ES8702731A1 - Perfeccionamientos en un condensador electrico - Google Patents

Perfeccionamientos en un condensador electrico

Info

Publication number
ES8702731A1
ES8702731A1 ES541880A ES541880A ES8702731A1 ES 8702731 A1 ES8702731 A1 ES 8702731A1 ES 541880 A ES541880 A ES 541880A ES 541880 A ES541880 A ES 541880A ES 8702731 A1 ES8702731 A1 ES 8702731A1
Authority
ES
Spain
Prior art keywords
capacitor
bands
metal
encapsulation
band
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES541880A
Other languages
English (en)
Other versions
ES541880A0 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=6232544&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES8702731(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Siemens AG filed Critical Siemens AG
Publication of ES8702731A1 publication Critical patent/ES8702731A1/es
Publication of ES541880A0 publication Critical patent/ES541880A0/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H01F2027/295—Surface mounted devices with flexible terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10916—Terminals having auxiliary metallic piece, e.g. for soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Ceramic Capacitors (AREA)
  • Organic Insulating Materials (AREA)
  • Pens And Brushes (AREA)

Abstract

MODIFICACIONES EN UN CONDENSADOR ELECTRICO. CONSISTENTES EN FORMAR LAS ALIMENTACIONES DE LA CORRIENTE (9, 10) POR BANDAS (11, 12) DE METAL FLEXIBLE SUSCEPTIBLE DE SOLDARSE POR ESTAÑADO, ESTANDO FIJADAS CON UN EXTREMO (13, 14) SOBRE LAS CAPAS METALICAS (7, 8); Y ALOJAR EL CUERPO DEL CONDENSADOR (1) JUNTO CON LOS EXTREMOS (13, 14) DE LAS BANDAS (11, 12) EN UN REVESTIMIENTO (15) DE MATERIAL SINTETICO ESTABLE A TEMPERATURA ELEVADA CON LAS DIMENSIONES EXTERNAS NECESARIAS, DEL QUE SE HAN EXTRAIDO LAS BANDAS (11, 12) Y SE HAN DOBLADO DE TAL FORMA QUE DISCURREN A LO LARGO DE LA SUPERFICIE DEL REVESTIMIENTO (15), FORMANDO SUPERFICIES DE SOLDADURA POR ESTAÑO (16, 17, 18, 19). TIENE APLICACIONES EN CHIPS DE CIRCUITOS IMPRESOS.
ES541880A 1984-04-03 1985-04-02 Perfeccionamientos en un condensador electrico Expired ES8702731A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19843412492 DE3412492A1 (de) 1984-04-03 1984-04-03 Elektrischer kondensator als chip-bauelement

Publications (2)

Publication Number Publication Date
ES8702731A1 true ES8702731A1 (es) 1986-12-16
ES541880A0 ES541880A0 (es) 1986-12-16

Family

ID=6232544

Family Applications (1)

Application Number Title Priority Date Filing Date
ES541880A Expired ES8702731A1 (es) 1984-04-03 1985-04-02 Perfeccionamientos en un condensador electrico

Country Status (7)

Country Link
US (1) US4617609A (es)
EP (1) EP0162149B1 (es)
JP (1) JPS60225414A (es)
AT (1) ATE44840T1 (es)
BR (1) BR8501541A (es)
DE (2) DE3412492A1 (es)
ES (1) ES8702731A1 (es)

Families Citing this family (51)

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DE3466121D1 (en) * 1983-06-03 1987-10-15 Wolfgang Westermann Plastic foil-wound capacitor
FR2581827B1 (fr) * 1985-05-10 1989-04-28 Europ Composants Electron Bande de connexion pour la fabrication de composants electriques a report direct et procede de fabrication de ces composants
US4801912A (en) * 1985-06-07 1989-01-31 American Precision Industries Inc. Surface mountable electronic device
US4934048A (en) * 1985-06-07 1990-06-19 American Precision Industries Inc. Method of making surface mountable electronic device
ATE51462T1 (de) * 1985-12-17 1990-04-15 Siemens Bauelemente Ohg Elektrisches bauelement in chip-bauweise.
DE3607225A1 (de) * 1986-03-05 1987-09-10 Siemens Ag Elektrisches bauelement in chip-bauweise und verfahren zu seiner herstellung
DE3731966C3 (de) * 1986-09-26 1995-02-09 Gen Electric Oberflächenmontierbarer Varistor
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DE3638342A1 (de) * 1986-11-10 1988-05-19 Siemens Ag Elektrisches bauelement aus keramik mit mehrlagenmetallisierung und verfahren zu seiner herstellung
FR2609207B1 (fr) * 1986-12-30 1989-10-20 Europ Composants Electron Barrette de connexions pour la fabrication de composants electriques
EP0289934B1 (de) * 1987-05-05 1991-11-27 Siemens Aktiengesellschaft Elektrisches Bauelement in Chip-Bauweise und Verfahren zu seiner Herstellung
US4894746A (en) * 1987-06-06 1990-01-16 Murata Manufacturing Co., Ltd. Laminated capacitor with fuse function
AT393180B (de) * 1987-12-17 1991-08-26 Philips Nv Elektrolytkondensator und verfahren zur herstellung eines elektrolytkondensators
EP0327860A1 (de) * 1988-02-10 1989-08-16 Siemens Aktiengesellschaft Elektrisches Bauelement in Chip-Bauweise und Verfahren zu seiner Herstellung
DE3813435A1 (de) * 1988-04-21 1989-11-02 Siemens Ag Bauelement in chip-bauweise zum befestigen auf einer schaltplatte, mit einem elektrischen oder elektronischen funktionskoerper
DE3816024A1 (de) * 1988-05-10 1989-12-07 Roederstein Kondensatoren Traegerband mit anschlusslaschen fuer elektrische bauelemente und verfahren zum bestuecken des traegerbandes
DE3887327D1 (de) * 1988-08-16 1994-03-03 Philips Nv Elektrolytkondensator.
DE3829934C1 (en) * 1988-09-02 1990-02-22 Roederstein Spezialfabriken Fuer Bauelemente Der Elektronik Und Kondensatoren Der Starkstromtechnik Gmbh, 8300 Landshut, De Device for processing the plastic sheathing of electrical chip components on a carrier strip
US5075621A (en) * 1988-12-19 1991-12-24 International Business Machines Corporation Capacitor power probe
FR2640825B1 (fr) * 1988-12-20 1991-01-25 Europ Composants Electron Composant electrique a report direct
FR2641905B1 (fr) * 1988-12-23 1991-03-15 Europ Composants Electron Bande de connexions pour assemblage en ligne de composants cms
DE3921651A1 (de) * 1989-06-30 1991-01-10 Siemens Ag Mindestens sechsflaechiges elektronikbauteil fuer gedruckte schaltungen
DE4024312A1 (de) * 1990-07-31 1992-02-06 Roederstein Kondensatoren Chip-kondensator mit waermeleitsperre
DE4446566A1 (de) * 1994-12-24 1996-06-27 Telefunken Microelectron Mehrpoliges, oberflächenmontierbares, elektronisches Bauelement
US5771149A (en) * 1996-03-01 1998-06-23 Matsushita Electric Industrial Co., Ltd. Capacitor device
US6023403A (en) * 1996-05-03 2000-02-08 Littlefuse, Inc. Surface mountable electrical device comprising a PTC and fusible element
JPH10321407A (ja) * 1997-05-23 1998-12-04 Murata Mfg Co Ltd 表面実装型電子部品
GB9814317D0 (en) * 1997-07-23 1998-09-02 Murata Manufacturing Co Ceramic electronic part and method for producing the same
US6282072B1 (en) 1998-02-24 2001-08-28 Littelfuse, Inc. Electrical devices having a polymer PTC array
US6582647B1 (en) 1998-10-01 2003-06-24 Littelfuse, Inc. Method for heat treating PTC devices
US6574089B1 (en) * 1998-12-15 2003-06-03 Murata Manufacturing Co., Ltd. Monolithic ceramic capacitor
JP2002025852A (ja) * 2000-07-07 2002-01-25 Matsushita Electric Ind Co Ltd 電子部品
US6628498B2 (en) 2000-08-28 2003-09-30 Steven J. Whitney Integrated electrostatic discharge and overcurrent device
WO2003088356A1 (en) 2002-04-08 2003-10-23 Littelfuse, Inc. Voltage variable material for direct application and devices employing same
US7132922B2 (en) 2002-04-08 2006-11-07 Littelfuse, Inc. Direct application voltage variable material, components thereof and devices employing same
US7183891B2 (en) 2002-04-08 2007-02-27 Littelfuse, Inc. Direct application voltage variable material, devices employing same and methods of manufacturing such devices
KR100465234B1 (ko) * 2002-09-13 2005-01-13 삼성전자주식회사 테이프 레코더용 테이프-엔드 검출센서 전원공급장치
US7019396B2 (en) * 2003-07-15 2006-03-28 Murata Manufacturing Co., Ltd. Electronic chip component and method for manufacturing electronic chip component
JP4415744B2 (ja) * 2003-12-11 2010-02-17 パナソニック株式会社 電子部品
WO2005062318A1 (ja) * 2003-12-18 2005-07-07 Matsushita Electric Industrial Co., Ltd. 電子部品
US7133274B2 (en) * 2005-01-20 2006-11-07 Matsushita Electric Industrial Co., Ltd. Multilayer capacitor and mold capacitor
JP5075890B2 (ja) * 2008-09-03 2012-11-21 株式会社東芝 半導体装置及び半導体装置の製造方法
JP4867999B2 (ja) * 2009-01-20 2012-02-01 Ｔｄｋ株式会社 積層コンデンサ
DE102011086707A1 (de) 2011-11-21 2013-05-23 Robert Bosch Gmbh Schaltungsanordnung für elektronische und/oder elektrische Bauteile
US9357634B2 (en) 2012-04-27 2016-05-31 Kemet Electronics Corporation Coefficient of thermal expansion compensating compliant component
DE102013102278A1 (de) * 2013-03-07 2014-09-11 Epcos Ag Kondensatoranordnung
WO2015065974A1 (en) * 2013-10-29 2015-05-07 Kemet Electronics Corporation Ceramic capacitors with improved lead designs
DE102014217933A1 (de) * 2014-09-08 2016-03-10 Continental Automotive Gmbh Elektromotor mit SMD-Bauteilen und zugehöriges Verbindungsteil
KR102139759B1 (ko) * 2015-01-20 2020-07-31 삼성전기주식회사 적층 세라믹 전자 부품
DE102015102866B4 (de) 2015-02-27 2023-02-02 Tdk Electronics Ag Keramisches Bauelement, Bauelementanordnung und Verfahren zur Herstellung eines keramischen Bauelements
JP6899246B2 (ja) * 2016-06-10 2021-07-07 モレックス エルエルシー 電子部品

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Also Published As

Publication number Publication date
BR8501541A (pt) 1985-11-26
JPS60225414A (ja) 1985-11-09
ATE44840T1 (de) 1989-08-15
US4617609A (en) 1986-10-14
EP0162149A1 (de) 1985-11-27
DE3412492A1 (de) 1985-10-03
EP0162149B1 (de) 1989-07-19
DE3479067D1 (en) 1989-08-24
ES541880A0 (es) 1986-12-16

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Legal Events

Date Code Title Description
FD1A Patent lapsed

Effective date: 19960603