AU2003218477A1 - Composite conditioning tool - Google Patents

Composite conditioning tool

Info

Publication number
AU2003218477A1
AU2003218477A1 AU2003218477A AU2003218477A AU2003218477A1 AU 2003218477 A1 AU2003218477 A1 AU 2003218477A1 AU 2003218477 A AU2003218477 A AU 2003218477A AU 2003218477 A AU2003218477 A AU 2003218477A AU 2003218477 A1 AU2003218477 A1 AU 2003218477A1
Authority
AU
Australia
Prior art keywords
conditioning tool
composite conditioning
composite
tool
conditioning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003218477A
Inventor
Joseph K. So
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm and Haas Electronic Materials CMP Holdings Inc
Original Assignee
Rodel Inc
Rodel Holdings Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rodel Inc, Rodel Holdings Inc filed Critical Rodel Inc
Publication of AU2003218477A1 publication Critical patent/AU2003218477A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/005—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents using brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
AU2003218477A 2002-04-02 2003-04-02 Composite conditioning tool Abandoned AU2003218477A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11547602A 2002-04-02 2002-04-02
US10/115,476 2002-04-02
PCT/US2003/009825 WO2003084715A1 (en) 2002-04-02 2003-04-02 Composite conditioning tool

Publications (1)

Publication Number Publication Date
AU2003218477A1 true AU2003218477A1 (en) 2003-10-20

Family

ID=28673778

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003218477A Abandoned AU2003218477A1 (en) 2002-04-02 2003-04-02 Composite conditioning tool

Country Status (4)

Country Link
US (1) US20030190874A1 (en)
AU (1) AU2003218477A1 (en)
TW (1) TW200400866A (en)
WO (1) WO2003084715A1 (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7170190B1 (en) * 2003-12-16 2007-01-30 Lam Research Corporation Apparatus for oscillating a head and methods for implementing the same
US7033253B2 (en) * 2004-08-12 2006-04-25 Micron Technology, Inc. Polishing pad conditioners having abrasives and brush elements, and associated systems and methods
JP2006159317A (en) * 2004-12-03 2006-06-22 Asahi Sunac Corp Dressing method of grinding pad
JP4936040B2 (en) * 2005-08-26 2012-05-23 株式会社東京精密 Pad dressing method
US7354337B2 (en) * 2005-08-30 2008-04-08 Tokyo Seimitsu Co., Ltd. Pad conditioner, pad conditioning method, and polishing apparatus
US20070087672A1 (en) * 2005-10-19 2007-04-19 Tbw Industries, Inc. Apertured conditioning brush for chemical mechanical planarization systems
JP4162001B2 (en) * 2005-11-24 2008-10-08 株式会社東京精密 Wafer polishing apparatus and wafer polishing method
JP5002353B2 (en) * 2007-07-05 2012-08-15 シャープ株式会社 Chemical mechanical polishing equipment
US20090104863A1 (en) * 2007-10-17 2009-04-23 Chun-Liang Lin Pad conditioner for chemical mechanical polishing
GB2479559B (en) * 2010-04-14 2012-07-25 Rolls Royce Plc Apparatus and method for applying a fluid to a component
US8920214B2 (en) * 2011-07-12 2014-12-30 Chien-Min Sung Dual dressing system for CMP pads and associated methods
TWI542444B (en) * 2014-09-11 2016-07-21 China Grinding Wheel Corp A polishing pad dresser with a brush holder
US9902038B2 (en) * 2015-02-05 2018-02-27 Toshiba Memory Corporation Polishing apparatus, polishing method, and semiconductor manufacturing method
KR101841549B1 (en) * 2015-10-29 2018-03-23 에스케이실트론 주식회사 An apparatus for dressing a polishing pad and wafer polisher including the same
WO2018063242A1 (en) * 2016-09-29 2018-04-05 Intel Corporation Chemical-mechanical planarization (cmp) pad conditioner brush-and-abrasive hybrid for multi-step, preparation- and restoration-conditioning process of cmp pad
KR101904860B1 (en) * 2016-10-06 2018-10-08 신한다이아몬드공업 주식회사 Attachment removing device for diamond tip cutting wheel
US10857651B2 (en) * 2017-11-20 2020-12-08 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus of chemical mechanical polishing and operating method thereof
CN109483403A (en) * 2018-12-25 2019-03-19 上海致领半导体科技发展有限公司 A kind of polishing pad brush with grooming function
DE102019113317A1 (en) * 2019-05-20 2020-11-26 Hartmetall-Werkzeugfabrik Paul Horn Gmbh Combined grinding and brushing device
US11787012B2 (en) * 2019-10-31 2023-10-17 Taiwan Semiconductor Manufacturing Co., Ltd. Conditioner disk, chemical mechanical polishing device, and method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3111892B2 (en) * 1996-03-19 2000-11-27 ヤマハ株式会社 Polishing equipment
US6135868A (en) * 1998-02-11 2000-10-24 Applied Materials, Inc. Groove cleaning device for chemical-mechanical polishing
US6200199B1 (en) * 1998-03-31 2001-03-13 Applied Materials, Inc. Chemical mechanical polishing conditioner
JP2000079551A (en) * 1998-07-06 2000-03-21 Canon Inc Conditioning device and method
US6086460A (en) * 1998-11-09 2000-07-11 Lam Research Corporation Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization
KR100546288B1 (en) * 1999-04-10 2006-01-26 삼성전자주식회사 Chemical-mechanical polishing CMP apparatus
US6193587B1 (en) * 1999-10-01 2001-02-27 Taiwan Semicondutor Manufacturing Co., Ltd Apparatus and method for cleansing a polishing pad
US6340326B1 (en) * 2000-01-28 2002-01-22 Lam Research Corporation System and method for controlled polishing and planarization of semiconductor wafers

Also Published As

Publication number Publication date
US20030190874A1 (en) 2003-10-09
WO2003084715A1 (en) 2003-10-16
TW200400866A (en) 2004-01-16

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase