TWI542444B - A polishing pad dresser with a brush holder - Google Patents
A polishing pad dresser with a brush holder Download PDFInfo
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- TWI542444B TWI542444B TW103131280A TW103131280A TWI542444B TW I542444 B TWI542444 B TW I542444B TW 103131280 A TW103131280 A TW 103131280A TW 103131280 A TW103131280 A TW 103131280A TW I542444 B TWI542444 B TW I542444B
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- polishing pad
- area
- substrate
- pad conditioner
- abrasives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
Description
本創作係關於一種拋光墊修整器,特別指一種具有刷拭件之拋光墊修整器。 The present invention relates to a polishing pad conditioner, and more particularly to a polishing pad conditioner having a brushing member.
化學機械研磨係各領域製程常利用之平坦化技術,因其適合大面積的平坦化,故被廣泛的應用於積體電路的層疊後的矽表面或是銅表面的平坦化。而化學機械研磨的設備通常包含一拋光墊與一拋光墊修整器,其操作時係先將研磨液利用旋轉塗佈的方式塗佈於拋光墊上,並將待研磨物品的表面壓於拋光墊上,藉由拋光墊對待研磨物品的表面進行研磨,而在研磨過程中將因研磨而產生碎屑,碎屑會累積於拋光墊的孔隙當中並與研磨液混合形成一硬化層,導致其研磨效率下降,進而縮短拋光墊的使用壽命。因此在研磨過程中需利用拋光墊修整器持續對拋光墊之表面進行修整,以延長拋光墊的使用時限。然而,若利用一般之拋光墊修整器對拋光墊表面進行修整僅能破壞該硬化層,並無法將碎屑自孔隙中移除,因此所能夠延長之拋光墊使用的時限相當有限。 The chemical mechanical polishing system is a flattening technique commonly used in various fields of the process. Since it is suitable for planarization of a large area, it is widely used for the planarization of the laminated tantalum surface or the copper surface of the integrated circuit. The chemical mechanical polishing device generally comprises a polishing pad and a polishing pad conditioner, which is operated by first applying the polishing solution to the polishing pad by spin coating, and pressing the surface of the object to be polished against the polishing pad. The surface of the article to be polished is polished by the polishing pad, and debris is generated by grinding during the grinding process, and the debris accumulates in the pores of the polishing pad and mixes with the polishing liquid to form a hardened layer, resulting in a decrease in polishing efficiency. , thereby shortening the service life of the polishing pad. Therefore, the surface of the polishing pad is continuously trimmed by the polishing pad dresser during the grinding process to extend the use time of the polishing pad. However, if the polishing pad surface is trimmed by a conventional polishing pad conditioner to only destroy the hardened layer and the debris cannot be removed from the pores, the extended polishing pad can be used for a relatively limited time period.
有鑑於此,如圖11、圖12所示,目前有一種拋光墊修整器,其包含一承載體70、複數磨料80與複數清潔部90,該承載體70具有複數個研磨區域71和複數個刷拭區域72,該研磨區域71及該刷拭區域72於一環形方向上呈交錯排序,該等磨料80係鋪灑固定於該等研磨區域71,該等清潔部90係設置於該等刷拭區域72,各清潔部90包含複數個固定於刷拭區域72的刷毛91,該拋光墊 修整器利用該等刷毛91能於研磨過程中將含碎屑之研磨液掃除並一併清除孔隙中的碎屑,進而恢復拋光墊的研磨效率並延長拋光墊的使用時限。 In view of this, as shown in FIG. 11 and FIG. 12, there is currently a polishing pad conditioner comprising a carrier 70, a plurality of abrasives 80 and a plurality of cleaning portions 90, the carrier 70 having a plurality of polishing regions 71 and a plurality of The brushing area 72, the polishing area 71 and the wiping area 72 are staggered in an annular direction, and the abrasives 80 are laid and fixed on the polishing areas 71, and the cleaning parts 90 are disposed on the brushes. Wiping area 72, each cleaning part 90 includes a plurality of bristles 91 fixed to the wiping area 72, the polishing pad The trimmer utilizes the bristles 91 to sweep the debris-containing slurry during the grinding process and to remove debris from the pores, thereby restoring the polishing efficiency of the polishing pad and prolonging the use time of the polishing pad.
然而如圖12所示,該拋光墊修整器因該等磨料80係鋪灑於該承載體70之上,各磨料80之末端81的高度不一,並無法形成統一的基準,因此各刷毛91末端911相對於磨料80之末端81的高度也是有高有低,若是刷毛91末端911相對於磨料80末端81來得低,刷毛91將無法有效的清除孔隙內碎屑;又若刷毛91末端911相對於磨料80末端81來得高,則可能會造成磨料80對於拋光墊表面的研磨效率降低,因此該拋光墊修整器的刷毛91末端911相對於磨料80之末端81的高度不一致將導致拋光墊部分區域的孔隙內碎屑未有效被清除或是各區域的磨料研磨效率不一致的問題,故其仍有改善之空間。 However, as shown in FIG. 12, the polishing pad conditioner is spread on the carrier 70 by the abrasives 80, and the heights of the ends 81 of the respective abrasives 80 are different, and a uniform reference cannot be formed, so each bristles 91 The height of the end 911 relative to the end 81 of the abrasive 80 is also high or low. If the end 911 of the bristles 91 is lower relative to the end 81 of the abrasive 80, the bristles 91 will not effectively remove the debris in the pores; High at the end 81 of the abrasive 80 may result in reduced abrasive efficiency of the abrasive pad 80 to the surface of the polishing pad, so that the height of the end 911 of the bristles 91 of the polishing pad conditioner relative to the end 81 of the abrasive 80 will result in a partial area of the polishing pad. The debris in the pores is not effectively removed or the abrasive grinding efficiency of each region is inconsistent, so there is still room for improvement.
有鑑於此,本創作係對現有之拋光墊修整器加以改良,以克服拋光墊修整器的刷毛末端相對於磨料之末端的高度不一致和其所衍生之孔隙內碎屑清除不完全或磨料研磨效率不一致的問題。 In view of this, the present invention improves the existing polishing pad conditioner to overcome the inconsistency in the height of the bristle end of the polishing pad conditioner relative to the end of the abrasive and the incomplete removal of debris in the pores or the abrasive polishing efficiency. Inconsistent issues.
本創作係提供一種具有刷拭件之拋光墊修整器,其包含:一基板,其包含一表面與複數內凹部,該等內凹部係內凹成形於該表面;複數金屬柱磨料,該等金屬柱磨料係裝設於該表面,各金屬柱磨料包含一金屬柱與一磨料,該金屬柱包含相對之一連接端與一切削端,該連接端係裝設固定於對應之內凹部內,該磨料包含一尖端,該磨料係裝設於該金屬柱之切削端並露出該尖端,且各磨料之尖端與該表面之水平面的垂直距離皆相等;複數叢刷拭件,該等刷拭件係裝設於該表面,而各叢刷拭件之末端相對於該等磨料之尖端係較遠離該表面,且各叢刷拭件之末端與該等磨料之尖端所形成之水平面的垂直距離皆相等,且其係介於0.1毫米至1毫米之間。 The present invention provides a polishing pad conditioner having a brushing member, comprising: a substrate comprising a surface and a plurality of concave portions, the inner concave portions are concavely formed on the surface; a plurality of metal pillar abrasives, the metal The column abrasive system is mounted on the surface, each of the metal column abrasives comprises a metal column and an abrasive, the metal column includes a connecting end and a cutting end, and the connecting end is installed and fixed in the corresponding inner concave portion, The abrasive comprises a tip, the abrasive is mounted on the cutting end of the metal post and exposes the tip, and the vertical distance between the tip of each abrasive and the horizontal plane of the surface is equal; a plurality of brush wipes, the brush system Mounted on the surface, and the ends of the brush holders are farther from the surface relative to the tips of the abrasives, and the ends of the brush holders are perpendicular to the horizontal plane formed by the tips of the abrasives. And the system is between 0.1 mm and 1 mm.
本創作之具有刷拭件之拋光墊修整器因精確的控制各磨料之尖端與該表面之水平面的垂直距離以及該等刷拭件之末端與該等磨料之尖端所形成之水平面的垂直距離係得以進一步提升對於拋光墊表面孔隙內的碎屑的清除效果,並避免拋光墊部分區域的孔隙內碎屑未有效被清除或是各區域的磨料研磨效率不一致的問題。 The polishing pad dresser with brushing device of the present invention precisely controls the vertical distance between the tip of each abrasive and the horizontal plane of the surface and the vertical distance between the end of the brush and the horizontal surface formed by the tips of the abrasives. The effect of removing debris in the pores of the surface of the polishing pad can be further improved, and the problem that the debris in the pores of the polishing pad portion is not effectively removed or the abrasive polishing efficiency of each region is inconsistent is avoided.
較佳的是,該具有刷拭件之拋光墊修整器更包含一第二基板,該第二基板係裝設固定於該表面,而該等刷拭件係裝設於該第二基板。更佳的是,該第二基板之材質係為聚乙烯、聚丙烯、聚氯乙烯、聚苯乙烯、聚對苯二甲酸乙二酯或聚乳酸。 Preferably, the polishing pad conditioner having the brushing member further comprises a second substrate, the second substrate is mounted on the surface, and the brushing device is mounted on the second substrate. More preferably, the material of the second substrate is polyethylene, polypropylene, polyvinyl chloride, polystyrene, polyethylene terephthalate or polylactic acid.
另擇的是,該基板更包含複數鑽孔,該等鑽孔係內凹成形於該表面,各叢刷拭件係裝設於對應之鑽孔當中。 Alternatively, the substrate further comprises a plurality of drilled holes, the drilled holes are concavely formed on the surface, and the bundle of brush wipes are installed in the corresponding drilled holes.
較佳的是,該等刷拭件係分為複數叢軟質刷毛與複數叢硬質刷毛,該等軟質刷毛與該等硬質刷毛係交錯排列。更佳的是,該等軟質刷毛之材質係為聚丙烯或耐龍,該等硬質刷毛之材質係為聚丙烯或耐龍。 Preferably, the brushing members are divided into a plurality of soft bristles and a plurality of rigid bristles, and the soft bristles are staggered with the hard bristles. More preferably, the soft bristles are made of polypropylene or nylon, and the hard bristles are made of polypropylene or nylon.
較佳的是,該基板係呈圓形片狀,該表面係能劃分為呈同心圓之一外圍區與一中心區,該外圍區係環繞該中心區;該等內凹部係內凹成形於該表面之外圍區,該等刷拭件係裝設固定於該表面之中心區。 Preferably, the substrate is in the form of a circular sheet, and the surface can be divided into a peripheral region of a concentric circle and a central region surrounding the central region; the concave portions are concavely formed on the surface In the peripheral region of the surface, the brushing members are mounted in a central region of the surface.
更進一步的是,該外圍區係進一步區分成交錯排列之研磨區域與清除區域,該等內凹部係內凹成形於該表面之外圍區的研磨區域,該等刷拭件係裝設固定於該表面之中心區以及該表面之外圍區的清除區域。 Further, the peripheral region is further divided into a staggered polishing area and a clearing area, the inner concave portions are concavely formed in a polishing area of the peripheral area of the surface, and the brushing parts are fixed to the The central area of the surface and the clearing area of the peripheral area of the surface.
另擇的是,該基板係呈圓形片狀,該表面係能劃分為呈同心圓之一外圍區與一中心區,該外圍區係環繞該中心區並進一步區分成交錯排列之研磨區域與清除區域;該等內凹部係內凹成形於該表面之外圍區的研磨區域,該等刷拭件係裝設固定於該表面之外圍區的清除區域。 Alternatively, the substrate is in the form of a circular sheet, and the surface can be divided into a peripheral region of a concentric circle and a central region, the peripheral region surrounding the central region and further divided into staggered polishing regions and a cleaning region; the inner concave portion is concavely formed in a polishing region of a peripheral portion of the surface, and the cleaning member is provided with a clearing region fixed to a peripheral region of the surface.
10、10A、10B、10C‧‧‧基板 10, 10A, 10B, 10C‧‧‧ substrate
11、11D‧‧‧表面 11, 11D‧‧‧ surface
111、111A、111B、111C‧‧‧外圍區 111, 111A, 111B, 111C‧‧‧ peripheral area
1111B、1111C‧‧‧研磨區域 1111B, 1111C‧‧‧ grinding area
1112B、1112C‧‧‧清除區域 1112B, 1112C‧‧‧ Clearing area
112、112A、112B、112C、112D‧‧‧中心區 112, 112A, 112B, 112C, 112D‧‧‧ central area
12、12B、12C‧‧‧內凹部 12, 12B, 12C‧‧‧ recess
13、13B、13C‧‧‧鑽孔 13, 13B, 13C‧‧‧ drilling
20、20A‧‧‧金屬柱磨料 20, 20A‧‧‧Metal column abrasive
21、21A‧‧‧金屬柱 21, 21A‧‧‧ metal column
211‧‧‧連接端 211‧‧‧Connected end
212‧‧‧切削端 212‧‧‧ cutting end
22、22A、22D‧‧‧磨料 22, 22A, 22D‧‧‧ abrasives
221、221A、221D‧‧‧尖端 221, 221A, 221D‧‧‧ cutting-edge
30‧‧‧刷拭件 30‧‧‧wiping parts
31、31A、31D‧‧‧軟質刷毛 31, 31A, 31D‧‧‧ soft bristles
311、311A、311D‧‧‧末端 End of 311, 311A, 311D‧‧
32、32A、32D‧‧‧硬質刷毛 32, 32A, 32D‧‧‧ Hard bristles
321、321A、321D‧‧‧末端 321, 321A, 321D‧‧‧ end
40A‧‧‧第二基板 40A‧‧‧second substrate
60‧‧‧精密治具 60‧‧‧Precision fixture
61‧‧‧磨料平面 61‧‧‧Abrasive plane
62‧‧‧刷毛平面 62‧‧‧Brush plane
70‧‧‧承載體 70‧‧‧Carrier
71‧‧‧研磨區域 71‧‧‧ Grinding area
72‧‧‧刷拭區域 72‧‧‧Swipe area
80‧‧‧磨料 80‧‧‧Abrasive
81‧‧‧末端 End of 81‧‧‧
90‧‧‧清潔部 90‧‧‧Clean Department
91‧‧‧刷毛 91‧‧‧ bristles
911‧‧‧末端 End of 911‧‧
d1‧‧‧垂直距離 D1‧‧‧ vertical distance
d2‧‧‧垂直距離 D2‧‧‧ vertical distance
d3‧‧‧垂直距離 D3‧‧‧ vertical distance
d4‧‧‧垂直距離 D4‧‧‧ vertical distance
d5‧‧‧垂直距離 D5‧‧‧ vertical distance
d6‧‧‧垂直距離 D6‧‧‧ vertical distance
圖1為本創作實施例1之上視示意圖。 FIG. 1 is a top view of the first embodiment of the present invention.
圖2為本創作實施例1之剖面示意圖。 2 is a schematic cross-sectional view showing a first embodiment of the present invention.
圖3為本創作實施例1之製備過程示意圖。 FIG. 3 is a schematic view showing the preparation process of the first embodiment of the present invention.
圖4為本創作實施例2之剖面示意圖。 4 is a schematic cross-sectional view showing a second embodiment of the present invention.
圖5為本創作實施例3之上視示意圖。 FIG. 5 is a top view of the third embodiment of the present invention.
圖6為本創作實施例4之上視示意圖。 FIG. 6 is a top plan view of the fourth embodiment of the present invention.
圖7為本創作對照例之剖面示意圖。 Fig. 7 is a schematic cross-sectional view showing a comparative example of the creation.
圖8為利用本創作實施例1研磨後之拋光墊的電子顯微鏡圖。 Fig. 8 is an electron micrograph of the polishing pad after the polishing using the inventive example 1.
圖9為利用本創作對照例研磨後之拋光墊的電子顯微鏡圖。 Fig. 9 is an electron micrograph of a polishing pad polished using the present comparative example.
圖10為利用現有之拋光墊修整器研磨後之拋光墊的電子顯微鏡圖。 Figure 10 is an electron micrograph of a polishing pad after grinding using a conventional polishing pad conditioner.
圖11為現有之拋光墊修整器之上視示意圖。 Figure 11 is a top plan view of a conventional polishing pad conditioner.
圖12為現有之拋光墊修整器之剖面示意圖。 Figure 12 is a schematic cross-sectional view of a conventional polishing pad conditioner.
如圖1、圖2所示,本實施例中係提供一種具有刷拭件之拋光墊修整器,其包含:一基板10、複數金屬柱磨料20與複數叢刷拭件30。 As shown in FIG. 1 and FIG. 2, in this embodiment, a polishing pad conditioner having a brushing member is provided, which comprises: a substrate 10, a plurality of metal pillar abrasives 20 and a plurality of bundle brush holders 30.
所述之基板10係成圓形片狀並包含一表面11、複數內凹部12與複數鑽孔13,該表面11係劃分為呈同心圓之一外圍區111與一中心區112,該外圍區111係環繞於該中心區112之外,換言之,該外圍區111係位於外圈,而該 中心區112係位於內圈,該等內凹部12係內凹成形於該表面11之外圍區111,該等鑽孔13係內凹成形於該表面11之中心區112。 The substrate 10 is formed into a circular sheet shape and includes a surface 11 , a plurality of concave portions 12 and a plurality of holes 13 , and the surface 11 is divided into a peripheral region 111 and a central region 112 which are concentric circles, and the peripheral region The 111 series surrounds the central area 112, in other words, the peripheral area 111 is located on the outer ring, and the The central region 112 is located in the inner ring, and the inner recesses 12 are concavely formed in the peripheral region 111 of the surface 11, and the drilled holes 13 are concavely formed in the central region 112 of the surface 11.
各金屬柱磨料20包含一金屬柱21與一磨料22,該金屬柱21之兩端係為一連接端211與一切削端212,該連接端211係對應固設於該等內凹部12內,該磨料22包含一尖端221,該磨料22係裝設於該金屬柱21之切削端212並露出該尖端221,而各磨料20之尖端221與該外圍區111之水平面的垂直距離d1皆相等。 Each of the metal pillars 20 includes a metal post 21 and an abrasive 22, and the two ends of the metal post 21 are a connecting end 211 and a cutting end 212. The connecting end 211 is correspondingly fixed in the inner recesses 12, The abrasive 22 includes a tip end 221 which is mounted on the cutting end 212 of the metal post 21 and exposes the tip end 221, and the vertical distance d1 of the tip end 221 of each abrasive 20 from the horizontal plane of the peripheral region 111 is equal.
該等刷拭件30係分為複數叢軟質刷毛31與複數叢硬質刷毛32,該等軟質刷毛31之材質係為聚丙烯並係裝設於對應之鑽孔13內,且該等軟質刷毛31之線徑係為0.15毫米至0.25毫米(與長度有關,此處僅為舉例說明),該等硬質刷毛32之材質係為聚丙烯並係裝設於對應之鑽孔13內,且該等硬質刷毛32之線徑係為0.4毫米至0.6毫米(與長度有關,此處僅為舉例說明),相同材質下,硬質刷毛之線徑較粗,而該等軟質刷毛31與該等硬質刷毛32係交錯排列,該等軟質刷毛31之末端311相對於該等磨料之尖端221係較遠離該表面11,且該等軟質刷毛31之末端311與該等磨料22之尖端221所形成之水平面的垂直距離d2係為0.1毫米,該等硬質刷毛32之末端321相對於該等磨料22之尖端221係較遠離該表面11,且該等硬質刷毛32之末端321與該等磨料22之尖端221所形成之水平面的垂直距離d3係為0.1毫米。 The brushing members 30 are divided into a plurality of soft bristles 31 and a plurality of rigid bristles 32. The soft bristles 31 are made of polypropylene and are installed in the corresponding drill holes 13, and the soft bristles 31 are provided. The wire diameter is from 0.15 mm to 0.25 mm (depending on the length, which is only exemplified herein), and the hard bristles 32 are made of polypropylene and are installed in the corresponding bores 13 and are hard. The wire diameter of the bristles 32 is 0.4 mm to 0.6 mm (related to the length, which is merely an example). Under the same material, the hard bristles have a relatively large wire diameter, and the soft bristles 31 and the hard bristles 32 are Staggered, the ends 311 of the soft bristles 31 are relatively far from the surface 11 relative to the tips 221 of the abrasives, and the vertical distances between the ends 311 of the soft bristles 31 and the horizontal surface formed by the tips 221 of the abrasives 22 The d2 is 0.1 mm, the ends 321 of the hard bristles 32 are relatively far from the surface 11 with respect to the tips 221 of the abrasives 22, and the ends 321 of the hard bristles 32 and the tips 221 of the abrasives 22 are formed. The vertical distance d3 of the horizontal plane is 0.1 mm.
本實施例之具有刷拭件之拋光墊修整器的該等金屬柱磨料20之製備如下。準備一下模具,並於該下模具之表面上放置一矽膠墊,將該基板10放置於該矽膠墊上,而該矽膠墊則於該基板10之內凹部12中形成緩衝墊;注入黏合膠於各內凹部12內,並將各金屬柱磨料20之金屬柱21的連接端211設置於內凹部12中;放置調整該等金屬柱磨料20之磨料22尖端高度之墊片於該等磨料22之尖端,並放置於一上模具於該墊片相對於該等金屬柱磨料20的一側,施壓 固定壓力夾緊上下模具已使得各磨料22之尖端與該基板10表面11之水平面的垂直距離皆相等,加熱使黏合膠固化,卸除上模具、下模具、墊片以及矽膠墊,並於基板10之內凹部12注入黏合膠填平,即完成該等金屬柱磨料22之製備。以上所述僅是本創作的較佳實例而已,並非對本創作做任何形式上的限制。 The metal column abrasives 20 of the polishing pad conditioner of the present embodiment having the brushing member are prepared as follows. Preparing a mold, and placing a rubber pad on the surface of the lower mold, placing the substrate 10 on the silicone pad, and forming a cushion in the concave portion 12 of the substrate 10; injecting adhesive into each In the inner recess 12, the connecting end 211 of the metal post 21 of each metal post abrasive 20 is disposed in the inner recess 12; a spacer for adjusting the tip height of the abrasive 22 of the metal post abrasive 20 is placed at the tip of the abrasive 22 And placing an upper mold on the side of the gasket relative to the metal column abrasive 20, applying pressure The fixed pressure clamping upper and lower molds have the same vertical distance between the tip end of each abrasive 22 and the horizontal surface of the surface 11 of the substrate 10, heating to cure the adhesive, removing the upper mold, the lower mold, the gasket and the silicone pad, and the substrate The recess 12 is filled with adhesive glue to fill the inner portion 10 to complete the preparation of the metal column abrasives 22. The above description is only a preferred example of the present creation, and does not impose any form limitation on the creation.
再配合圖3所示,本實施例之具有刷拭件之拋光墊修整器製作係透過一精密治具60使得該等軟質刷毛31或該等硬質刷毛32之末端311,321與該等磨料22之尖端221所形成之水平面的垂直距離為0.1毫米。 Referring to FIG. 3 again, the polishing pad dresser having the brushing member of the present embodiment passes through a precision jig 60 to make the ends of the soft bristles 31 or the hard bristles 32 311, 321 and the tips of the abrasives 22 The vertical distance formed by the horizontal plane of 221 is 0.1 mm.
該精密治具60包含兩平面,即一磨料平面61與一刷毛平面62,該磨料平面61係相對於該等磨料22,該刷毛平面62係對應抵頂於該等軟質刷毛31與該等硬質刷毛32之末端311,321,且該磨料平面61係相對高於該刷毛平面62,該磨料平面61與該刷毛平面62之段差d4係為0.1毫米。製作該具有刷拭件之拋光墊修整器時,係將其基板10之表面11朝下使得該等軟質刷毛31與該等硬質刷毛32之末端311,321抵於該刷毛平面62,藉此可確保該等軟質刷毛31或該等硬質刷毛32之末端311,321與該等磨料22之尖端221所形成之水平面的垂直距離相距0.1毫米。 The precision fixture 60 comprises two planes, namely an abrasive plane 61 and a bristle plane 62, the abrasive plane 61 is opposite to the abrasives 22, and the bristle plane 62 corresponds to the soft bristles 31 and the hard materials. The ends 311, 321 of the bristles 32, and the abrasive plane 61 are relatively higher than the bristle plane 62, and the step d4 of the abrasive plane 61 and the bristle plane 62 is 0.1 mm. When the polishing pad conditioner having the brushing member is formed, the surface 11 of the substrate 10 is faced downward so that the soft bristles 31 and the ends 311, 321 of the hard bristles 32 abut against the bristle plane 62, thereby ensuring the The vertical distance between the soft bristles 31 or the ends 311, 321 of the hard bristles 32 and the horizontal surface formed by the tips 221 of the abrasives 22 is 0.1 mm apart.
如圖4所示,本實施例之具有刷拭件之拋光墊修整器與實施例1大致相同,其不同之處在於該基板10A不包含該等鑽孔,而該具有刷拭件之拋光墊修整器更包含一第二基板40A,該第二基板40A之材質為聚丙烯,該第二基板40A係裝設固定於該中心區112A,而該等軟質刷毛31A係裝設於該第二基板40A上,該等軟質刷毛31A之材質係為耐龍,該等軟質刷毛31A之末端311A與該等磨料22A之尖端221A所形成之水平面的垂直距離係為0.5毫米,而該等硬質刷毛32A係裝設於該第二基板40A上,且該等硬質刷毛32A之材質係為耐龍,該等硬質刷毛32A之末端321A與該等磨料22A之尖端221A所形成之水平面的垂直 距離係為0.5毫米;將該等軟質刷毛31A及硬質刷毛32A裝設於該第二基板40A,再將該第二基板40A裝設於該基板10A上,此種組合式的結構係能增加製作上的便利性。 As shown in FIG. 4, the polishing pad conditioner having the brushing member of the embodiment is substantially the same as that of Embodiment 1, except that the substrate 10A does not include the holes, and the polishing pad with the brushing member is used. The trimmer further includes a second substrate 40A. The second substrate 40A is made of polypropylene. The second substrate 40A is mounted and fixed to the central portion 112A. The soft bristles 31A are mounted on the second substrate. In 40A, the soft bristles 31A are made of Nylon, and the vertical distance between the end 311A of the soft bristles 31A and the horizontal surface formed by the tips 221A of the abrasives 22A is 0.5 mm, and the hard bristles 32A are The hard bristles 32A are made of a nylon, and the ends 321A of the hard bristles 32A are perpendicular to the horizontal surface formed by the tips 221A of the abrasives 22A. The distance is 0.5 mm; the soft bristles 31A and the hard bristles 32A are mounted on the second substrate 40A, and the second substrate 40A is mounted on the substrate 10A, and the combined structure can be increased. Convenience.
如圖5所示,本實施例之具有刷拭件之拋光墊修整器與實施例1大致相同,其不同之處在於該外圍區111B更進一步區分成交錯排列之研磨區域1111B與清除區域1112B,該等內凹部12B係內凹成形於該表面之外圍區111B的研磨區域1111B,該等鑽孔13B係內凹成形於該表面之中心區112B以及該表面之外圍區111B的清除區域1112B,而該等軟質刷毛之末端與該等磨料之尖端所形成之水平面的垂直距離係為1毫米,該等硬質刷毛之末端與該等磨料之尖端所形成之水平面的垂直距離係為1毫米,藉由調整軟質/硬質刷毛與該等磨料之間的比例來能調整該具有刷拭件之拋光墊修整器之清潔能力與切削力,以適用於不同的製程當中。 As shown in FIG. 5, the polishing pad conditioner having the brushing member of the present embodiment is substantially the same as that of Embodiment 1, except that the peripheral region 111B is further divided into the staggered polishing region 1111B and the cleaning region 1112B. The inner recesses 12B are concavely formed in the abrasive region 1111B of the peripheral region 111B of the surface, and the drilled holes 13B are concavely formed in the central region 112B of the surface and the clearing region 1112B of the peripheral region 111B of the surface, and The vertical distance between the ends of the soft bristles and the horizontal surface formed by the tips of the abrasives is 1 mm, and the vertical distance between the ends of the hard bristles and the horizontal surface formed by the tips of the abrasives is 1 mm. Adjusting the ratio between the soft/hard bristles and the abrasives can adjust the cleaning ability and cutting force of the polishing pad conditioner with the brushing member to suit different processes.
如圖6所示,本實施例之具有刷拭件之拋光墊修整器與實施例3大致相同,其不同之處在於該等鑽孔13C僅內凹形成於該表面之外圍區111C的清除區域1112C,本實施例藉由調整軟質/硬質刷毛與該等磨料之間的比例來能調整該具有刷拭件之拋光墊修整器之清潔能力與切削力,以適用於不同的製程當中。 As shown in FIG. 6, the polishing pad conditioner having the brushing member of the present embodiment is substantially the same as that of Embodiment 3, except that the holes 13C are only concavely formed in the clearing region of the peripheral region 111C of the surface. In 1112C, in this embodiment, the cleaning ability and the cutting force of the polishing pad conditioner having the brushing member can be adjusted by adjusting the ratio between the soft/hard bristles and the abrasive materials, so as to be suitable for different processes.
如圖7所示,本對照例之具有刷拭件之拋光墊修整器與實施例1大致相同,其不同之處在於該等軟質刷毛31D之末端311D相對於該等磨料22D之尖端221D係較靠近該表面11D,且該等軟質刷毛31D之末端311D與該等磨料22D之尖端221D所形成之水平面的垂直距離d5係為0.1毫米,該等硬質刷毛32D 之末端321D相對於該等磨料22D之尖端221D係較靠近該表面11D,且該等硬質刷毛32D之末端321D與該等磨料22D之尖端221D所形成之水平面的垂直距離d6係為0.1毫米。 As shown in FIG. 7, the polishing pad conditioner having the brushing member of the comparative example is substantially the same as that of Embodiment 1, except that the end 311D of the soft bristles 31D is relatively opposite to the tip 221D of the abrasives 22D. Close to the surface 11D, and the vertical distance d5 of the end 311D of the soft bristles 31D and the horizontal surface formed by the tips 221D of the abrasives 22D is 0.1 mm, and the hard bristles 32D The end 321D is closer to the surface 11D than the tip 221D of the abrasive 22D, and the vertical distance d6 of the end 321D of the hard bristles 32D and the horizontal surface formed by the tip 221D of the abrasive 22D is 0.1 mm.
係將實施例1、對照例之具有刷拭件之拋光墊修整器與先前技術之拋光墊修整器分別對拋光墊進行修整,再透過電子顯微鏡確認修整後之拋光墊表面的孔隙內之碎屑是否被清除,其結果分別為圖8(實施例1)、圖9(對照例)與圖10(先前技術)。 The polishing pad of the polishing pad with the brushing member of the first embodiment and the comparative example is trimmed with the polishing pad conditioner of the prior art, and the debris in the pores of the surface of the polishing pad after the trimming is confirmed by an electron microscope. Whether it was cleared or not, the results are shown in Fig. 8 (Example 1), Fig. 9 (Comparative Example), and Fig. 10 (Prior Art).
比較圖8(實施例1)與圖9(對照例)可以發現當該等軟質刷毛或該等硬質刷毛相對於該中心區之末端係低於該等磨料之尖端時,對於拋光墊表面孔隙內的碎屑的清除效果不彰。 Comparing FIG. 8 (Example 1) with FIG. 9 (Comparative Example), it can be found that when the soft bristles or the hard bristles are lower than the tip end of the central region with respect to the tip of the abrasive, the surface of the polishing pad is in the pores. The removal of debris is not effective.
而比較圖8(實施例1)與圖10(先前技術)可以得知,本創作之具有刷拭件之拋光墊修整器因精確的控制各磨料之尖端與該外圍區之水平面的垂直距離以及該等軟質刷毛之末端或該等硬質刷毛之末端與該等磨料之尖端所形成之水平面的垂直距離,因此對於拋光墊表面孔隙內的碎屑能夠獲得相對於先前技術之拋光墊修整器更佳的清除效果,並避免拋光墊部分區域的孔隙內碎屑未有效被清除或是各區域的磨料研磨效率不一致的問題。 Comparing FIG. 8 (Embodiment 1) with FIG. 10 (Prior Art), it can be seen that the polishing pad conditioner having the brushing device of the present invention precisely controls the vertical distance between the tip end of each abrasive and the horizontal surface of the peripheral region and The ends of the soft bristles or the vertical distance between the ends of the hard bristles and the horizontal surface formed by the tips of the abrasives, and thus the crumbs in the pores of the polishing pad surface can be better than the polishing pad conditioner of the prior art. The cleaning effect is avoided, and the debris in the pores of the polishing pad portion is not effectively removed or the abrasive grinding efficiency of each region is inconsistent.
本創作之具有刷拭件之拋光墊修整器因精確的控制各磨料之尖端與該外圍區之水平面的垂直距離以及該等軟質刷毛之末端或該等硬質刷毛之末端與該等磨料之尖端所形成之水平面的垂直距離係得以進一步提升對於拋光墊表面孔隙內的碎屑的清除效果,並避免拋光墊部分區域的孔隙內碎屑未有效被清除或是各區域的磨料研磨效率不一致的問題,且透過該等刷拭件與該等金屬柱磨料不同的排列方式亦得以適用於不同情況之拋光墊。 The polishing pad conditioner having the brushing member of the present invention precisely controls the vertical distance between the tip of each abrasive and the horizontal surface of the peripheral region and the end of the soft bristles or the ends of the hard bristles and the tips of the abrasives The vertical distance of the formed horizontal plane can further improve the removal effect on the debris in the pores of the polishing pad surface, and avoid the problem that the debris in the pore region of the polishing pad is not effectively removed or the abrasive polishing efficiency of each region is inconsistent. And the arrangement of the brush members different from the metal column abrasives is also applicable to the polishing pads of different situations.
以上所述僅是本創作的較佳實例而已,並非對本創作做任何形式上的限制,雖然本創作已以較佳實施例揭露如上,然而並非用以限定本創作,任何所屬技術領域中具有通常知識者,在不脫離本創作技術方案的範圍內,當可利用上述揭示的技術內容做出些許更動或修飾為等同變化的等效實施例,但凡是未脫離本創作之技術方案的內容,依據本創作的技術實質對以上實施例作任何簡單修改、等同變化與修改,均仍屬於本創作技術方案的範圍內。 The above description is only a preferred example of the present invention, and is not intended to limit the present invention in any way. Although the present invention has been disclosed above in the preferred embodiment, it is not intended to limit the present invention, and is generally in the art. Those skilled in the art, while departing from the technical scope of the present invention, may make some modifications or modifications to equivalent embodiments by using the technical contents disclosed above, but the content of the technical solution without departing from the present invention is based on The technical essence of the present invention makes any simple modification, equivalent change and modification to the above embodiments, and still belongs to the scope of the technical solution of the present invention.
11‧‧‧表面 11‧‧‧ surface
111‧‧‧外圍區 111‧‧‧ peripheral area
112‧‧‧中心區 112‧‧‧Central District
12‧‧‧內凹部 12‧‧‧ Inside recess
13‧‧‧鑽孔 13‧‧‧Drilling
21‧‧‧金屬柱 21‧‧‧Metal column
211‧‧‧連接端 211‧‧‧Connected end
212‧‧‧切削端 212‧‧‧ cutting end
22‧‧‧磨料 22‧‧‧Abrasive
221‧‧‧尖端 221‧‧‧ tip
30‧‧‧刷拭件 30‧‧‧wiping parts
31‧‧‧軟質刷毛 31‧‧‧Soft bristles
311‧‧‧末端 End of 311‧‧‧
32‧‧‧硬質刷毛 32‧‧‧hard bristles
321‧‧‧末端 End of 321‧‧‧
d1‧‧‧垂直距離 D1‧‧‧ vertical distance
d2‧‧‧垂直距離 D2‧‧‧ vertical distance
d3‧‧‧垂直距離 D3‧‧‧ vertical distance
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TW103131280A TWI542444B (en) | 2014-09-11 | 2014-09-11 | A polishing pad dresser with a brush holder |
US14/834,030 US20160074995A1 (en) | 2014-09-11 | 2015-08-24 | Chemical mechanical polishing conditioner with brushes |
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US20140120724A1 (en) * | 2005-05-16 | 2014-05-01 | Chien-Min Sung | Composite conditioner and associated methods |
TWI595973B (en) * | 2015-06-01 | 2017-08-21 | China Grinding Wheel Corp | Chemical mechanical polishing dresser and its manufacturing method |
DE102016117994A1 (en) * | 2016-09-23 | 2018-03-29 | Karl Heesemann Maschinenfabrik Gmbh & Co. Kg | grinding machine |
DE102016117991A1 (en) * | 2016-09-23 | 2018-03-29 | Karl Heesemann Maschinenfabrik Gmbh & Co Kg | grinding machine |
TWI636854B (en) * | 2017-06-12 | 2018-10-01 | 中國砂輪企業股份有限公司 | Grinding tool and method of fabricating the same |
CN109483403A (en) * | 2018-12-25 | 2019-03-19 | 上海致领半导体科技发展有限公司 | A kind of polishing pad brush with grooming function |
US11618126B2 (en) * | 2019-08-30 | 2023-04-04 | Taiwan Semiconductor Manufacturing Company Limited | Polishing pad conditioning apparatus |
CN116872090B (en) * | 2023-09-07 | 2023-11-14 | 北京特思迪半导体设备有限公司 | Dressing disk and device for polishing wafer |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2486363A (en) * | 1947-01-29 | 1949-10-25 | Carl D Langston | Combination drill and brush |
US2557207A (en) * | 1947-09-20 | 1951-06-19 | Thau-Jensen Orla | Polishing machine |
KR19990081117A (en) * | 1998-04-25 | 1999-11-15 | 윤종용 | CMP Pad Conditioning Disc and Conditioner, Manufacturing Method, Regeneration Method and Cleaning Method of the Disc |
ATE237432T1 (en) * | 1999-02-02 | 2003-05-15 | Poul Erik Jespersen | ROTATING GRINDING OR POLISHING TOOL, APPARATUS EQUIPPED WITH SUCH A TOOL AND METHOD FOR GRINDING OR POLISHING |
WO2003084715A1 (en) * | 2002-04-02 | 2003-10-16 | Rodel Holdings, Inc. | Composite conditioning tool |
US7033253B2 (en) * | 2004-08-12 | 2006-04-25 | Micron Technology, Inc. | Polishing pad conditioners having abrasives and brush elements, and associated systems and methods |
US7815495B2 (en) * | 2007-04-11 | 2010-10-19 | Applied Materials, Inc. | Pad conditioner |
TW200914202A (en) * | 2007-09-19 | 2009-04-01 | Powerchip Semiconductor Corp | Polishing pad conditioner and method for conditioning polishing pad |
-
2014
- 2014-09-11 TW TW103131280A patent/TWI542444B/en active
-
2015
- 2015-08-24 US US14/834,030 patent/US20160074995A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
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US20160074995A1 (en) | 2016-03-17 |
TW201609318A (en) | 2016-03-16 |
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