WO1982003038A1

WO1982003038A1 - One-pass type automatic plane multi-head grinding polishing and cleaning machine

Info

Publication number: WO1982003038A1
Application number: PCT/JP1981/000054
Authority: WO
Inventors: Kikai Co Ltd Shibayama; Yoshio Ishimura
Original assignee: Hatano Kouichi
Priority date: 1981-03-10
Filing date: 1981-03-10
Publication date: 1982-09-16

Abstract

A one-pass type automatic plane multi-head grinding, polishing and cleaning machine, which incorporates a vacuum chuck cleaning unit (1), an automatic wafer-from-cassette conveying unit (2), and a wafer-to-vacuum chuck automatic loading unit (3) and the like. This machine rotates a plane grinding stone by a motor (5) for grinding, and rotates a rotary table (7) for sequentially machining wafers (4), (6), (8), (11), (15), (18), (19) and (21). This machine sequentially grinds through second and third grinding shafts (9) and (10), and then jet cleans with a wafer cleaning unit (13). After the cleaning operation this machine polishes, at high speed with a polishing unit (14), cleans the wafers with a jet cleaning unit (16), and then automatically contains the wafers in respective cassettes. This machine can automatically execute all the operations at high speed.

Description

Specification

Title of invention

One-pass multi-face grinding, polishing and automatic lathes With the progress of electronics, the development of semiconductors is progressing, and miniaturization is progressing to I (:, LSI, LSI).

Along with that, mass production of thin wafers such as silicon, gallium, gallium phosphide, GGGG, sapphire for SOS (silicon 'on' sapphires), alumina ceramics, glass, etc., mass production of wraps and polishes There is a need for labor saving.

The object of the present invention is to provide an apparatus for automatically grinding, polishing and cleaning the plane of the wafer.

Background art

In the past, these processes, which were performed exclusively by hand and rely on the ripeness of ί¾Λ, were invented in the United States in ヲ / 年 / year, followed by various grinding and lapping machines. Boards, polishing machines, and washing machines have emerged, and are now being machined more and more.

Disclosure of the invention

An object of the present invention is to provide an apparatus for automating manual operations that have been conventionally performed manually, and performing high-speed, high-precision cutting, lapping, polishing, and washing at a time.

Brief description of drawings ·

1 shows an embodiment of the present invention. FIG. 1 is a top view, FIG. 2 is a top view of a wafer high-speed polishing apparatus, and FIG. 3 is a side view thereof.

1 is a washing device 2 is an automatic loading device 3 is an auto loading device 4. 6. 8. 11. 1 5. 18. 19. 21 is 30 wafers 5. 10 is a motor 7 is a rotary table 9 Second grinding shaft 12 Pulley 13 Wafer cleaning device 14 Polishing device 16 Jet washing device 17 Motor 20 Compressor 22

ΟΜΡΙ Arbin set 2 3 Vacuum chuck cleaning 2 4 Automatic storage cassette 2 5 Polishing head 2 6 Gear 1 2 7 Sun gear 1 2 8 Outside polishing head iflS 2 9 Polishing head Side track £ 3; 30 is a head arm 31 is a work 32 2 is a spindle

BEST MODE FOR CARRYING OUT THE INVENTION

Next, the action and effect are explained by the figure B9, Fig. 1 is a top view of one-pass type multi-face grinding, polish and cleaning machine, 1 is a vacuum chuck cleaning device, 2 is a wafer An automatic windowing device 3 from a cassette is a device for automatically loading a wafer to a vacuum chuck 4. The wafer 4 coming out of the vacuum tweezers is accurately supplied onto the vacuum chuck.

5: First axis grinding device The in-line motor transmits the rotation to the stone on the flat surface of the upper surface of the wafer 6 on the vacuum chuck.

Reference numeral 7 denotes a sigma-tally table, which is rotated to add up to 4, 6, 8, 11, 15, 15, 18, 19, and 21 processed products.

The work 8 indicates the position of the work wafer to be machined by the second grinding 9, and 9 is a grinding shaft used for intermediate grinding.

Reference numeral 10 denotes a motor for transmitting rotation to grind the processing wafer 11 through belt and pulley 12 during the third grinding.

Reference numeral 13 denotes a wafer cleaning device, which is used to perform a jet cleaning and blow water and air at a high pressure to the fan.

Reference numeral 14 denotes a polishing apparatus for polishing the processed wafer 15 at high speed.

Reference numeral 16 denotes a jetting machine which is provided to wash the processed wafer 18 after polishing.

1 9 is dried by air blow with the air supplied from the compressor 20.

OMPI

V / IPO '' It is a processed wafer to be dried.

2 1 is a processing wafer in the unπ-deposition position, which is unloaded by air tweezers 22 for unloading.

2 3 is used to clean the dirty vacuum chuck before wafer loading, before removing the chuck by jet cleaning and splashing, and before going to the loading position 4 Is an important device.

24 is a cassette which is automatically stored after finishing all the processing.

By using this apparatus of the present invention, cutting, lapping, polishing, and washing, which have been performed separately until now, can be performed automatically, at high speed, and with high density. Next, the polishing apparatus will be described. In FIG. 2, reference numeral 25 denotes a polishing head, reference numeral 26 denotes a gear for rotating the polishing head 25 at high speed, and reference numeral 27 denotes a sun gear for rotating the gear 26. It is provided to rotate the polishing head 25 by being rotated together with the head arm 30.

Reference numeral 2 9 denotes the trajectory of the movement of the polishing head, which is inside, and reference numeral 28 denotes the outside 1.

Reference numeral 31 denotes a workpiece to be polished by a polishing head 25.

Numeral 32 in FIG. 3 denotes a spindle for rotating the head arm 30.

The present invention is a one-pass multi-face polishing machine having the above configuration. In the meantime, the polishing machine used to be a conventional one that has been operated at a speed of 1 to 1 rpm: The polishing head 25i to rotate the sun gear 27 of the KIMY at 2 rpm or more. Since the orbit revolves around the sun gear 27 at high speed while rotating above 60 以上 Ο τνm, the wafer of the work 31 can be polished in a short time.

By using this device, grinding, lapping, polishing, and washing, which have been conventionally performed individually, can be performed automatically, at high speed, and with high accuracy.

Industrial use

OMPI

,. „· ^{Ι? 0} With the advancement of electronics, etc., the necessity of advanced machining machines capable of producing ultra-high-precision, ultra-small and ultra-compact electronic products is increasing, and its development is urgently urgent. If it is used as a package 501, especially for pack wrapping, poly, and sourcing equipment for LSIs, it will greatly contribute to mass production and labor saving.

. · 'WIPO

Claims

The scope of the claims

A one-pass system that automatically performs surface grinding, polishing, high-pressure jet washing, air blowing, and vacuum chucking. It is possible to perform high-speed polishing with a high-speed polishing device. It is an automatic lathe with automatic loading and unloading, including multi-grinding, polishing and washing, including polished ox, target and chemical processing methods.

Ο ΡΙ

Eight WIPO