt) 1985-11-26

Family

ID=6232544

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8501541A BR8501541A (pt) 1984-04-03 1985-04-02 Capacitor eletrico como componente-chip,bem como processo para sua fabricacao

Country Status (7)

Country Link
US (1) US4617609A (pt)
EP (1) EP0162149B1 (pt)
JP (1) JPS60225414A (pt)
AT (1) ATE44840T1 (pt)
BR (1) BR8501541A (pt)
DE (2) DE3412492A1 (pt)
ES (1) ES8702731A1 (pt)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0130386B1 (de) * 1983-06-03 1987-09-09 Wolfgang Westermann Kunststoffolien-Wickelkondensator
FR2581827B1 (fr) * 1985-05-10 1989-04-28 Europ Composants Electron Bande de connexion pour la fabrication de composants electriques a report direct et procede de fabrication de ces composants
US4801912A (en) * 1985-06-07 1989-01-31 American Precision Industries Inc. Surface mountable electronic device
US4934048A (en) * 1985-06-07 1990-06-19 American Precision Industries Inc. Method of making surface mountable electronic device
EP0229286B1 (de) * 1985-12-17 1990-03-28 Siemens Aktiengesellschaft Elektrisches Bauelement in Chip-Bauweise
DE3607225A1 (de) * 1986-03-05 1987-09-10 Siemens Ag Elektrisches bauelement in chip-bauweise und verfahren zu seiner herstellung
DE3731966C3 (de) * 1986-09-26 1995-02-09 Gen Electric Oberflächenmontierbarer Varistor
NL8602804A (nl) * 1986-11-06 1988-06-01 Philips Nv Werkwijze voor het aanbrengen van een aansluitdraad op een uiteinde van een condensator en condensator vervaardigd volgens die werkwijze.
DE3638342A1 (de) * 1986-11-10 1988-05-19 Siemens Ag Elektrisches bauelement aus keramik mit mehrlagenmetallisierung und verfahren zu seiner herstellung
FR2609207B1 (fr) * 1986-12-30 1989-10-20 Europ Composants Electron Barrette de connexions pour la fabrication de composants electriques
DE3866418D1 (de) * 1987-05-05 1992-01-09 Siemens Ag Elektrisches bauelement in chip-bauweise und verfahren zu seiner herstellung.
US4894746A (en) * 1987-06-06 1990-01-16 Murata Manufacturing Co., Ltd. Laminated capacitor with fuse function
AT393180B (de) * 1987-12-17 1991-08-26 Philips Nv Elektrolytkondensator und verfahren zur herstellung eines elektrolytkondensators
EP0327860A1 (de) * 1988-02-10 1989-08-16 Siemens Aktiengesellschaft Elektrisches Bauelement in Chip-Bauweise und Verfahren zu seiner Herstellung
DE3813435A1 (de) * 1988-04-21 1989-11-02 Siemens Ag Bauelement in chip-bauweise zum befestigen auf einer schaltplatte, mit einem elektrischen oder elektronischen funktionskoerper
DE3816024A1 (de) * 1988-05-10 1989-12-07 Roederstein Kondensatoren Traegerband mit anschlusslaschen fuer elektrische bauelemente und verfahren zum bestuecken des traegerbandes
EP0355205B1 (de) * 1988-08-16 1994-01-19 Koninklijke Philips Electronics N.V. Elektrolytkondensator
DE3829934C1 (en) * 1988-09-02 1990-02-22 Roederstein Spezialfabriken Fuer Bauelemente Der Elektronik Und Kondensatoren Der Starkstromtechnik Gmbh, 8300 Landshut, De Device for processing the plastic sheathing of electrical chip components on a carrier strip
US5075621A (en) * 1988-12-19 1991-12-24 International Business Machines Corporation Capacitor power probe
FR2640825B1 (fr) * 1988-12-20 1991-01-25 Europ Composants Electron Composant electrique a report direct
FR2641905B1 (fr) * 1988-12-23 1991-03-15 Europ Composants Electron Bande de connexions pour assemblage en ligne de composants cms
DE3921651A1 (de) * 1989-06-30 1991-01-10 Siemens Ag Mindestens sechsflaechiges elektronikbauteil fuer gedruckte schaltungen
DE4024312A1 (de) * 1990-07-31 1992-02-06 Roederstein Kondensatoren Chip-kondensator mit waermeleitsperre
DE4446566A1 (de) * 1994-12-24 1996-06-27 Telefunken Microelectron Mehrpoliges, oberflächenmontierbares, elektronisches Bauelement
US5771149A (en) * 1996-03-01 1998-06-23 Matsushita Electric Industrial Co., Ltd. Capacitor device
US6023403A (en) * 1996-05-03 2000-02-08 Littlefuse, Inc. Surface mountable electrical device comprising a PTC and fusible element
JPH10321407A (ja) * 1997-05-23 1998-12-04 Murata Mfg Co Ltd 表面実装型電子部品
GB9814317D0 (en) * 1997-07-23 1998-09-02 Murata Manufacturing Co Ceramic electronic part and method for producing the same
US6282072B1 (en) 1998-02-24 2001-08-28 Littelfuse, Inc. Electrical devices having a polymer PTC array
US6582647B1 (en) 1998-10-01 2003-06-24 Littelfuse, Inc. Method for heat treating PTC devices
US6574089B1 (en) * 1998-12-15 2003-06-03 Murata Manufacturing Co., Ltd. Monolithic ceramic capacitor
JP2002025852A (ja) * 2000-07-07 2002-01-25 Matsushita Electric Ind Co Ltd 電子部品
US6628498B2 (en) 2000-08-28 2003-09-30 Steven J. Whitney Integrated electrostatic discharge and overcurrent device
US7183891B2 (en) 2002-04-08 2007-02-27 Littelfuse, Inc. Direct application voltage variable material, devices employing same and methods of manufacturing such devices
CN100350606C (zh) 2002-04-08 2007-11-21 力特保险丝有限公司 使用压变材料的装置
US7132922B2 (en) 2002-04-08 2006-11-07 Littelfuse, Inc. Direct application voltage variable material, components thereof and devices employing same
KR100465234B1 (ko) * 2002-09-13 2005-01-13 삼성전자주식회사 테이프 레코더용 테이프-엔드 검출센서 전원공급장치
US7019396B2 (en) * 2003-07-15 2006-03-28 Murata Manufacturing Co., Ltd. Electronic chip component and method for manufacturing electronic chip component
JP4415744B2 (ja) * 2003-12-11 2010-02-17 パナソニック株式会社 電子部品
WO2005062318A1 (ja) * 2003-12-18 2005-07-07 Matsushita Electric Industrial Co., Ltd. 電子部品
US7133274B2 (en) * 2005-01-20 2006-11-07 Matsushita Electric Industrial Co., Ltd. Multilayer capacitor and mold capacitor
JP5075890B2 (ja) * 2008-09-03 2012-11-21 株式会社東芝 半導体装置及び半導体装置の製造方法
JP4867999B2 (ja) * 2009-01-20 2012-02-01 Ｔｄｋ株式会社 積層コンデンサ
DE102011086707A1 (de) 2011-11-21 2013-05-23 Robert Bosch Gmbh Schaltungsanordnung für elektronische und/oder elektrische Bauteile
US9357634B2 (en) 2012-04-27 2016-05-31 Kemet Electronics Corporation Coefficient of thermal expansion compensating compliant component
DE102013102278A1 (de) * 2013-03-07 2014-09-11 Epcos Ag Kondensatoranordnung
JP2016535445A (ja) * 2013-10-29 2016-11-10 ケメット エレクトロニクス コーポレーション 改良されたリード設計を有するセラミックコンデンサー
DE102014217933A1 (de) * 2014-09-08 2016-03-10 Continental Automotive Gmbh Elektromotor mit SMD-Bauteilen und zugehöriges Verbindungsteil
KR102139759B1 (ko) * 2015-01-20 2020-07-31 삼성전기주식회사 적층 세라믹 전자 부품
DE102015102866B4 (de) 2015-02-27 2023-02-02 Tdk Electronics Ag Keramisches Bauelement, Bauelementanordnung und Verfahren zur Herstellung eines keramischen Bauelements
JP6899246B2 (ja) * 2016-06-10 2021-07-07 モレックス エルエルシー 電子部品

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2673972A (en) * 1949-08-13 1954-03-30 Erie Resistor Corp Condenser
US3236936A (en) * 1962-07-30 1966-02-22 Corneil Dubilier Electric Corp Miniature electrical component with protected terminal-wire connections
US3439395A (en) * 1965-11-05 1969-04-22 Corning Glass Works Method of attaching leads to electrical components
US3670378A (en) * 1968-06-24 1972-06-20 Siemens Ag Process for the production of capacitors
US3728765A (en) * 1969-06-18 1973-04-24 Siemens Ag Process for the production of capacitors
US3739438A (en) * 1970-02-25 1973-06-19 Union Carbide Corp System for molding electronic components
US3612963A (en) * 1970-03-11 1971-10-12 Union Carbide Corp Multilayer ceramic capacitor and process
JPS4821146U (pt) * 1971-07-19 1973-03-10
US3740624A (en) * 1972-06-21 1973-06-19 Sprague Electric Co Monolithic capacitor having corner internal electrode terminations
US3778532A (en) * 1972-07-03 1973-12-11 Illinois Tool Works Electrical circuit component having solder preform connection means
US3766451A (en) * 1972-09-15 1973-10-16 Trw Inc Metallized capacitor with wire terminals
US4004200A (en) * 1975-07-21 1977-01-18 Johanson Manufacturing Corporation Chip capacitor with spring-like leads
US4158218A (en) * 1977-09-19 1979-06-12 Union Carbide Corporation Ceramic capacitor device
US4168520A (en) * 1978-01-06 1979-09-18 Sprague Electric Company, Inc. Monolithic ceramic capacitor with free-flowed protective coating and method for making same
US4247883A (en) * 1978-07-31 1981-01-27 Sprague Electric Company Encapsulated capacitor
US4205365A (en) * 1978-12-28 1980-05-27 Western Electric Company, Inc. Boxed capacitor with bimetallic terminals and method of making
US4288842A (en) * 1979-06-11 1981-09-08 Emhart Industries, Inc. Solid chip capacitor and method of manufacture
DE3120298C2 (de) * 1981-05-21 1983-07-07 Ernst Roederstein Spezialfabrik für Kondensatoren GmbH, 8300 Landshut Kondensator in Chip-Bauweise
DE3134617C2 (de) * 1981-09-01 1989-11-02 Ernst Roederstein Spezialfabrik für Kondensatoren GmbH, 8300 Landshut Folien-Kondensator
JPS5923723A (ja) * 1982-07-29 1984-02-07 Diesel Kiki Co Ltd カーエアコンの制御装置
EP0130386B1 (de) * 1983-06-03 1987-09-09 Wolfgang Westermann Kunststoffolien-Wickelkondensator
GB2141583A (en) * 1983-06-17 1984-12-19 Standard Telephones Cables Ltd Leadless capacitors

Also Published As

Publication number Publication date
US4617609A (en) 1986-10-14
ATE44840T1 (de) 1989-08-15
ES8702731A1 (es) 1986-12-16
EP0162149B1 (de) 1989-07-19
DE3412492A1 (de) 1985-10-03
JPS60225414A (ja) 1985-11-09
EP0162149A1 (de) 1985-11-27
DE3479067D1 (en) 1989-08-24
ES541880A0 (es) 1986-12-16

Similar Documents

Publication Publication Date Title
BR8501541A (pt) Capacitor eletrico como componente-chip,bem como processo para sua fabricacao
CN1077729C (zh) 复合电子组件及其制造方法
JPH02159008A (ja) 塔状縁部に埋込電極と端子を有するセラミック基板
US3886654A (en) Method of manufacturing laminated bus bars
JPS5934625A (ja) チツプ型固体電解コンデンサの製造方法
EP0180438B1 (en) Outer wrapping for a metallized wound capacitor
JP3542115B2 (ja) 固体電解コンデンサおよびその製造方法
MY122427A (en) Method of manufacturing electrical terminals and terminal modules
US4342881A (en) Laminated bus bar and method of manufacture
US4614995A (en) Hermetically sealed ceramic cased surface mount capacitor
GB997383A (en) Method of and apparatus for packaging modules
JPH0193081A (ja) フレキシブルテープコネクター部材の製造法
RU2072588C1 (ru) Способ сборки полупроводникового моста
JP2004119579A (ja) 電子部品内蔵コネクタの製造方法
JPS6249614A (ja) 電子部品の製造方法
JPH0629160A (ja) チップ形アルミ電解コンデンサ
SU982864A1 (ru) Электрод-инструмент дл электрохимического маркировани
DE102008004621A1 (de) Gestanzte Multilayer Leiterplatten
JPH06310362A (ja) リードフレーム及びその製造方法
JPH0215317Y2 (pt)
JPS60154516A (ja) チツプ状コンデンサの製造方法
JPS6356010A (ja) ３端子フイルタの製造方法
JPS59194421A (ja) チツプ型電子部品及びその製造方法
JPH0123936B2 (pt)
JPS6050051B2 (ja) チップ型固体電解コンデンサの製造法

Legal Events

Date Code Title Description
MM Lapse due to non-payment of fees (art. 50)
B15K Others concerning applications: alteration of classification

Ipc: H01G 2/06 (2006.01), H05K 3/34 (2006.0