AU1577997A - Vacuum integrated smif system - Google Patents

Vacuum integrated smif system

Info

Publication number
AU1577997A
AU1577997A AU15779/97A AU1577997A AU1577997A AU 1577997 A AU1577997 A AU 1577997A AU 15779/97 A AU15779/97 A AU 15779/97A AU 1577997 A AU1577997 A AU 1577997A AU 1577997 A AU1577997 A AU 1577997A
Authority
AU
Australia
Prior art keywords
smif system
vacuum integrated
vacuum
smif
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU15779/97A
Other languages
English (en)
Inventor
Richard S. Muka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Azenta Inc
Original Assignee
Brooks Automation Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brooks Automation Inc filed Critical Brooks Automation Inc
Publication of AU1577997A publication Critical patent/AU1577997A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H10P72/3412—Batch transfer of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3406—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door or cover
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0297—Wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
AU15779/97A 1996-01-24 1997-01-14 Vacuum integrated smif system Abandoned AU1577997A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/590,757 US5752796A (en) 1996-01-24 1996-01-24 Vacuum integrated SMIF system
PCT/US1997/000523 WO1997027133A1 (en) 1996-01-24 1997-01-14 Vacuum integrated smif system
US590757 2000-06-08

Publications (1)

Publication Number Publication Date
AU1577997A true AU1577997A (en) 1997-08-20

Family

ID=24363582

Family Applications (1)

Application Number Title Priority Date Filing Date
AU15779/97A Abandoned AU1577997A (en) 1996-01-24 1997-01-14 Vacuum integrated smif system

Country Status (7)

Country Link
US (1) US5752796A (cg-RX-API-DMAC10.html)
EP (1) EP0886618A4 (cg-RX-API-DMAC10.html)
JP (1) JP4093376B2 (cg-RX-API-DMAC10.html)
KR (1) KR100499324B1 (cg-RX-API-DMAC10.html)
AU (1) AU1577997A (cg-RX-API-DMAC10.html)
TW (1) TW315488B (cg-RX-API-DMAC10.html)
WO (1) WO1997027133A1 (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU707884B2 (en) * 1997-10-07 1999-07-22 Innotech Corporation Conveying apparatus

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USD405427S (en) 1997-01-31 1999-02-09 Tokyo Electron Limited Heat retaining tube for use in a semiconductor wafer heat processing apparatus
USD404016S (en) 1997-01-31 1999-01-12 Tokyo Electron Limited Heat retaining tube for use in a semiconductor wafer heat processing apparatus
DE59805566D1 (de) * 1997-04-11 2002-10-24 Leybold Systems Gmbh Verfahren und Vorrichtung zum Be- und Entladen einer evakuierbaren Behandlungskammer
JPH10321714A (ja) * 1997-05-20 1998-12-04 Sony Corp 密閉コンテナ並びに密閉コンテナ用雰囲気置換装置及び雰囲気置換方法
USD405431S (en) 1997-08-20 1999-02-09 Tokyo Electron Ltd. Tube for use in a semiconductor wafer heat processing apparatus
USD405062S (en) * 1997-08-20 1999-02-02 Tokyo Electron Ltd. Processing tube for use in a semiconductor wafer heat processing apparatus
USD404372S (en) 1997-08-20 1999-01-19 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
USD404374S (en) 1997-08-20 1999-01-19 Tokyo Electron Limited Fin for use in a semiconductor wafer heat processing apparatus
USD404375S (en) 1997-08-20 1999-01-19 Tokyo Electron Limited Heat retaining tube base for use in a semiconductor wafer head processing apparatus
USD404370S (en) 1997-08-20 1999-01-19 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
USD404369S (en) 1997-08-20 1999-01-19 Tokyo Electron Limited Manifold cover for use in a semiconductor wafer heat processing apparatus
USD404368S (en) 1997-08-20 1999-01-19 Tokyo Electron Limited Outer tube for use in a semiconductor wafer heat processing apparatus
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USD404373S (en) 1997-08-20 1999-01-19 Tokyo Electron Limited Fin for use in a semiconductor wafer heat processing apparatus
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US6364595B1 (en) * 1999-02-10 2002-04-02 Asyst Technologies, Inc. Reticle transfer system
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US6612797B1 (en) * 1999-05-18 2003-09-02 Asyst Technologies, Inc. Cassette buffering within a minienvironment
US6234219B1 (en) * 1999-05-25 2001-05-22 Micron Technology, Inc. Liner for use in processing chamber
KR100403663B1 (ko) * 1999-07-14 2003-10-30 동경 엘렉트론 주식회사 피처리체 수용 박스의 개폐 덮개의 개폐 장치 및피처리체의 처리 시스템
US8348583B2 (en) 1999-10-19 2013-01-08 Rorze Corporation Container and loader for substrate
US6540424B1 (en) * 2000-03-24 2003-04-01 The Clorox Company Advanced cleaning system
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US7018504B1 (en) 2000-09-11 2006-03-28 Asm America, Inc. Loadlock with integrated pre-clean chamber
US6632068B2 (en) * 2000-09-27 2003-10-14 Asm International N.V. Wafer handling system
JP2002203887A (ja) * 2001-01-05 2002-07-19 Tdk Corp ミニエンバイロンメントシステムおよびその操作方法
DE10164175B4 (de) * 2001-12-27 2004-02-12 Infineon Technologies Ag Prozeßgerät mit zwei Raumeinheiten und einer die zwei Raumeinheiten verbindenden dritten Raumeinheit mit jeweils einer gegenüber der Umgebung verminderten Dichte kontaminierter Teilchen und Verfahren zum Betrieb des Prozeßgerätes
US6755602B2 (en) * 2002-02-07 2004-06-29 Taiwan Semiconductor Manufacturing Co., Ltd Wafer transport pod with linear door opening mechanism
US6899507B2 (en) * 2002-02-08 2005-05-31 Asm Japan K.K. Semiconductor processing apparatus comprising chamber partitioned into reaction and transfer sections
JP2003332402A (ja) * 2002-05-10 2003-11-21 Kondo Kogyo Kk ミニエンバライメント方式の半導体製造装置
DE10238165B3 (de) * 2002-08-15 2004-03-25 Hans-Heinz Helge Langgestrecktes Rolladenprofil aus Kunststoff oder Metall für Schwimmbadabdeckungen
FR2844258B1 (fr) * 2002-09-06 2005-06-03 Recif Sa Systeme de transport et stockage de conteneurs de plaques de semi-conducteur, et mecanisme de transfert
US20040069409A1 (en) * 2002-10-11 2004-04-15 Hippo Wu Front opening unified pod door opener with dust-proof device
US20040101385A1 (en) * 2002-11-25 2004-05-27 Ta-Kuang Chang Semiconductor process apparatus and SMIF pod used therein
JP3759492B2 (ja) 2002-12-03 2006-03-22 近藤工業株式会社 ミニエンバライメント方式の半導体製造装置
SG115631A1 (en) 2003-03-11 2005-10-28 Asml Netherlands Bv Lithographic projection assembly, load lock and method for transferring objects
SG115629A1 (en) 2003-03-11 2005-10-28 Asml Netherlands Bv Method and apparatus for maintaining a machine part
WO2005038887A1 (ja) * 2003-10-21 2005-04-28 Nikon Corporation 環境制御装置、デバイス製造装置、デバイス製造方法、露光装置
DE602004028165D1 (de) * 2003-12-22 2010-08-26 Applied Materials Gmbh & Co Kg Beschichtungsanlage mit eingangsschleuse sowie vorrichtung dafür
US7409263B2 (en) * 2004-07-14 2008-08-05 Applied Materials, Inc. Methods and apparatus for repositioning support for a substrate carrier
US7720558B2 (en) 2004-09-04 2010-05-18 Applied Materials, Inc. Methods and apparatus for mapping carrier contents
US7467916B2 (en) * 2005-03-08 2008-12-23 Asm Japan K.K. Semiconductor-manufacturing apparatus equipped with cooling stage and semiconductor-manufacturing method using same
JP5030410B2 (ja) * 2005-09-28 2012-09-19 株式会社日立ハイテクノロジーズ 真空処理装置
US8794896B2 (en) * 2005-12-14 2014-08-05 Tokyo Electron Limited Vacuum processing apparatus and zonal airflow generating unit
DE202006007937U1 (de) * 2006-05-18 2007-09-20 Strämke, Siegfried, Dr.-Ing. Plasmabehandlungsanlage
US8186927B2 (en) * 2008-05-27 2012-05-29 Tdk Corporation Contained object transfer system
DE102008062080A1 (de) * 2008-12-12 2010-06-17 Karlsruher Institut für Technologie Vorrichtung zum Transport atmosphärenempfindlicher Proben und Verwendung derselben
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WO2010137556A1 (ja) * 2009-05-27 2010-12-02 ローツェ株式会社 雰囲気置換装置
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US20150039859A1 (en) 2011-11-22 2015-02-05 Soft Machines, Inc. Microprocessor accelerated code optimizer
US10332769B2 (en) * 2016-01-15 2019-06-25 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor processing station, semiconductor process and method of operating semiconductor processing station
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US10510573B2 (en) * 2017-11-14 2019-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Loading apparatus and operating method thereof
US11195689B2 (en) * 2019-08-03 2021-12-07 ZoNexus LLC Sample holder for electron microscopy
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU707884B2 (en) * 1997-10-07 1999-07-22 Innotech Corporation Conveying apparatus

Also Published As

Publication number Publication date
EP0886618A1 (en) 1998-12-30
KR100499324B1 (ko) 2006-11-30
TW315488B (cg-RX-API-DMAC10.html) 1997-09-11
US5752796A (en) 1998-05-19
JP4093376B2 (ja) 2008-06-04
EP0886618A4 (en) 2005-09-07
WO1997027133A1 (en) 1997-07-31
KR19990082011A (ko) 1999-11-15
JP2000505240A (ja) 2000-04-25

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