AU5913699A - Electrostatic dechucking method and apparatus for dielectric workpieces in vacuum processors - Google Patents
Electrostatic dechucking method and apparatus for dielectric workpieces in vacuum processorsInfo
- Publication number
- AU5913699A AU5913699A AU59136/99A AU5913699A AU5913699A AU 5913699 A AU5913699 A AU 5913699A AU 59136/99 A AU59136/99 A AU 59136/99A AU 5913699 A AU5913699 A AU 5913699A AU 5913699 A AU5913699 A AU 5913699A
- Authority
- AU
- Australia
- Prior art keywords
- electrostatic
- dechucking method
- dielectric workpieces
- processors
- vacuum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/23—Chucks or sockets with magnetic or electrostatic means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical Vapour Deposition (AREA)
- Jigs For Machine Tools (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/163,370 US6125025A (en) | 1998-09-30 | 1998-09-30 | Electrostatic dechucking method and apparatus for dielectric workpieces in vacuum processors |
| US09163370 | 1998-09-30 | ||
| PCT/US1999/020615 WO2000019519A1 (en) | 1998-09-30 | 1999-09-10 | Electrostatic dechucking method and apparatus for dielectric workpieces in vacuum processors |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU5913699A true AU5913699A (en) | 2000-04-17 |
Family
ID=22589749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU59136/99A Abandoned AU5913699A (en) | 1998-09-30 | 1999-09-10 | Electrostatic dechucking method and apparatus for dielectric workpieces in vacuum processors |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6125025A (enExample) |
| JP (4) | JP4698025B2 (enExample) |
| KR (1) | KR100708237B1 (enExample) |
| AU (1) | AU5913699A (enExample) |
| TW (1) | TW426930B (enExample) |
| WO (1) | WO2000019519A1 (enExample) |
Families Citing this family (94)
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| US5737177A (en) * | 1996-10-17 | 1998-04-07 | Applied Materials, Inc. | Apparatus and method for actively controlling the DC potential of a cathode pedestal |
| JP3245369B2 (ja) * | 1996-11-20 | 2002-01-15 | 東京エレクトロン株式会社 | 被処理体を静電チャックから離脱する方法及びプラズマ処理装置 |
| JPH10209258A (ja) * | 1997-01-22 | 1998-08-07 | Hitachi Ltd | 静電吸着保持方法および装置 |
| JPH10242256A (ja) * | 1997-02-26 | 1998-09-11 | Kyocera Corp | 静電チャック |
| US5894400A (en) * | 1997-05-29 | 1999-04-13 | Wj Semiconductor Equipment Group, Inc. | Method and apparatus for clamping a substrate |
| US5933314A (en) * | 1997-06-27 | 1999-08-03 | Lam Research Corp. | Method and an apparatus for offsetting plasma bias voltage in bi-polar electro-static chucks |
| JPH10163308A (ja) * | 1997-11-04 | 1998-06-19 | Hitachi Ltd | プラズマ処理方法および装置 |
| US5880924A (en) * | 1997-12-01 | 1999-03-09 | Applied Materials, Inc. | Electrostatic chuck capable of rapidly dechucking a substrate |
-
1998
- 1998-09-30 US US09/163,370 patent/US6125025A/en not_active Expired - Lifetime
-
1999
- 1999-09-10 JP JP2000572927A patent/JP4698025B2/ja not_active Expired - Fee Related
- 1999-09-10 WO PCT/US1999/020615 patent/WO2000019519A1/en not_active Ceased
- 1999-09-10 KR KR1020017004017A patent/KR100708237B1/ko not_active Expired - Lifetime
- 1999-09-10 AU AU59136/99A patent/AU5913699A/en not_active Abandoned
- 1999-09-29 TW TW088116744A patent/TW426930B/zh not_active IP Right Cessation
-
2009
- 2009-09-07 JP JP2009205952A patent/JP5135306B2/ja not_active Expired - Lifetime
- 2009-09-07 JP JP2009206036A patent/JP2010050464A/ja active Pending
- 2009-09-07 JP JP2009206010A patent/JP2010050463A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2000019519A1 (en) | 2000-04-06 |
| TW426930B (en) | 2001-03-21 |
| US6125025A (en) | 2000-09-26 |
| JP4698025B2 (ja) | 2011-06-08 |
| JP5135306B2 (ja) | 2013-02-06 |
| JP2010050464A (ja) | 2010-03-04 |
| JP2002526923A (ja) | 2002-08-20 |
| WO2000019519B1 (en) | 2000-05-25 |
| KR20010083878A (ko) | 2001-09-03 |
| JP2010062570A (ja) | 2010-03-18 |
| KR100708237B1 (ko) | 2007-04-16 |
| JP2010050463A (ja) | 2010-03-04 |
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| Date | Code | Title | Description |
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| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |