AU2001229403A1 - System and method for controlled polishing and planarization of semiconductor wafers - Google Patents

System and method for controlled polishing and planarization of semiconductor wafers

Info

Publication number
AU2001229403A1
AU2001229403A1 AU2001229403A AU2940301A AU2001229403A1 AU 2001229403 A1 AU2001229403 A1 AU 2001229403A1 AU 2001229403 A AU2001229403 A AU 2001229403A AU 2940301 A AU2940301 A AU 2940301A AU 2001229403 A1 AU2001229403 A1 AU 2001229403A1
Authority
AU
Australia
Prior art keywords
planarization
semiconductor wafers
controlled polishing
polishing
controlled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001229403A
Other languages
English (en)
Inventor
Yehiel Gotkis
Rod Kistler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of AU2001229403A1 publication Critical patent/AU2001229403A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
AU2001229403A 2000-01-28 2001-01-12 System and method for controlled polishing and planarization of semiconductor wafers Abandoned AU2001229403A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/493,978 US6340326B1 (en) 2000-01-28 2000-01-28 System and method for controlled polishing and planarization of semiconductor wafers
US09493978 2000-01-28
PCT/US2001/001044 WO2001054862A1 (en) 2000-01-28 2001-01-12 System and method for controlled polishing and planarization of semiconductor wafers

Publications (1)

Publication Number Publication Date
AU2001229403A1 true AU2001229403A1 (en) 2001-08-07

Family

ID=23962506

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001229403A Abandoned AU2001229403A1 (en) 2000-01-28 2001-01-12 System and method for controlled polishing and planarization of semiconductor wafers

Country Status (8)

Country Link
US (2) US6340326B1 (de)
EP (1) EP1250215B1 (de)
JP (1) JP4831910B2 (de)
KR (1) KR100780977B1 (de)
AU (1) AU2001229403A1 (de)
DE (1) DE60102891T2 (de)
TW (1) TW471994B (de)
WO (1) WO2001054862A1 (de)

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US6705930B2 (en) * 2000-01-28 2004-03-16 Lam Research Corporation System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques
US6340326B1 (en) * 2000-01-28 2002-01-22 Lam Research Corporation System and method for controlled polishing and planarization of semiconductor wafers
US6585572B1 (en) * 2000-08-22 2003-07-01 Lam Research Corporation Subaperture chemical mechanical polishing system
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CN100400233C (zh) * 2006-05-26 2008-07-09 中国科学院上海技术物理研究所 Ⅱ-ⅵ族半导体材料保护侧边缘的表面抛光方法
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JP2008229820A (ja) * 2007-03-23 2008-10-02 Elpida Memory Inc Ｃｍｐ加工用のドレッサ及びｃｍｐ加工装置並びにｃｍｐ加工用の研磨パッドのドレッシング処理方法
KR101042321B1 (ko) * 2009-08-18 2011-06-17 세메스 주식회사 기판 연마 장치 및 방법
KR101098367B1 (ko) 2009-08-28 2011-12-26 세메스 주식회사 기판 연마 장치 및 그의 처리 방법
DE102013221319A1 (de) 2013-10-21 2015-04-23 Volkswagen Aktiengesellschaft Automatischer Wechsel von Schleif-/Polierscheiben zur Behandlung von Karosseriebauteilen
US9700988B2 (en) * 2014-08-26 2017-07-11 Ebara Corporation Substrate processing apparatus
WO2017165068A1 (en) * 2016-03-25 2017-09-28 Applied Materials, Inc. Local area polishing system and polishing pad assemblies for a polishing system
US10096460B2 (en) 2016-08-02 2018-10-09 Semiconductor Components Industries, Llc Semiconductor wafer and method of wafer thinning using grinding phase and separation phase
CN110352115A (zh) * 2017-03-06 2019-10-18 应用材料公司 为cmp位置特定研磨(lsp)设计的螺旋及同心圆移动
JP7049801B2 (ja) * 2017-10-12 2022-04-07 株式会社ディスコ 被加工物の研削方法
KR102113026B1 (ko) * 2018-11-29 2020-05-20 한국생산기술연구원 웨이퍼용 화학기계연마 장치 및 이의 희생부 위치 제어 방법
CN111906694A (zh) * 2020-08-13 2020-11-10 蚌埠中光电科技有限公司 一种玻璃研磨垫的在线修整装置
JP7530237B2 (ja) 2020-08-17 2024-08-07 キオクシア株式会社 研磨装置および研磨方法

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Also Published As

Publication number Publication date
JP4831910B2 (ja) 2011-12-07
WO2001054862A1 (en) 2001-08-02
DE60102891D1 (de) 2004-05-27
US6340326B1 (en) 2002-01-22
EP1250215B1 (de) 2004-04-21
TW471994B (en) 2002-01-11
US20020137436A1 (en) 2002-09-26
KR100780977B1 (ko) 2007-11-29
EP1250215A1 (de) 2002-10-23
JP2003521117A (ja) 2003-07-08
US6729943B2 (en) 2004-05-04
KR20020077677A (ko) 2002-10-12
DE60102891T2 (de) 2005-03-31

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