WO1982003038A1 - Machine automatique de meulage, polissage et nettoyage de plan a tete multiple du type a une face - Google Patents

Machine automatique de meulage, polissage et nettoyage de plan a tete multiple du type a une face Download PDF

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Publication number
WO1982003038A1
WO1982003038A1 PCT/JP1981/000054 JP8100054W WO8203038A1 WO 1982003038 A1 WO1982003038 A1 WO 1982003038A1 JP 8100054 W JP8100054 W JP 8100054W WO 8203038 A1 WO8203038 A1 WO 8203038A1
Authority
WO
WIPO (PCT)
Prior art keywords
polishing
grinding
wafer
machine
cleaning
Prior art date
Application number
PCT/JP1981/000054
Other languages
English (en)
Japanese (ja)
Inventor
Kikai Co Ltd Shibayama
Yoshio Ishimura
Original Assignee
Hatano Kouichi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hatano Kouichi filed Critical Hatano Kouichi
Priority to PCT/JP1981/000054 priority Critical patent/WO1982003038A1/fr
Publication of WO1982003038A1 publication Critical patent/WO1982003038A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table

Definitions

  • the object of the present invention is to provide an apparatus for automatically grinding, polishing and cleaning the plane of the wafer.
  • An object of the present invention is to provide an apparatus for automating manual operations that have been conventionally performed manually, and performing high-speed, high-precision cutting, lapping, polishing, and washing at a time.
  • FIG. 1 shows an embodiment of the present invention.
  • FIG. 1 is a top view
  • FIG. 2 is a top view of a wafer high-speed polishing apparatus
  • FIG. 3 is a side view thereof.
  • a washing device 2 is an automatic loading device 3 is an auto loading device 4. 6. 8. 11. 1 5. 18. 19. 21 is 30 wafers 5.
  • 10 is a motor 7 is a rotary table 9 Second grinding shaft 12 Pulley 13 Wafer cleaning device 14 Polishing device 16 Jet washing device 17 Motor 20 Compressor 22
  • Fig. 1 is a top view of one-pass type multi-face grinding, polish and cleaning machine
  • 1 is a vacuum chuck cleaning device
  • 2 is a wafer
  • An automatic windowing device 3 from a cassette is a device for automatically loading a wafer to a vacuum chuck 4. The wafer 4 coming out of the vacuum tweezers is accurately supplied onto the vacuum chuck.
  • Reference numeral 7 denotes a sigma-tally table, which is rotated to add up to 4, 6, 8, 11, 15, 15, 18, 19, and 21 processed products.
  • the work 8 indicates the position of the work wafer to be machined by the second grinding 9, and 9 is a grinding shaft used for intermediate grinding.
  • Reference numeral 10 denotes a motor for transmitting rotation to grind the processing wafer 11 through belt and pulley 12 during the third grinding.
  • Reference numeral 13 denotes a wafer cleaning device, which is used to perform a jet cleaning and blow water and air at a high pressure to the fan.
  • Reference numeral 14 denotes a polishing apparatus for polishing the processed wafer 15 at high speed.
  • Reference numeral 16 denotes a jetting machine which is provided to wash the processed wafer 18 after polishing.
  • 1 9 is dried by air blow with the air supplied from the compressor 20.
  • V / IPO '' It is a processed wafer to be dried.
  • 2 1 is a processing wafer in the un ⁇ -deposition position, which is unloaded by air tweezers 22 for unloading.
  • reference numeral 25 denotes a polishing head
  • reference numeral 26 denotes a gear for rotating the polishing head 25 at high speed
  • reference numeral 27 denotes a sun gear for rotating the gear 26. It is provided to rotate the polishing head 25 by being rotated together with the head arm 30.
  • Reference numeral 2 9 denotes the trajectory of the movement of the polishing head, which is inside, and reference numeral 28 denotes the outside 1.
  • Reference numeral 31 denotes a workpiece to be polished by a polishing head 25.
  • Numeral 32 in FIG. 3 denotes a spindle for rotating the head arm 30.
  • the present invention is a one-pass multi-face polishing machine having the above configuration.
  • the polishing head 25i to rotate the sun gear 27 of the KIMY at 2 rpm or more. Since the orbit revolves around the sun gear 27 at high speed while rotating above 60 ⁇ ⁇ ⁇ m, the wafer of the work 31 can be polished in a short time.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

Une machine automatique de meulage, polissage et nettoyage de plan a tete multiple du type a une face comprend une unite de nettoyage de mandrin sous vide (1), une unite d'acheminement automatique (2) de tranches depuis une cassette, et une unite de chargement automatique (3) des tranches au mandrin sous vide. Cette machine fait tourner une pierre de meulage de plan a l'aide d'un moteur (5), et fait tourner une table rotative (7) pour usiner sequentiellement des tranches (4, 6, 8, 11, 15, 18, 19 et 21). Cette machine meule sequentiellement par l'intermediaire d'un second et d'un troisieme arbres de meulage (9 et 10), puis nettoie a l'aide de jet avec une unite de nettoyage des tranches (13). Une fois l'operation de nettoyage terminee, cette machine polit a haute vitesse avec une unite de polissage (14), nettoie les tranches avec une unite de nettoyage par jet (16), puis stocke automatiquement les tranches dans des cassettes respectives. Cette machine peut executer automatiquement toutes les operations a haute vitesse.
PCT/JP1981/000054 1981-03-10 1981-03-10 Machine automatique de meulage, polissage et nettoyage de plan a tete multiple du type a une face WO1982003038A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP1981/000054 WO1982003038A1 (fr) 1981-03-10 1981-03-10 Machine automatique de meulage, polissage et nettoyage de plan a tete multiple du type a une face

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
WOJP81/00054810310 1981-03-10
PCT/JP1981/000054 WO1982003038A1 (fr) 1981-03-10 1981-03-10 Machine automatique de meulage, polissage et nettoyage de plan a tete multiple du type a une face

Publications (1)

Publication Number Publication Date
WO1982003038A1 true WO1982003038A1 (fr) 1982-09-16

Family

ID=13734201

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1981/000054 WO1982003038A1 (fr) 1981-03-10 1981-03-10 Machine automatique de meulage, polissage et nettoyage de plan a tete multiple du type a une face

Country Status (1)

Country Link
WO (1) WO1982003038A1 (fr)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2324750A (en) * 1997-04-28 1998-11-04 Nec Corp Automatic wafer polishing apparatus
US6340326B1 (en) 2000-01-28 2002-01-22 Lam Research Corporation System and method for controlled polishing and planarization of semiconductor wafers
US6343978B1 (en) 1997-05-16 2002-02-05 Ebara Corporation Method and apparatus for polishing workpiece
US6354922B1 (en) 1999-08-20 2002-03-12 Ebara Corporation Polishing apparatus
US6443815B1 (en) 2000-09-22 2002-09-03 Lam Research Corporation Apparatus and methods for controlling pad conditioning head tilt for chemical mechanical polishing
US6640155B2 (en) 2000-08-22 2003-10-28 Lam Research Corporation Chemical mechanical polishing apparatus and methods with central control of polishing pressure applied by polishing head
US6682408B2 (en) 1999-03-05 2004-01-27 Ebara Corporation Polishing apparatus
US6705930B2 (en) 2000-01-28 2004-03-16 Lam Research Corporation System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques
US7011569B2 (en) 1996-05-16 2006-03-14 Ebara Corporation Method and apparatus for polishing workpiece
CN104068785A (zh) * 2014-06-27 2014-10-01 涂兴家 多头洗刷清洗渍机的清洗装置
CN109333337A (zh) * 2018-11-19 2019-02-15 深圳市华星光电技术有限公司 研磨装置及研磨方法
CN109822419A (zh) * 2019-03-04 2019-05-31 天通日进精密技术有限公司 晶圆转移装置及晶圆转移方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3032939A (en) * 1958-02-10 1962-05-08 Andersen Roland Conditioners for electric shavers and the like
US3793779A (en) * 1971-01-29 1974-02-26 Dbm Industries Ltd Apparatus for treating a surface
SU441133A1 (ru) * 1973-03-21 1974-08-30 Куйбышевский Филиал "Росоргтехстром" Установка дл шлифовки и полировки плит из естественного камн
US3863394A (en) * 1974-02-04 1975-02-04 Speedfam Corp Apparatus for machining work pieces
US3913271A (en) * 1974-02-04 1975-10-21 Speedfam Corp Apparatus for machining work pieces

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3032939A (en) * 1958-02-10 1962-05-08 Andersen Roland Conditioners for electric shavers and the like
US3793779A (en) * 1971-01-29 1974-02-26 Dbm Industries Ltd Apparatus for treating a surface
SU441133A1 (ru) * 1973-03-21 1974-08-30 Куйбышевский Филиал "Росоргтехстром" Установка дл шлифовки и полировки плит из естественного камн
US3863394A (en) * 1974-02-04 1975-02-04 Speedfam Corp Apparatus for machining work pieces
US3913271A (en) * 1974-02-04 1975-10-21 Speedfam Corp Apparatus for machining work pieces

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7011569B2 (en) 1996-05-16 2006-03-14 Ebara Corporation Method and apparatus for polishing workpiece
US6379230B1 (en) 1997-04-28 2002-04-30 Nec Corporation Automatic polishing apparatus capable of polishing a substrate with a high planarization
GB2324750A (en) * 1997-04-28 1998-11-04 Nec Corp Automatic wafer polishing apparatus
GB2324750B (en) * 1997-04-28 2002-04-10 Nec Corp Automatic polishing apparatus for polishing a substrate
US6343978B1 (en) 1997-05-16 2002-02-05 Ebara Corporation Method and apparatus for polishing workpiece
US6682408B2 (en) 1999-03-05 2004-01-27 Ebara Corporation Polishing apparatus
US6878044B2 (en) 1999-03-05 2005-04-12 Ebara Corporation Polishing apparatus
US7632378B2 (en) 1999-03-05 2009-12-15 Ebara Corporation Polishing apparatus
US6354922B1 (en) 1999-08-20 2002-03-12 Ebara Corporation Polishing apparatus
US6705930B2 (en) 2000-01-28 2004-03-16 Lam Research Corporation System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques
US6729943B2 (en) 2000-01-28 2004-05-04 Lam Research Corporation System and method for controlled polishing and planarization of semiconductor wafers
US6869337B2 (en) 2000-01-28 2005-03-22 Lam Research Corporation System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques
US6340326B1 (en) 2000-01-28 2002-01-22 Lam Research Corporation System and method for controlled polishing and planarization of semiconductor wafers
US6640155B2 (en) 2000-08-22 2003-10-28 Lam Research Corporation Chemical mechanical polishing apparatus and methods with central control of polishing pressure applied by polishing head
US6443815B1 (en) 2000-09-22 2002-09-03 Lam Research Corporation Apparatus and methods for controlling pad conditioning head tilt for chemical mechanical polishing
CN104068785A (zh) * 2014-06-27 2014-10-01 涂兴家 多头洗刷清洗渍机的清洗装置
CN109333337A (zh) * 2018-11-19 2019-02-15 深圳市华星光电技术有限公司 研磨装置及研磨方法
CN109822419A (zh) * 2019-03-04 2019-05-31 天通日进精密技术有限公司 晶圆转移装置及晶圆转移方法

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